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Author: Y N Zhou
Publisher: Elsevier
ISBN: 184569404X
Category : Technology & Engineering
Languages : en
Pages : 835
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Book Description
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Author: Y N Zhou
Publisher: Elsevier
ISBN: 184569404X
Category : Technology & Engineering
Languages : en
Pages : 835
Get Book Here
Book Description
Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products.Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells.This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. - Reviews the basics of nanojoining including solid-state bonding and fusion microwelding - Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling - Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells
Author: Gavin Walker
Publisher: Elsevier
ISBN: 1845694945
Category : Technology & Engineering
Languages : en
Pages : 599
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Book Description
Hydrogen fuel cells are emerging as a major alternative energy source in transportation and other applications. Central to the development of the hydrogen economy is safe, efficient and viable storage of hydrogen. Solid-state hydrogen storage: Materials and chemistry reviews the latest developments in solid-state hydrogen storage.Part one discusses hydrogen storage technologies, hydrogen futures, hydrogen containment materials and solid-state hydrogen storage system design. Part two reviews the analysis of hydrogen interactions including structural characterisation of hydride materials, neutron scattering techniques, reliably measuring hydrogen uptake in storage materials and modelling of carbon-based materials for hydrogen storage. Part three analyses physically-bound hydrogen storage with chapters on zeolites, carbon nanostructures and metal-organic framework materials. Part four examines chemically-bound hydrogen storage including intermetallics, magnesium hydride, alanates, borohydrides, imides and amides, multicomponent hydrogen storage systems, organic liquid carriers, indirect hydrogen storage in metal ammines and technological challenges in hydrogen storage.With its distinguished editor and international team of contributors, Solid-state hydrogen storage: Materials and chemistry is a standard reference for researchers and professionals in the field of renewable energy, hydrogen fuel cells and hydrogen storage. - Assesses hydrogen fuel cells as a major alternative energy source - Discusses hydrogen storage technologies and solid-state hydrogen storage system design - Explores the analysis of hydrogen interactions including reliably measuring hydrogen uptake in storage materials
Author: Kenji Uchino
Publisher: Elsevier
ISBN: 1845699750
Category : Technology & Engineering
Languages : en
Pages : 697
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Book Description
Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications.After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress.With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. - Provides a comprehensive review of the new materials, their properties and methods of manufacture and application - Explores the development of piezoelectric materials from the historical background to the present status - Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations
Author: Pawan Kumar Rakesh
Publisher: CRC Press
ISBN: 1000994295
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
Innovative Development in Micromanufacturing Processes details cutting edge technologies in micromanufacturing processes, an industry which has undergone a technological transformation in the past decade. Enabling engineers to create high performance, low cost, and long-lasting products, this book is an essential companion to all those working in micro and nano engineering. As products continue to get smaller and smaller, the field of micromanufacturing has gained an international audience. This book looks at both approaches of micromanufacturing: top-down and bottom-up. The top-down approach includes subtractive micromanufacturing processes such as microturning, micromilling, microdrilling, laser beam micromachining, and magnetic abrasive finishing. The bottom-up approach involves additive manufacturing processes such as micro-forming, micro deep drawing, microforging, microextrusion, and microwelding. Additionally, microjoining and microhybrid manufacturing processes are discussed in detail. The book also aids engineers and students in solving common manufacturing issues such as choice of materials and testing. The book will be of interest to those working in micro and nano engineering and machining, as well as students in manufacturing engineering, materials science, and more.
Author: Pawan Kumar Rakesh
Publisher: Woodhead Publishing
ISBN: 0323860206
Category : Technology & Engineering
Languages : en
Pages : 694
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Book Description
Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product. - Provides valuable information on innovative joining technologies including induction heating of metals, ultrasonic heating, and laser heating at micro- and nanoscale levels - Describes the newly developed modelling, simulation and digitalization of the joining process - Includes a methodology for characterization of joints
Author: Ravi Kant Mittal
Publisher: Elsevier
ISBN: 0323918352
Category : Technology & Engineering
Languages : en
Pages : 522
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Book Description
This edited book is a compilation of scholarly articles on the latest developments in the field of additive manufacturing, discussing nature-inspired and artificial intelligence–aided additive manufactured processes for different materials including biomanufacturing, and their applications, as well as various methods to enhance the characteristics of the materials produced, the efficiency of the manufacturing process itself, as well as optimal ways to develop a product in minimum time. The book explores the advancements in additive manufacturing from prefabrication stage to final product, with real-time defect detection, control, and process efficiency improvement covered. This book will be a great resource for engineers, researchers, and academics involved in this revolutionary and unique field of manufacturing. - Discusses modeling of additive manufacturing processes by artificial intelligence - Looks at the optimization of designs, technologies, and material fabrication and the use of simulation in additive manufacturing - Includes case studies and real-world industrial problems and solutions
Author: M O Alam
Publisher: Elsevier
ISBN: 0857092898
Category : Technology & Engineering
Languages : en
Pages : 279
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Book Description
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties.The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics.With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. - Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications - Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems - Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques
Author: C.P. Wong
Publisher: Springer Science & Business Media
ISBN: 1441900403
Category : Technology & Engineering
Languages : en
Pages : 761
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Book Description
Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.
Author: C. P.(Ching-Ping) Wong
Publisher: Springer Nature
ISBN: 303049991X
Category : Technology & Engineering
Languages : en
Pages : 582
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Book Description
This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.
Author:
Publisher: World Scientific
ISBN: 9811209642
Category : Technology & Engineering
Languages : en
Pages : 1079
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Book Description
Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.
