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Author: Bartlomiej F. Romanowicz
Publisher: Springer Science & Business Media
ISBN: 146155621X
Category : Technology & Engineering
Languages : en
Pages : 156
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Book Description
Over the past two decades, technologies for microsystems fabrication have made considerable progress. This has made possible a large variety of new commercial devices ranging, for example, from integrated pressure and acceleration microsensors to active micromirror arrays for image projection. In the near future, there will be a number of new devices, which will be commercialized in many application areas. The field of microsystems is characterized by its wide diversity, which requires a multidisciplinary approach for design and processes as well as in application areas. Although there is a common technological background derived from integrated circuits, it is clear that microsystems will require additional application-specific technologies. Since most microsystem technologies are based on batch processing and dedicated to mass production, prototyping is likely to be an expensive and time-consuming step. It is recognized that standardization of the processes as well as of the design tools will definitely help reduce the entry cost of microsystems. This creates a very challenging situation for the design, modeling and simulation of microsystems. Methodology for the Modeling and Simulation of Microsystems is the first book to give an overview of the problems associated with modeling and simulation of microsystems. It introduces a new methodology, which is supported by several examples. It should provide a useful starting point for both scientists and engineers seeking background information for efficient design of microsystems.
Author: Bartlomiej F. Romanowicz
Publisher: Springer Science & Business Media
ISBN: 146155621X
Category : Technology & Engineering
Languages : en
Pages : 156
Get Book Here
Book Description
Over the past two decades, technologies for microsystems fabrication have made considerable progress. This has made possible a large variety of new commercial devices ranging, for example, from integrated pressure and acceleration microsensors to active micromirror arrays for image projection. In the near future, there will be a number of new devices, which will be commercialized in many application areas. The field of microsystems is characterized by its wide diversity, which requires a multidisciplinary approach for design and processes as well as in application areas. Although there is a common technological background derived from integrated circuits, it is clear that microsystems will require additional application-specific technologies. Since most microsystem technologies are based on batch processing and dedicated to mass production, prototyping is likely to be an expensive and time-consuming step. It is recognized that standardization of the processes as well as of the design tools will definitely help reduce the entry cost of microsystems. This creates a very challenging situation for the design, modeling and simulation of microsystems. Methodology for the Modeling and Simulation of Microsystems is the first book to give an overview of the problems associated with modeling and simulation of microsystems. It introduces a new methodology, which is supported by several examples. It should provide a useful starting point for both scientists and engineers seeking background information for efficient design of microsystems.
Author: Bartlomiej F. Romanowicz
Publisher: Springer Science & Business Media
ISBN: 9780792383062
Category : Technology & Engineering
Languages : en
Pages : 178
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Book Description
Over the past two decades, technologies for microsystems fabrication have made considerable progress. This has made possible a large variety of new commercial devices ranging, for example, from integrated pressure and acceleration microsensors to active micromirror arrays for image projection. In the near future, there will be a number of new devices, which will be commercialized in many application areas. The field of microsystems is characterized by its wide diversity, which requires a multidisciplinary approach for design and processes as well as in application areas. Although there is a common technological background derived from integrated circuits, it is clear that microsystems will require additional application-specific technologies. Since most microsystem technologies are based on batch processing and dedicated to mass production, prototyping is likely to be an expensive and time-consuming step. It is recognized that standardization of the processes as well as of the design tools will definitely help reduce the entry cost of microsystems. This creates a very challenging situation for the design, modeling and simulation of microsystems. Methodology for the Modeling and Simulation of Microsystems is the first book to give an overview of the problems associated with modeling and simulation of microsystems. It introduces a new methodology, which is supported by several examples. It should provide a useful starting point for both scientists and engineers seeking background information for efficient design of microsystems.
Author: Oliver Brand
Publisher: John Wiley & Sons
ISBN: 3527647120
Category : Technology & Engineering
Languages : en
Pages : 562
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Book Description
System-level modeling of MEMS - microelectromechanical systems - comprises integrated approaches to simulate, understand, and optimize the performance of sensors, actuators, and microsystems, taking into account the intricacies of the interplay between mechanical and electrical properties, circuitry, packaging, and design considerations. Thereby, system-level modeling overcomes the limitations inherent to methods that focus only on one of these aspects and do not incorporate their mutual dependencies. The book addresses the two most important approaches of system-level modeling, namely physics-based modeling with lumped elements and mathematical modeling employing model order reduction methods, with an emphasis on combining single device models to entire systems. At a clearly understandable and sufficiently detailed level the readers are made familiar with the physical and mathematical underpinnings of MEMS modeling. This enables them to choose the adequate methods for the respective application needs. This work is an invaluable resource for all materials scientists, electrical engineers, scientists working in the semiconductor and/or sensor industry, physicists, and physical chemists.
Author: Peter Fritzson
Publisher: John Wiley & Sons
ISBN: 1118094247
Category : Technology & Engineering
Languages : en
Pages : 227
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Book Description
Master modeling and simulation using Modelica, the new powerful, highly versatile object-based modeling language Modelica, the new object-based software/hardware modeling language that is quickly gaining popularity around the world, offers an almost universal approach to high-level computational modeling and simulation. It handles a broad range of application domains, for example mechanics, electrical systems, control, and thermodynamics, and facilitates general notation as well as powerful abstractions and efficient implementations. Using the versatile Modelica language and its associated technology, this text presents an object-oriented, component-based approach that makes it possible for readers to quickly master the basics of computer-supported equation-based object-oriented (EOO) mathematical modeling and simulation. Throughout the text, Modelica is used to illustrate the various aspects of modeling and simulation. At the same time, a number of key concepts underlying the Modelica language are explained with the use of modeling and simulation examples. This book: Examines basic concepts such as systems, models, and simulations Guides readers through the Modelica language with the aid of several step-by-step examples Introduces the Modelica class concept and its use in graphical and textual modeling Explores modeling methodology for continuous, discrete, and hybrid systems Presents an overview of the Modelica Standard Library and key Modelica model libraries Readers will find plenty of examples of models that simulate distinct application domains as well as examples that combine several domains. All the examples and exercises in the text are available via DrModelica. This electronic self-teaching program, freely available on the text's companion website, guides readers from simple, introductory examples and exercises to more advanced ones. Written by the Director of the Open Source Modelica Consortium, Introduction to Modeling and Simulation of Technical and Physical Systems with Modelica is recommended for engineers and students interested in computer-aided design, modeling, simulation, and analysis of technical and natural systems. By building on basic concepts, the text is ideal for students who want to learn modeling, simulation, and object orientation.
Author: Tamara Bechtold
Publisher: Springer Science & Business Media
ISBN: 3540346139
Category : Technology & Engineering
Languages : en
Pages : 185
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Book Description
This book provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.
Author: Dirk Jansen
Publisher: Springer Science & Business Media
ISBN: 0387735437
Category : Computers
Languages : en
Pages : 672
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Book Description
When I attended college we studied vacuum tubes in our junior year. At that time an average radio had ?ve vacuum tubes and better ones even seven. Then transistors appeared in 1960s. A good radio was judged to be one with more thententransistors. Latergoodradioshad15–20transistors and after that everyone stopped counting transistors. Today modern processors runing personal computers have over 10milliontransistorsandmoremillionswillbeaddedevery year. The difference between 20 and 20M is in complexity, methodology and business models. Designs with 20 tr- sistors are easily generated by design engineers without any tools, whilst designs with 20M transistors can not be done by humans in reasonable time without the help of Prof. Dr. Gajski demonstrates the Y-chart automation. This difference in complexity introduced a paradigm shift which required sophisticated methods and tools, and introduced design automation into design practice. By the decomposition of the design process into many tasks and abstraction levels the methodology of designing chips or systems has also evolved. Similarly, the business model has changed from vertical integration, in which one company did all the tasks from product speci?cation to manufacturing, to globally distributed, client server production in which most of the design and manufacturing tasks are outsourced.
Author: Yufeng Jin
Publisher: CRC Press
ISBN: 1351832972
Category : Technology & Engineering
Languages : en
Pages : 233
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Book Description
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author: Ephraim Suhir
Publisher: Springer Science & Business Media
ISBN: 0387329897
Category : Technology & Engineering
Languages : en
Pages : 1471
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Book Description
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author: Sarhan M. Musa
Publisher: CRC Press
ISBN: 135183259X
Category : Science
Languages : en
Pages : 647
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Book Description
Computational Finite Element Methods in Nanotechnology demonstrates the capabilities of finite element methods in nanotechnology for a range of fields. Bringing together contributions from researchers around the world, it covers key concepts as well as cutting-edge research and applications to inspire new developments and future interdisciplinary research. In particular, it emphasizes the importance of finite element methods (FEMs) for computational tools in the development of efficient nanoscale systems. The book explores a variety of topics, including: A novel FE-based thermo-electrical-mechanical-coupled model to study mechanical stress, temperature, and electric fields in nano- and microelectronics The integration of distributed element, lumped element, and system-level methods for the design, modeling, and simulation of nano- and micro-electromechanical systems (N/MEMS) Challenges in the simulation of nanorobotic systems and macro-dimensions The simulation of structures and processes such as dislocations, growth of epitaxial films, and precipitation Modeling of self-positioning nanostructures, nanocomposites, and carbon nanotubes and their composites Progress in using FEM to analyze the electric field formed in needleless electrospinning How molecular dynamic (MD) simulations can be integrated into the FEM Applications of finite element analysis in nanomaterials and systems used in medicine, dentistry, biotechnology, and other areas The book includes numerous examples and case studies, as well as recent applications of microscale and nanoscale modeling systems with FEMs using COMSOL Multiphysics® and MATLAB®. A one-stop reference for professionals, researchers, and students, this is also an accessible introduction to computational FEMs in nanotechnology for those new to the field.
Author: Dr. Mohd. Zafar Shaikh
Publisher: Lulu.com
ISBN: 1329413962
Category :
Languages : en
Pages : 110
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Book Description
