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Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 16
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Book Description
Knowledge of ice conditions on important aircraft lift and control surfaces is critical for safe operation. These conditions can be determined with conventional ice detection sensors, but these sensors are often expensive, require elaborate installation procedures, and interrupt the airflow. A micromachined, silicon based, flush mounted sensor which generates no internal heat has been designed, batch fabricated, packaged, and tested. The sensor is capable of distinguishing between an ice covered and a clean surface. It employs a bulk micromachined wafer with a 7 micrometers thick, boron doped, silicon diaphragm which serves as one plate of a parallel plate capacitor. This is bonded to a second silicon wafer which contains the fixed electrodes; one to drive the diaphragm by application of a voltage, the other to measure the deflection by a change in capacitance. The diaphragm sizes ranged from 1x1mm to 3x3mm, and the gap between parallel plate capacitors is 2 micrometers. A 200V d.c. was applied to the driving electrode which caused the capacitance to increase approximately 0.6pf from a nominal capacitance of 0.6pf when the surface was ice free. After the sensor was cooled below the freezing point of water, the same voltage range was applied to the drive electrode. The capacitance increased by the same amount. Then a drop of water was placed over the diaphragm and allowed to freeze. This created an approximately 2mm thick ice layer. The applied 200V d.c. produced no change in capacitance, confirming that the diaphragm was locked to the ice layer. Since the sensor uses capacitive actuation, it uses very little power and is an ideal candidate for inclusion in a wireless sensing system.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 16
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Book Description
Knowledge of ice conditions on important aircraft lift and control surfaces is critical for safe operation. These conditions can be determined with conventional ice detection sensors, but these sensors are often expensive, require elaborate installation procedures, and interrupt the airflow. A micromachined, silicon based, flush mounted sensor which generates no internal heat has been designed, batch fabricated, packaged, and tested. The sensor is capable of distinguishing between an ice covered and a clean surface. It employs a bulk micromachined wafer with a 7 micrometers thick, boron doped, silicon diaphragm which serves as one plate of a parallel plate capacitor. This is bonded to a second silicon wafer which contains the fixed electrodes; one to drive the diaphragm by application of a voltage, the other to measure the deflection by a change in capacitance. The diaphragm sizes ranged from 1x1mm to 3x3mm, and the gap between parallel plate capacitors is 2 micrometers. A 200V d.c. was applied to the driving electrode which caused the capacitance to increase approximately 0.6pf from a nominal capacitance of 0.6pf when the surface was ice free. After the sensor was cooled below the freezing point of water, the same voltage range was applied to the drive electrode. The capacitance increased by the same amount. Then a drop of water was placed over the diaphragm and allowed to freeze. This created an approximately 2mm thick ice layer. The applied 200V d.c. produced no change in capacitance, confirming that the diaphragm was locked to the ice layer. Since the sensor uses capacitive actuation, it uses very little power and is an ideal candidate for inclusion in a wireless sensing system.
Author: Henry Helvajian
Publisher: AIAA
ISBN: 9781884989032
Category : Technology & Engineering
Languages : en
Pages : 748
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Book Description
Microengineering Aerospace Systems is a textbook tutorial encompassing MEMS (micro-electromechanical systems), nanoelectronics, packaging, processing, and materials characterization for developing miniaturized smart instruments for aerospace systems (i.e., ASIM application-specific integrated microinstrument), satellites, and satellite subsystems. Third in a series of Aerospace Press publications covering this rapidly advancing technology, this work presents fundamental aspects of the technology and specific aerospace systems applications through worked examples.
Author:
Publisher:
ISBN:
Category : Technology
Languages : en
Pages : 660
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Book Description
Author: P. Rai-Choudhury
Publisher: SPIE Press
ISBN: 9780819423795
Category : Technology & Engineering
Languages : en
Pages : 706
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Book Description
Focusing on the use of microlithography techniques in microelectronics manufacturing, this volume is one of a series addressing a rapidly growing field affecting the integrated circuit industry. New applications in such areas as sensors, actuators and biomedical devices, are described.
Author:
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN:
Category : Science
Languages : en
Pages : 702
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Book Description
Author: Marc J. Madou
Publisher: CRC Press
ISBN: 1482274000
Category : Technology & Engineering
Languages : en
Pages : 764
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Book Description
MEMS technology and applications have grown at a tremendous pace, while structural dimensions have grown smaller and smaller, reaching down even to the molecular level. With this movement have come new types of applications and rapid advances in the technologies and techniques needed to fabricate the increasingly miniature devices that are literally changing our world. A bestseller in its first edition, Fundamentals of Microfabrication, Second Edition reflects the many developments in methods, materials, and applications that have emerged recently. Renowned author Marc Madou has added exercise sets to each chapter, thus answering the need for a textbook in this field. Fundamentals of Microfabrication, Second Edition offers unique, in-depth coverage of the science of miniaturization, its methods, and materials. From the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering, it provides the background, tools, and directions you need to confidently choose fabrication methods and materials for a particular miniaturization problem. New in the Second Edition Revised chapters that reflect the many recent advances in the field Updated and enhanced discussions of topics including DNA arrays, microfluidics, micromolding techniques, and nanotechnology In-depth coverage of bio-MEMs, RF-MEMs, high-temperature, and optical MEMs. Many more links to the Web Problem sets in each chapter
Author: Marc J. Madou
Publisher: CRC Press
ISBN: 1482274663
Category : Technology & Engineering
Languages : en
Pages : 1983
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Book Description
Now in its third edition, Fundamentals of Microfabrication and Nanotechnology continues to provide the most complete MEMS coverage available. Thoroughly revised and updated the new edition of this perennial bestseller has been expanded to three volumes, reflecting the substantial growth of this field. It includes a wealth of theoretical and practical information on nanotechnology and NEMS and offers background and comprehensive information on materials, processes, and manufacturing options. The first volume offers a rigorous theoretical treatment of micro- and nanosciences, and includes sections on solid-state physics, quantum mechanics, crystallography, and fluidics. The second volume presents a very large set of manufacturing techniques for micro- and nanofabrication and covers different forms of lithography, material removal processes, and additive technologies. The third volume focuses on manufacturing techniques and applications of Bio-MEMS and Bio-NEMS. Illustrated in color throughout, this seminal work is a cogent instructional text, providing classroom and self-learners with worked-out examples and end-of-chapter problems. The author characterizes and defines major research areas and illustrates them with examples pulled from the most recent literature and from his own work.
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 404
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Book Description
Author: Marc J. Madou
Publisher: CRC Press
ISBN: 1420055194
Category : Technology & Engineering
Languages : en
Pages : 672
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Book Description
Designed for science and engineering students, this text focuses on emerging trends in processes for fabricating MEMS and NEMS devices. The book reviews different forms of lithography, subtractive material removal processes, and additive technologies. Both top-down and bottom-up fabrication processes are exhaustively covered and the merits of the different approaches are compared. Students can use this color volume as a guide to help establish the appropriate fabrication technique for any type of micro- or nano-machine.
Author: Sang-Joon John Lee
Publisher: Artech House
ISBN: 1596934727
Category : Electronic books
Languages : en
Pages : 276
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Book Description
Providing a definitive source of knowledge about the principles, materials, and process techniques used in the fabrication of microfluidics, this practical volume is a must for your reference shelf. The book focuses on fabrication, but also covers the basic purpose, benefits, and limitations of the fabricated structures as they are applied to microfluidic sensor and actuator functions. You find guidance on rapidly assessing options and tradeoffs for the selection of a fabrication method with clear tabulated process comparisons.
