Microcircuit Engineering 82 PDF Download
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Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 379
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Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 379
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Book Description
Author: Colloque International sur la Microlithographie
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 379
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Book Description
Author: Ivor Brodie
Publisher: Springer Science & Business Media
ISBN: 1475767757
Category : Science
Languages : en
Pages : 661
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Book Description
In this revised and expanded edition, the authors provide a comprehensive overview of the tools, technologies, and physical models needed to understand, build, and analyze microdevices. Students, specialists within the field, and researchers in related fields will appreciate their unified presentation and extensive references.
Author:
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 216
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Book Description
Author: J. David Irwin
Publisher: Wiley
ISBN: 9780470083093
Category : Technology & Engineering
Languages : en
Pages : 816
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Book Description
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 332
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Book Description
Author:
Publisher:
ISBN:
Category : Trademarks
Languages : en
Pages : 960
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Book Description
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 1162
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Book Description
Author:
Publisher:
ISBN:
Category : Electronic circuits
Languages : en
Pages : 410
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Book Description
Author: Kamil A. Valiev
Publisher: Springer Science & Business Media
ISBN: 146153318X
Category : Science
Languages : en
Pages : 502
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Book Description
This book is devoted to the physics of electron-beam, ion-beam, optical, and x-ray lithography. The need for this book results from the following considerations. The astonishing achievements in microelectronics are in large part connected with successfully applying the relatively new technology of processing (changing the prop erties of) a material into a device whose component dimensions are submicron, called photolithography. In this method the device is imaged as a pattern on a metal film that has been deposited onto a transparent substrate and by means of a broad stream of light is transferred to a semiconductor wafer within which the physical structure of the devices and the integrated circuit connections are formed layer by layer. The smallest dimensions of the device components are limited by the diffraction of the light when the pattern is transferred and are approximately the same as the wavelength of the light. Photolithography by light having a wavelength of A ~ 0.4 flm has made it possible to serially produce integrated circuits having devices whose minimal size is 2-3 flm in the 4 pattern and having 10-105 transistors per circuit.
