Author: Ken Gilleo
Publisher: McGraw Hill Professional
ISBN: 0071589090
Category : Technology & Engineering
Languages : en
Pages : 239
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
MEMS/MOEM Packaging
Author: Ken Gilleo
Publisher: McGraw Hill Professional
ISBN: 0071589090
Category : Technology & Engineering
Languages : en
Pages : 239
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Publisher: McGraw Hill Professional
ISBN: 0071589090
Category : Technology & Engineering
Languages : en
Pages : 239
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Fabrication and Design of Resonant Microdevices
Author: Behraad Bahreyni
Publisher: William Andrew
ISBN: 0815519710
Category : Technology & Engineering
Languages : en
Pages : 234
Book Description
This book discusses the main issues of fabrication and design, and applications of micromachined resonant devices, including techniques commonly used for processing the output signal of resonant micro-electro-mechanical systems (MEMS). Concepts of resonance are introduced, with an overview of fabrication techniques for micromachined devices – important to understand as design options will depend on how the device will be fabricated. Also explained: excitation and signal detection methods; an analytic model of device behavior (a valuable design tool); numerical simulation techniques; issues of damping and noise for resonant MEMS; electronic interfacing; packaging issues; and numerous examples of resonant MEMS from academia and industry. - Offers numerous academic and industrial examples of resonant MEMS - Provides an analytic model of device behaviour - Explains two-port systems in detail - Devotes ample space to excitation and signal detection methods - Covers issues of damping and noise for resonant MEMS, two topics of particular importance for high-Q devices
Publisher: William Andrew
ISBN: 0815519710
Category : Technology & Engineering
Languages : en
Pages : 234
Book Description
This book discusses the main issues of fabrication and design, and applications of micromachined resonant devices, including techniques commonly used for processing the output signal of resonant micro-electro-mechanical systems (MEMS). Concepts of resonance are introduced, with an overview of fabrication techniques for micromachined devices – important to understand as design options will depend on how the device will be fabricated. Also explained: excitation and signal detection methods; an analytic model of device behavior (a valuable design tool); numerical simulation techniques; issues of damping and noise for resonant MEMS; electronic interfacing; packaging issues; and numerous examples of resonant MEMS from academia and industry. - Offers numerous academic and industrial examples of resonant MEMS - Provides an analytic model of device behaviour - Explains two-port systems in detail - Devotes ample space to excitation and signal detection methods - Covers issues of damping and noise for resonant MEMS, two topics of particular importance for high-Q devices
MEMS/MOEM Packaging : Concepts, Designs, Materials and Processes
Author: Ken Gilleo
Publisher: Mcgraw-hill
ISBN: 9780071455565
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Publisher: Mcgraw-hill
ISBN: 9780071455565
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Futuristic Manufacturing
Author: Mithilesh K. Dikshit
Publisher: CRC Press
ISBN: 1000852121
Category : Technology & Engineering
Languages : en
Pages : 194
Book Description
Increased industrial capacity, manufacturing output, and manufacturing technology all contribute significantly to a country's GDP. Manufacturing is the foundation of industrial production, so improving its methods and infrastructure is crucial for progress. Recent years have seen the introduction of a wide range of energy- and resource-efficient, environmentally friendly, and occupationally safe manufacturing techniques, and this book focuses on these latest techniques, as well as continuous advancement, in order to meet current challenges. The book is divided into three sections: (1) subtractive manufacturing, (2) additive manufacturing, and (3) the use of artificial intelligence in manufacturing. It discusses micromaching, metal-based additive manufacturing, polymer-based additive manufacturing, hybrid additive manufacturing, and finally artificial intelligence in manufacturing. Futuristic Manufacturing: Perpetual Advancement and Research Challenges connects modern manufacturing methods and emerging trends in the industry. It adds a thorough examination of modern manufacturing techniques and modifications that may be implemented in the future, and is an excellent resource of information for undergraduate and graduate students in manufacturing.
Publisher: CRC Press
ISBN: 1000852121
Category : Technology & Engineering
Languages : en
Pages : 194
Book Description
Increased industrial capacity, manufacturing output, and manufacturing technology all contribute significantly to a country's GDP. Manufacturing is the foundation of industrial production, so improving its methods and infrastructure is crucial for progress. Recent years have seen the introduction of a wide range of energy- and resource-efficient, environmentally friendly, and occupationally safe manufacturing techniques, and this book focuses on these latest techniques, as well as continuous advancement, in order to meet current challenges. The book is divided into three sections: (1) subtractive manufacturing, (2) additive manufacturing, and (3) the use of artificial intelligence in manufacturing. It discusses micromaching, metal-based additive manufacturing, polymer-based additive manufacturing, hybrid additive manufacturing, and finally artificial intelligence in manufacturing. Futuristic Manufacturing: Perpetual Advancement and Research Challenges connects modern manufacturing methods and emerging trends in the industry. It adds a thorough examination of modern manufacturing techniques and modifications that may be implemented in the future, and is an excellent resource of information for undergraduate and graduate students in manufacturing.
Design, Characterization, and Packaging for MEMS and Microelectronics
Author:
Publisher:
ISBN:
Category : Microelectromechanical systems
Languages : en
Pages : 344
Book Description
Publisher:
ISBN:
Category : Microelectromechanical systems
Languages : en
Pages : 344
Book Description
Polymer Nanocomposites
Author: Joseph H. Koo
Publisher: McGraw Hill Professional
ISBN: 0071492046
Category : Technology & Engineering
Languages : en
Pages : 289
Book Description
Understand the principles, applications, and limitations of a cutting-edge material Based on the author's 26 years of experience in the field of Nanotechnology, this reference offers researchers and materials scientists a complete reference to the physical concepts, techniques, applications and principles underlying one of the most researched materials. Keeps you abreast of the latest trends, developments, and commercial applications
Publisher: McGraw Hill Professional
ISBN: 0071492046
Category : Technology & Engineering
Languages : en
Pages : 289
Book Description
Understand the principles, applications, and limitations of a cutting-edge material Based on the author's 26 years of experience in the field of Nanotechnology, this reference offers researchers and materials scientists a complete reference to the physical concepts, techniques, applications and principles underlying one of the most researched materials. Keeps you abreast of the latest trends, developments, and commercial applications
MEMS/MOEMS Packaging
Author:
Publisher:
ISBN: 9781615831258
Category : Microelectromechanical systems
Languages : en
Pages : 220
Book Description
Publisher:
ISBN: 9781615831258
Category : Microelectromechanical systems
Languages : en
Pages : 220
Book Description
MOEMS
Author: M. Edward Motamedi
Publisher: SPIE Press
ISBN: 9780819450210
Category : Technology & Engineering
Languages : en
Pages : 640
Book Description
This book introduces the exciting and fast-moving field of MOEMS to graduate students, scientists, and engineers by providing a foundation of both micro-optics and MEMS that will enable them to conduct future research in the field. Born from the relatively new fields of MEMS and micro-optics, MOEMS are proving to be an attractive and low-cost solution to a range of device problems requiring high optical functionality and high optical performance. MOEMS solutions include optical devices for telecommunication, sensing, and mobile systems such as v-grooves, gratings, shutters, scanners, filters, micromirrors, switches, alignment aids, lens arrays, and hermetic wafer-scale optical packaging. An international team of leading researchers contributed to this book, and it presents examples and problems employing cutting-edge MOEM devices. It will inspire researchers to further advance the design, fabrication, and analysis of MOEM systems.
Publisher: SPIE Press
ISBN: 9780819450210
Category : Technology & Engineering
Languages : en
Pages : 640
Book Description
This book introduces the exciting and fast-moving field of MOEMS to graduate students, scientists, and engineers by providing a foundation of both micro-optics and MEMS that will enable them to conduct future research in the field. Born from the relatively new fields of MEMS and micro-optics, MOEMS are proving to be an attractive and low-cost solution to a range of device problems requiring high optical functionality and high optical performance. MOEMS solutions include optical devices for telecommunication, sensing, and mobile systems such as v-grooves, gratings, shutters, scanners, filters, micromirrors, switches, alignment aids, lens arrays, and hermetic wafer-scale optical packaging. An international team of leading researchers contributed to this book, and it presents examples and problems employing cutting-edge MOEM devices. It will inspire researchers to further advance the design, fabrication, and analysis of MOEM systems.
Design, Test, and Microfabrication of MEMS and MOEMS
Author: Bernard Courtois
Publisher:
ISBN:
Category : Computer-aided design
Languages : en
Pages : 694
Book Description
Publisher:
ISBN:
Category : Computer-aided design
Languages : en
Pages : 694
Book Description
Microelectronic Structures and MEMS for Optical Processing
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 260
Book Description
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 260
Book Description