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Author: John H. Lau
Publisher: McGraw Hill Professional
ISBN: 0071500472
Category : Technology & Engineering
Languages : en
Pages : 595
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Book Description
State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.
Author: John H. Lau
Publisher: McGraw Hill Professional
ISBN: 0071500472
Category : Technology & Engineering
Languages : en
Pages : 595
Get Book Here
Book Description
State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.
Author: James E. Morris
Publisher: Springer
ISBN: 3319903624
Category : Technology & Engineering
Languages : en
Pages : 1007
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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: Hanqiao Zhang
Publisher: Elsevier
ISBN: 012418667X
Category : Technology & Engineering
Languages : en
Pages : 268
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Book Description
High Speed Digital Design discusses the major factors to consider in designing a high speed digital system and how design concepts affect the functionality of the system as a whole. It will help you understand why signals act so differently on a high speed digital system, identify the various problems that may occur in the design, and research solutions to minimize their impact and address their root causes. The authors offer a strong foundation that will help you get high speed digital system designs right the first time. Taking a systems design approach, High Speed Digital Design offers a progression from fundamental to advanced concepts, starting with transmission line theory, covering core concepts as well as recent developments. It then covers the challenges of signal and power integrity, offers guidelines for channel modeling, and optimizing link circuits. Tying together concepts presented throughout the book, the authors present Intel processors and chipsets as real-world design examples. - Provides knowledge and guidance in the design of high speed digital circuits - Explores the latest developments in system design - Covers everything that encompasses a successful printed circuit board (PCB) product - Offers insight from Intel insiders about real-world high speed digital design
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119793890
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author: Istvan Nagy
Publisher: CRC Press
ISBN: 1040011799
Category : Computers
Languages : en
Pages : 618
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Book Description
This book is about how to design the most complex types of digital circuit boards used inside servers, routers and other equipment, from high-level system architecture down to the low-level signal integrity concepts. It explains common structures and subsystems that can be expanded into new designs in different markets. The book is targeted at all levels of hardware engineers. There are shorter, lower-level introductions to every topic, while the book also takes the reader all they way to the most complex and most advanced topics of digital circuit design, layout design, analysis, and hardware architecture.
Author: Lubomyr Taras Romankiw
Publisher: The Electrochemical Society
ISBN: 9781566772570
Category : Science
Languages : en
Pages : 452
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Book Description
The symposium was jointly held by the US and Japanese societies, but drew participants from companies, universities, and research institutes in 12 countries. The 47 papers cover high density packaging and related technologies, electronic devices and related materials and processes, micro-electromechanical systems and microfabrication, magnetic materials and devices, and fundamental studies on the materials for electrochemical technology applications. Nearly half of them, 23, were invited. Annotation copyrighted by Book News Inc., Portland, OR.
Author: P. L. Silveston
Publisher: Butterworth-Heinemann
ISBN: 0123918669
Category : Science
Languages : en
Pages : 793
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Book Description
This comprehensive review, prepared by 24 experts, many of whom are pioneers of the subject, brings together in one place over 40 years of research in this unique publication. This book will assist R & D specialists, research chemists, chemical engineers or process managers harnessing periodic operations to improve their process plant performance. Periodic Operation of Reactors covers process fundamentals, research equipment and methods and provides "the state of the art" for the periodic operation of many industrially important catalytic reactions. Emphasis is on experimental results, modeling and simulation. Combined reaction and separation are dealt with, including simulated moving bed chromatographic, pressure and temperature swing and circulating bed reactors. Thus, Periodic Operation of Reactors offers readers a single comprehensive source for the broad and diverse new subject. This exciting new publication is a "must have" for any professional working in chemical process research and development. - A comprehensive reference on the fundamentals, development and applications of periodic operation - Contributors and editors include the pioneers of the subject as well as the leading researchers in the field - Covers both fundamentals and the state of the art for each operation scenario, and brings all types of periodic operation together in a single volume - Discussion is focused on experimental results rather than theoretical ones; provides a rich source of experimental data, plus process models - Accompanying website with modelling data
Author: John O. Dukovic
Publisher: The Electrochemical Society
ISBN: 1566775868
Category : Science
Languages : en
Pages : 288
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Book Description
The papers in this issue describe the latest advances in fundamental and practical aspects of electrochemical processes for fabrication of microelectronic devices and related structures. Topics range from plating to etching, chips to packages, mechanisms to models, through-silicon vias to nanotubes, tin to ruthenium, capping to cooling, porous gold to porous alumina, probe-card springs to solder balls, electroless deposition to CMP, TFT-LCDs to magnetic nanowires and beyond.
Author: J. T. Black
Publisher: John Wiley & Sons
ISBN: 0470924675
Category : Political Science
Languages : en
Pages : 1298
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Book Description
Now in its eleventh edition, DeGarmo's Materials and Processes in Manufacturing has been a market-leading text on manufacturing and manufacturing processes courses for more than fifty years. Authors J T. Black and Ron Kohser have continued this book's long and distinguished tradition of exceedingly clear presentation and highly practical approach to materials and processes, presenting mathematical models and analytical equations only when they enhance the basic understanding of the material. Completely revised and updated to reflect all current practices, standards, and materials, the eleventh edition has new coverage of additive manufacturing, lean engineering, and processes related to ceramics, polymers, and plastics.
Author: Richard K. Ulrich
Publisher: John Wiley & Sons
ISBN: 0471466093
Category : Technology & Engineering
Languages : en
Pages : 852
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Book Description
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
