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Author: Peter Van Zant
Publisher: McGraw Hill Professional
ISBN: 0071821023
Category : Technology & Engineering
Languages : en
Pages : 577
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Book Description
The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
Author: Peter Van Zant
Publisher: McGraw Hill Professional
ISBN: 0071821023
Category : Technology & Engineering
Languages : en
Pages : 577
Get Book Here
Book Description
The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
Author: Peter Van Zant
Publisher: McGraw-Hill Education
ISBN: 9780071821018
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process--surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
Author: Peter Van Zant
Publisher: McGraw Hill Professional
ISBN: 0071501398
Category : Technology & Engineering
Languages : en
Pages : 658
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Book Description
The #1 book in the industry for more than 15 years! Utilizing a straightforward, math-free pathology, this is a novice-friendly guide to the semiconductor fabrication process from raw materials through shipping the finished, packaged device. Challenging quizzes and review summaries make this the perfect learning guide for technicians in training. * NEW chapter on nanotechnology * NEW sections on 300mm wafer processing * Processes and devices, and Green processing * Every chapter updated to reflect the latest processing techniques
Author: Peter Van Zant
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 656
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Book Description
s an easy-to-follow introduction to semiconductor fabrication that proceeds from basic materials and process chemicals to chip packaging procedures. New methods and data related to packaging, memory circuits, and semiconductor devices are key updates in this new edition.
Author: Peter Van Zant
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 322
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Book Description
Author: Peter Van Zant
Publisher:
ISBN: 9780961388003
Category : Technology & Engineering
Languages : ja
Pages : 278
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Book Description
Novice-friendly intro to semiconductor processing.The most readable and comprehensive guide to semiconductorprocessing, Peter Van Zant's Microchip Fabrication is considered the bible of basic microchip technology. Now in an updated new fourth edition, this completely math-free introduction to a complex field is an efficient tool for high-powered engineers and technology-clueless salespeople alike. You'll find fully illuminating, easy-reading explanations of semiconductor materials and process chemicals...contamination control...process yields...all aspects of basic patterning....doping,deposition, and metallization...wafer, device, and circuit evaluation...semiconductor devices and integrated circuit formation and types...and packaging. This new fourth edition puts at your fingertips new sections on: *Copper metallization and damascene patterning *BGA and CSP* Cutting-edge cleaning techniques *And more!
Author: Gary S. May
Publisher: John Wiley & Sons
ISBN: 0471790273
Category : Technology & Engineering
Languages : en
Pages : 428
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Book Description
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
Author: Bo Lojek
Publisher: Springer Science & Business Media
ISBN: 3540342583
Category : Science
Languages : en
Pages : 394
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Book Description
This book provides a unique account of the history of integrated circuit, the microelectronics industry and the people involved in the development of transistor and integrated circuit. In this richly illustrated account the author argues that the group of inventors was much larger than originally thought. This is a personal recollection providing the first comprehensive behind-the-scenes account of the history of the integrated circuit.
Author: Kazuo Nojiri
Publisher: Springer
ISBN: 3319102958
Category : Technology & Engineering
Languages : en
Pages : 126
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Book Description
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Author: Ming-Bo Lin
Publisher: CRC Press
ISBN: 1439897328
Category : Technology & Engineering
Languages : en
Pages : 890
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Book Description
With the advance of semiconductors and ubiquitous computing, the use of system-on-a-chip (SoC) has become an essential technique to reduce product cost. With this progress and continuous reduction of feature sizes, and the development of very large-scale integration (VLSI) circuits, addressing the harder problems requires fundamental understanding
