Author: Ken Gilleo
Publisher: McGraw Hill Professional
ISBN: 0071589090
Category : Technology & Engineering
Languages : en
Pages : 239
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
MEMS/MOEM Packaging
Author: Ken Gilleo
Publisher: McGraw Hill Professional
ISBN: 0071589090
Category : Technology & Engineering
Languages : en
Pages : 239
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Publisher: McGraw Hill Professional
ISBN: 0071589090
Category : Technology & Engineering
Languages : en
Pages : 239
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
MEMS/MOEMS Packaging
Author:
Publisher:
ISBN: 9781615831258
Category : Microelectromechanical systems
Languages : en
Pages : 220
Book Description
Publisher:
ISBN: 9781615831258
Category : Microelectromechanical systems
Languages : en
Pages : 220
Book Description
MEMS/MOEM Packaging : Concepts, Designs, Materials and Processes
Author: Ken Gilleo
Publisher: Mcgraw-hill
ISBN: 9780071455565
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Publisher: Mcgraw-hill
ISBN: 9780071455565
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
MEMS and MOEMS Technology and Applications
Author: P. Rai-Choudhury
Publisher: SPIE Press
ISBN: 9780819437167
Category : Technology & Engineering
Languages : en
Pages : 544
Book Description
The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.
Publisher: SPIE Press
ISBN: 9780819437167
Category : Technology & Engineering
Languages : en
Pages : 544
Book Description
The silicon age that led the computer revolution has significantly changed the world. The next 30 years will see the incorporation of new types of functionality onto the chip-structures that will enable the chip to reason, to sense, to act and to communicate. Micromachining technologies offer a wide range of possibilities for active and passive devices. Recent developments have produced sensors, actuators and optical systems. Many of these technologies are based on surface micromachining, which has evolved from silicon integrated circuit technology. This book is written by experts in the field. It contains useful details in design and processing and can be utilized as a reference book or as a textbook.
Design, Test, Integration and Packaging of MEMS/MOEMS, 2008. MEMS/MOEMS 2008. Symposium on
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X
Author: Sonia Garcia-Blanco
Publisher: SPIE-International Society for Optical Engineering
ISBN: 9780819484659
Category : Microelectromechanical systems
Languages : en
Pages : 256
Book Description
Includes Proceedings Vol. 7821
Publisher: SPIE-International Society for Optical Engineering
ISBN: 9780819484659
Category : Microelectromechanical systems
Languages : en
Pages : 256
Book Description
Includes Proceedings Vol. 7821
Design, Test, Integration and Packaging of MEMS/MOEMS
Author:
Publisher:
ISBN:
Category : Microelectromechanical systems
Languages : en
Pages : 596
Book Description
Publisher:
ISBN:
Category : Microelectromechanical systems
Languages : en
Pages : 596
Book Description
Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX
Author: Richard C. Kullberg
Publisher: SPIE-International Society for Optical Engineering
ISBN: 9780819479884
Category : Microelectromechanical systems
Languages : en
Pages : 344
Book Description
Includes Proceedings Vol. 7821
Publisher: SPIE-International Society for Optical Engineering
ISBN: 9780819479884
Category : Microelectromechanical systems
Languages : en
Pages : 344
Book Description
Includes Proceedings Vol. 7821
Design, Test, Integration and Packaging of MEMS/MOEMS 2002
Author: Bernard Courtois
Publisher: Society of Photo Optical
ISBN: 9780819445186
Category : Technology & Engineering
Languages : en
Pages : 832
Book Description
This volume examines the design, test, integration and packaging of MEMS/MOEMS 2002.
Publisher: Society of Photo Optical
ISBN: 9780819445186
Category : Technology & Engineering
Languages : en
Pages : 832
Book Description
This volume examines the design, test, integration and packaging of MEMS/MOEMS 2002.
Design, Test, Integration and Packaging of MEMS/MOEMS 2003
Author: Centre national de la recherche scientifique (France)
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780370661
Category : Microelectromechanical systems
Languages : en
Pages : 411
Book Description
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
ISBN: 9780780370661
Category : Microelectromechanical systems
Languages : en
Pages : 411
Book Description