Mechanical and Electronics Engineering III PDF Download
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Author: Han Zhao
Publisher: Trans Tech Publications Ltd
ISBN: 3038137189
Category : Technology & Engineering
Languages : en
Pages : 4760
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Book Description
Volume is indexed by Thomson Reuters CPCI-S (WoS). These peer-reviewed proceedings comprise the papers presented at a conference whose main theme was Mechanical and Electronics Engineering. The main goal of the event was to provide an international scientific forum for the exchange of new ideas in a number of fields and for in-depth interaction via discussions with peers from around the world. Core areas of Information and Network Technology, plus multidisciplinary, interdisciplinary and applied aspects were covered.
Author: Han Zhao
Publisher: Trans Tech Publications Ltd
ISBN: 3038137189
Category : Technology & Engineering
Languages : en
Pages : 4760
Get Book Here
Book Description
Volume is indexed by Thomson Reuters CPCI-S (WoS). These peer-reviewed proceedings comprise the papers presented at a conference whose main theme was Mechanical and Electronics Engineering. The main goal of the event was to provide an international scientific forum for the exchange of new ideas in a number of fields and for in-depth interaction via discussions with peers from around the world. Core areas of Information and Network Technology, plus multidisciplinary, interdisciplinary and applied aspects were covered.
Author: Han Zhao
Publisher:
ISBN:
Category :
Languages : en
Pages : 47
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Book Description
Author: Han Zhao
Publisher:
ISBN: 9783037951118
Category :
Languages : en
Pages : 0
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Book Description
Author: David Baker
Publisher: Arcturus Publishing
ISBN: 1398807281
Category : Technology & Engineering
Languages : en
Pages : 760
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Book Description
A concise introduction to all the key tenets of electrical and mechanical engineering degree course, written by former NASA engineer Dr David Baker. A Degree in a Book: Electrical and Mechanical Engineering is presented in an attractive landscape format in full-color. With timelines, feature spreads and information boxes, readers will quickly get to grips with the fundamentals of electrical and mechanical engineering and their practical applications. Covering Newtonian mechanics, nuclear engineering, artificial intelligence, 3D printing and more, this essential guide brings clarity to complex ideas. David Baker delves into the history and development of this far-reaching subject as well as the challenges of the future such as environmental responsibility. Complete with a useful glossary of key terms, this holistic introduction will equip students and laypeople alike with the knowledge of an engineering graduate. ABOUT THE SERIES: Get the knowledge of a degree for the price of a book with Arcturus Publishing's A Degree in a Book series. Written by experts in their fields, these highly visual guides feature handy timelines, information boxes, feature spreads and margin annotations, allowing readers to get to grips with complex subjects in no time.
Author: David Jin
Publisher: Springer Science & Business Media
ISBN: 3642315283
Category : Technology & Engineering
Languages : en
Pages : 526
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Book Description
This book includes the volume 3 of the proceedings of the 2012 International Conference on Mechanical and Electronic Engineering(ICMEE2012), held at June 23-24,2012 in Hefei, China. The conference provided a rare opportunity to bring together worldwide researchers who are working in the fields. This volume 3 is focusing on Electronic Engineering and Electronic Communication; Electronic Engineering and Electronic Image Processing.
Author: Charles Fraser
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 560
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Book Description
Basic electrical technology. Analogue electronics. Electrical actuators.
Author: Zhi Ming Liu
Publisher: Trans Tech Publications Ltd
ISBN: 3038266469
Category : Technology & Engineering
Languages : en
Pages : 428
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Book Description
Collection of selected, peer reviewed papers from the 2014 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2014), August 16-17, 2014, Beijing, China. Volume is indexed by Thomson Reuters CPCI-S (WoS). The 80 papers are grouped as follows: Chapter 1: Advanced Materials Engineering and Processing Technologies, Chapter 2: General Mechanical Engineering and Applied Mechanics, Chapter 3: Power Engineering, Chapter 4: Power Electronics and Electrical Engineering, Chapter 5: Mechatronics, Robotics and Control, Chapter 6: Measurements and Sensors, Chapter 7: Signal and Image Processing, Data Mining and Computational Mathematics, Chapter 8: Communication, Networks and Information Technologies, Chapter 9: Product Design and Industrial Engineering
Author: Ali Jamnia
Publisher: CRC Press
ISBN: 1498754023
Category : Technology & Engineering
Languages : en
Pages : 374
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Book Description
Successfully Estimate the Thermal and Mechanical Characteristics of Electronics Systems A definitive guide for practitioners new to the field or requiring a refresher course, Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides an understanding of system failures and helps identify the areas where they can occur. Specifically designed for the mechanical, electrical, or quality engineer, the book addresses engineering issues involved in electronics packaging and provides the basics needed to design a new system or troubleshoot a current one. Updated to reflect recent developments in the field, this latest edition adds two new chapters on acoustic and reliability fundamentals, and contains more information on electrical failures and causes. It also includes tools for understanding heat transfer, shock, and vibration. Additionally, the author: Addresses various cross-discipline issues in the design of electromechanical products Provides a solid foundation for heat transfer, vibration, and life expectancy calculations Identifies reliability issues and concerns Develops the ability to conduct a more thorough analysis for the final design Includes design tips and guidelines for each aspect of electronics packaging Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition explains the mechanical and thermal/fluid aspects of electronic product design and offers a basic understanding of electronics packaging design issues. Defining the material in-depth, it also describes system design guidelines and identifies reliability concerns for practitioners in mechanical, – electrical or quality engineering.
Author: William Bolton
Publisher: Prentice Hall
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 568
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Book Description
"The integration of electronic engineering, electrical engineering, computer technology and control engineering with mechanical engineering -- mechatronics -- now forms a crucial part in the design, manufacture and maintenance of a wide range of engineering products and processes. This book provides a clear and comprehensive introduction to the application of electronic control systems in mechanical and electrical engineering. It gives a framework of knowledge that allows engineers and technicians to develop an interdisciplinary understanding and integrated approach to engineering. This second edition has been updated and expanded to provide greater depth of coverage." -- Back cover.
Author: Jian Feng Li
Publisher: Trans Tech Publications Ltd
ISBN: 3038262846
Category : Technology & Engineering
Languages : en
Pages : 1140
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Book Description
Collection of selected, peer reviewed papers from the 2013 3rd International Conference on Machinery Electronics and Control Engineering (ICMECE 2013), November 29-30, 2013, Jinan, Shandong, China. Volume is indexed by Thomson Reuters CPCI-S (WoS). The 241 papers are grouped as follows: Chapter 1: Development and Processing of Innovative Materials; Chapter 2: Electronic and Semiconductor Devices; Chapter 3: Power Systems and Applied Electronics; Chapter 4: Measurement and Monitoring of Systems; Chapter 5: Modelling, Simulation and Optimization; Chapter 6: Analysis and Design of Structures and Machines; Chapter 7: Data and Signal Processing; Chapter 8: Neural Network and Applied Algorithms; Chapter 9: Control Systems; Chapter 10: Communication Systems, Network and Information Technologies; Chapter 11: Technologies in Manufacture and Engineering Management.
