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Author: Peter W. Hawkes
Publisher:
ISBN: 9780120147250
Category : Electronic books
Languages : en
Pages : 282
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Book Description
Author: Peter W. Hawkes
Publisher:
ISBN: 9780120147250
Category : Electronic books
Languages : en
Pages : 282
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Book Description
Author: Umberto Celano
Publisher: Springer
ISBN: 3030156125
Category : Science
Languages : en
Pages : 408
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Book Description
The tremendous impact of electronic devices on our lives is the result of continuous improvements of the billions of nanoelectronic components inside integrated circuits (ICs). However, ultra-scaled semiconductor devices require nanometer control of the many parameters essential for their fabrication. Through the years, this created a strong alliance between microscopy techniques and IC manufacturing. This book reviews the latest progress in IC devices, with emphasis on the impact of electrical atomic force microscopy (AFM) techniques for their development. The operation principles of many techniques are introduced, and the associated metrology challenges described. Blending the expertise of industrial specialists and academic researchers, the chapters are dedicated to various AFM methods and their impact on the development of emerging nanoelectronic devices. The goal is to introduce the major electrical AFM methods, following the journey that has seen our lives changed by the advent of ubiquitous nanoelectronics devices, and has extended our capability to sense matter on a scale previously inaccessible.
Author: Alain Claverie
Publisher: John Wiley & Sons
ISBN: 1118579054
Category : Technology & Engineering
Languages : en
Pages : 280
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Book Description
Today, the availability of bright and highly coherent electron sources and sensitive detectors has radically changed the type and quality of the information which can be obtained by transmission electron microscopy (TEM). TEMs are now present in large numbers not only in academia, but also in industrial research centers and fabs. This book presents in a simple and practical way the new quantitative techniques based on TEM which have recently been invented or developed to address most of the main challenging issues scientists and process engineers have to face to develop or optimize semiconductor layers and devices. Several of these techniques are based on electron holography; others take advantage of the possibility of focusing intense beams within nanoprobes. Strain measurements and mappings, dopant activation and segregation, interfacial reactions at the nanoscale, defect identification and specimen preparation by FIB are among the topics presented in this book. After a brief presentation of the underlying theory, each technique is illustrated through examples from the lab or fab.
Author: Chih-Hang Tung
Publisher: John Wiley & Sons
ISBN: 9780471457725
Category : Technology & Engineering
Languages : en
Pages : 688
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Book Description
More than 1,100 TEM images illustrate the science of ULSI The natural outgrowth of VLSI (Very Large Scale Integration), Ultra Large Scale Integration (ULSI) refers to semiconductor chips with more than 10 million devices per chip. Written by three renowned pioneers in their field, ULSI Semiconductor Technology Atlas uses examples and TEM (Transmission Electron Microscopy) micrographs to explain and illustrate ULSI process technologies and their associated problems. The first book available on the subject to be illustrated using TEM images, ULSI Semiconductor Technology Atlas is logically divided into four parts: * Part I includes basic introductions to the ULSI process, device construction analysis, and TEM sample preparation * Part II focuses on key ULSI modules--ion implantation and defects, dielectrics and isolation structures, silicides/salicides, and metallization * Part III examines integrated devices, including complete planar DRAM, stacked cell DRAM, and trench cell DRAM, as well as SRAM as examples for process integration and development * Part IV emphasizes special applications, including TEM in advanced failure analysis, TEM in advanced packaging development and UBM (Under Bump Metallization) studies, and high-resolution TEM in microelectronics This innovative guide also provides engineers and managers in the microelectronics industry, as well as graduate students, with: * More than 1,100 TEM images to illustrate the science of ULSI * A historical introduction to the technology as well as coverage of the evolution of basic ULSI process problems and issues * Discussion of TEM in other advanced microelectronics devices and materials, such as flash memories, SOI, SiGe devices, MEMS, and CD-ROMs
Author: EDFAS Desk Reference Committee
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
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Book Description
Includes bibliographical references and index.
Author: Tejinder Gandhi
Publisher: ASM International
ISBN: 1627082468
Category : Technology & Engineering
Languages : en
Pages : 750
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Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author: Peter W. Hawkes
Publisher: Academic Press
ISBN: 0323989209
Category : Technology & Engineering
Languages : en
Pages : 546
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Book Description
The Beginnings of Electron Microscopy - Part 2, Volume 221 in the Advances in Imaging and Electron Physics series, highlights new advances in the field, with this new volume presenting interesting chapters on Recollections from the Early Years: Canada-USA, My Recollection of the Early History of Our Work on Electron Optics and the Electron Microscope, Walter Hoppe (1917–1986), Reminiscences of the Development of Electron Optics and Electron Microscope Instrumentation in Japan, Early Electron Microscopy in The Netherlands, L. L. Marton, 1901-1979, The Invention of the Electron Fresnel Interference Biprism, The Development of the Scanning Electron Microscope, and much more. Provides the authority and expertise of leading contributors from an international board of authors Presents the latest release in Advances in Imaging and Electron Physics series
Author: John R. Devaney
Publisher:
ISBN:
Category : Miniature electronic equipment
Languages : en
Pages : 60
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Book Description
Author:
Publisher: Academic Press
ISBN: 9780080577623
Category : Science
Languages : en
Pages : 885
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Book Description
As a complement to The Beginnings of Electron Microscopy, Advances in Imaging and Electron Physics is pleased to present Volume 96, The Growth of Electron Microscopy. This comprehensive collection of articles surveys the accomplishments of various national groups that comprise the International Federation of Societies of Electron Microscopy (IFSEM).
Author: Peter W. Hawkes
Publisher: Elsevier
ISBN: 9780080525457
Category : Technology & Engineering
Languages : en
Pages : 369
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Book Description
Advances in Imaging and Electron Physics merges two long-running serials-Advances in Electronics and Electron Physics and Advances in Optical and Electron Microscopy. This series features extended articles on the physics of electron devices (especially semiconductor devices), particle optics at high and low energies, microlithography, image science and digital image processing, electromagnetic wave propagation, electron microscopy, and the computing methods used in all these domains.
