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Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 178
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Book Description
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 178
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Book Description
Author: Eugene Machlin
Publisher: Elsevier
ISBN: 0080460402
Category : Technology & Engineering
Languages : en
Pages : 268
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Book Description
The subject matter of thin-films – which play a key role in microelectronics – divides naturally into two headings: the processing / structure relationship, and the structure / properties relationship. Part II of 'Materials Science in Microelectronics' focuses on the latter of these relationships, examining the effect of structure on the following: •Electrical properties•Magnetic properties•Optical properties•Mechanical properties•Mass transport properties•Interface and junction properties•Defects and properties - Captures the importance of thin films to microelectronic development - Examines the cause / effect relationship of structure on thin film properties
Author: Rao Tummala
Publisher: Springer Science & Business Media
ISBN: 9780412084515
Category : Computers
Languages : en
Pages : 662
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Book Description
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Author: C. V. Thompson
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 352
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: D. Widmann
Publisher: Springer Science & Business Media
ISBN: 366204160X
Category : Technology & Engineering
Languages : en
Pages : 355
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Book Description
This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.
Author: Richard C. Jaeger
Publisher: McGraw-Hill Science, Engineering & Mathematics
ISBN: 9780073309484
Category : Digital electronics
Languages : en
Pages : 0
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Book Description
Microelectronic Circuit Designis known for being a technically excellent text. The new edition has been revised to make the material more motivating and accessible to students while retaining a student-friendly approach.Jaeger has added more pedagogy and an emphaisis on design through the use of design examples and design notes. Some pedagogical elements include chapter opening vignettes, chapter objectives, "Electronics in Action" boxes, a problem solving methodology, and "design note" boxes. The number of examples, including new design examples, has been increased, giving students more opportunity to see problems worked out. Additionally,some of the less fundamental mathematical material has been moved to the ARIS website. In addition this edition comes with aHomework Management System called ARIS, which includes 450 static problems.
Author:
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1152
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Book Description
Author:
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1094
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Book Description
Author: Philip Hoff
Publisher: Cambridge University Press
ISBN: 9780521588171
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
This book explains the operating principles of 'real world' electronic devices.
Author: Franco Maloberti
Publisher: John Wiley & Sons
ISBN: 1119978343
Category : Technology & Engineering
Languages : en
Pages : 694
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Book Description
The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today’s students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions, signals and their properties. Here he presents a helpful balance of theory, examples, and verification of results, while keeping mathematics and signal processing theory to a minimum. Key features: Presents a new learning approach that will greatly improve students’ ability to retain key concepts in electronics studies Match the evolution of Computer Aided Design (CAD) which focuses increasingly on high-level design Covers sub-functions as well as basic circuits and basic components Provides real-world examples to inspire a thorough understanding of global issues, before going into the detail of components and devices Discusses power conversion and management; an important area that is missing in other books on the subject End-of-chapter problems and self-training sections support the reader in exploring systems and understanding them at increasing levels of complexity Inside this book you will find a complete explanation of electronics that can be applied across a range of disciplines including electrical engineering and physics. This comprehensive introduction will be of benefit to students studying electronics, as well as their lecturers and professors. Postgraduate engineers, those in vocational training, and design and application engineers will also find this book useful.
