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Author: M. Rühle
Publisher: Elsevier
ISBN: 1483287467
Category : Technology & Engineering
Languages : en
Pages : 448
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Book Description
As engineering materials and structures often contain a metal or metallic alloy bonded to a ceramic, the resultant interface must be able to sustain mechanical forces without failure. They also play an important role in oxidation or reduction of materials. The workshop on 'Bonding, Structure and Mechanical Properties of Metal/Ceramic Interfaces' was held in January 1989 within the Acta/Scripta Metallurgica conference series. It drew together an international collection of 70 scientists who discussed a wide range of issues related to metal-ceramic interfaces. The sessions were divided into 7 categories: structure and bonding, chemistry at interfaces, formation of interfaces, structure of interfaces, thermodynamics/atomistics of interface fracture, mechanics of interface cracks, and fracture resistance of bimaterial interfaces. Within these headings attention was paid to grain boundaries, the influence of chemical processes on the behaviour of interfaces, diffusion bonding, characterization of fracture, and crack propagation by fatigue and by stress corrosion. The book presents a useful reference source for materials scientists, physicists, chemists, and mechanical engineers who are concerned with the roles and properties of interfaces.
Author: M. Rühle
Publisher: Elsevier
ISBN: 1483287467
Category : Technology & Engineering
Languages : en
Pages : 448
Get Book Here
Book Description
As engineering materials and structures often contain a metal or metallic alloy bonded to a ceramic, the resultant interface must be able to sustain mechanical forces without failure. They also play an important role in oxidation or reduction of materials. The workshop on 'Bonding, Structure and Mechanical Properties of Metal/Ceramic Interfaces' was held in January 1989 within the Acta/Scripta Metallurgica conference series. It drew together an international collection of 70 scientists who discussed a wide range of issues related to metal-ceramic interfaces. The sessions were divided into 7 categories: structure and bonding, chemistry at interfaces, formation of interfaces, structure of interfaces, thermodynamics/atomistics of interface fracture, mechanics of interface cracks, and fracture resistance of bimaterial interfaces. Within these headings attention was paid to grain boundaries, the influence of chemical processes on the behaviour of interfaces, diffusion bonding, characterization of fracture, and crack propagation by fatigue and by stress corrosion. The book presents a useful reference source for materials scientists, physicists, chemists, and mechanical engineers who are concerned with the roles and properties of interfaces.
Author: Kheng-Lim Goh
Publisher: Woodhead Publishing
ISBN: 0081027311
Category : Technology & Engineering
Languages : en
Pages : 584
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Book Description
Interfaces in Particle and Fibre-Reinforced Composites: From Macro- to Nanoscale addresses recent research findings on the particle-matrix interface at different length scales. The book's main focus is on the reinforcement of materials by particles that can result in a composite material of high stiffness and strength, but it also focuses on how the particle interacts with the (matrix) material, which may be a polymer, biological-based material, ceramic or conventional metal. The different types of particle reinforced composites are discussed, as is load transfer at the particle-matrix interface. Readers will learn how to select materials and about particle structure. Significant progress has been made in applying these approaches, thus making this book a timely piece on recent research findings on the particle-matrix interface at different length scales. - Features wide coverage, from polymer, to ceramics and metal-based particulate composites - Structured in a logical order to cover fundamental studies, computer simulations, experimental techniques and characterization
Author: Manferd Ruhle
Publisher:
ISBN:
Category : Ceramic to metal bonding
Languages : en
Pages : 433
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Book Description
Author: Robert Edward Monroe
Publisher:
ISBN:
Category : Adhesives
Languages : en
Pages : 86
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Book Description
This report supplies information on joining processes applicable to titanium and its alloys in sheet metal applications, primarily related directly to airframe construction. Although the material presented here does not cover all titanium joining processes, and omits such processes as plasma-arc, submerged-arc, electroslag, flash, and high-frequency resistance welding, the data presented cover materials up to 2-inches thick in some cases and the report should be useful to anyone seeking titanium joining information. The joining processes covered fall into five categories: welding, brazing, metallurgical bonding (diffusion and deformation bonding), adhesive bonding, and mechanical fastening. The fusion welding processes that are discussed in detail include gas tungsten arc, gas metal arc, arc spot, and electron beam. The resistance processes give extended coverage are spot, roll spot, and seam welding. (Author).
Author: Subra Suresh
Publisher: Elsevier
ISBN: 0080523714
Category : Technology & Engineering
Languages : en
Pages : 353
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Book Description
`Metal-Matrix Composites' are being used or considered for use in a variety of applications in the automotive, aerospace and sporting goods industries. This book contains sixteen chapters, all written by leading experts in the filed, which focus on the processing, microstructure and characterization, mechanics and micromechanics of deformation, mechanics and micromechanics of damage and fracture, and practical applications of a wide variety of metal composites.A particularly noteworthy feature of this authoritative volume is its collection of state-of-the-art reviews of the relationships among processing, microstructural evolution, micromechanics of deformation and overall mechanical response.
Author: Joseph Pask
Publisher: Springer Science & Business Media
ISBN: 1468439472
Category : Technology & Engineering
Languages : en
Pages : 733
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Book Description
The 17th University Conference on Ceramics, which also was the 7th LBL/MMRD International Materials Symposium, was held on the campus of the University of California at Berkeley from July 28 to August 1, 1980. It was devoted to the subject of surfaces and interfaces in ceramic and ceramic-metal systems. The program was timely and of great interest, as indicated by the large number of contributed papers, which included contributions from ten foreign countries. These proceedings are divided into the following categories dealing with the chemistry and physics of interfaces: calculations of interface/surface states, characterization of surfaces and inter faces, thermodynamics of interfaces, influence of surface and inter faces on selected ceramic processes, grain boundary structures, effects of grain boundaries on deformation and fracture, interfacial phenomena, formation of interfaces, development of adhesion, and reactions at interfaces. A number of papers deal specifically with the Si-Si02 interface, which probably has received more attention than any other because of its importance in the electronics industry. This coverage fulfills the principal objective of the symposium which was to explore and assess the current fundamental understand ing of interfaces and surfaces. A parallel objective of the symposium was fulfilled by a group of papers dealing with the correlation of interfacial characteris tics with mechanical behavior. This group includes papers dealing with the adherence of dissimilar materials at interfaces.
Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461540860
Category : Technology & Engineering
Languages : en
Pages : 742
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Book Description
Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan. Korea. Singapore. Hong Kong. and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors. the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries. displays. magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies. from mainframe and supercomputer applications at any cost. to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example. going from $500IMIP when products were first introduced in 1981, to a projected $lIMIP within 10 years. Thin. light portable. user friendly and very low-cost are. therefore. the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection. powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author: L.C. Dufour
Publisher: Springer Science & Business Media
ISBN: 9400910355
Category : Technology & Engineering
Languages : en
Pages : 820
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Book Description
This book contains the proceedings of the NATO Advanced Study Institute on Surfaces and Interfaces of Ceramic Materials, held on the Oleron island, France, in September 1988. This Institute was organized in nine months after receiving the agreement of the NATO Scientific Affairs Division. Despite this very short time, most of the lecturers contacted have accepted our invitation to prepare a specific talk. The meeting was held at "La Vieille Perrotine" on the Oleron island. This holiday village of the French CNRS is located near the Ocean in a natural area which contributed to create a very pleasant atmosphere favourable to develop interaction between the 91 participants in this Institute. First of all, the Institute was aimed at diffusing the foremost results on the characterization of and the role played by surfaces, grain boundaries and interfaces in preparation and overall properties of ceramic materials, mainly of oxide ceramics. Through its interdisciplinary character, the Institute was also aimed at developing interaction between scientists and engineers interested in basic and practical aspects of processing and use of ceramics.
Author: S.T. Mileiko
Publisher: Elsevier
ISBN: 0080536301
Category : Technology & Engineering
Languages : en
Pages : 705
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Book Description
Modern scientific and technological fields are frequently of an interdisciplinary nature, and the field of fibrous composites is no exception. Unlike fibre-reinforced plastics, the family of metal- and ceramic-based composites is still quite a new group of materials with a large variety of mechanical and physical properties. Up until now it has been difficult to produce these materials as the necessary technical information has not been well documented.The main purpose of this book is to link together fabrication, structure and properties chains, so as to clarify which structure provides the necessary properties, and how one can attain the correct composite structure. To this end, the book not only contains topics of a purely technical nature, but also a description of the failure mechanics of metal- and ceramic-matrix composites, as this is the key to understanding the structure-properties segment of the chain mentioned.The book is divided into three parts. Part I presents a general view of composites with the accent on metal- and ceramic-matrix composites. It also contains a brief description of modern fibres and composites and can be considered, at least for beginners, as a starting point for further study. Part II looks at the composite microstructures considered to be either optimal or reasonable in resisting a particular loading. Finally Part II describes a variety of mechanical, physical, and chemical potential for organizing these microstructures. Experimental data on technologies, material structures, and material properties are used throughout the book to support theoretical conclusions or to obtain important physical parameters.
Author: Kim Ill Yoo
Publisher: CRC Press
ISBN: 1040290922
Category : Technology & Engineering
Languages : en
Pages : 468
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Book Description
The science of ceramic interfaces is multidisciplinary, overlapping several existing, well-established disciplines such as solid-state chemistry, high-temperature chemistry, solid-state electrochemistry, surface science, catalysis and metallurgy. This volume contains the processing’s of the 4th international workshop on ceramic Interfaces held at the Korea Advanced Institute of Science and Technology, Taejon, Korea. 27 specialists from 8 countries contributed of the workshop which was divided into 3 sessions: Microstructural development; Transport; Interfacial Phenomena and Kinetics.
