Materials Reliability in Microelectronics IX PDF Download
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Languages : en
Pages : 0
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Author:
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Languages : en
Pages : 0
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Author: Cynthia A. Volkert
Publisher: Cambridge University Press
ISBN: 9781558994706
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
The continual evolution of integrated circuit architecture places ever-increasing demands on the metal and dielectric thin films used in fabricating these circuits. Not only must these materials meet performance and manufacturability requirements, they must also be highly reliable for many years under operating conditions. A thorough understanding of the failure mechanisms and the effect of processing conditions and material properties on reliability is required to achieve this, particularly if it is to be done while minimizing cost and maximizing performance. This book brings together researchers from academia and industry to discuss fundamental mechanisms and phenomena in the reliability field. Topics include: solder and barrier-layer reliability; electromigration modeling; electromigration in interconnects; advanced measurement techniques; mechanical behavior of back-end materials and adhesion and fracture.
Author:
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Category : Microelectronics
Languages : en
Pages : 336
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Author:
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Category : Microelectronics
Languages : en
Pages :
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Author: Materials Research Society
Publisher: Materials Research Society
ISBN: 9783380000006
Category : Technology & Engineering
Languages : en
Pages :
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Author: Anthony S. Oates
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 552
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This long-standing proceedings series is highly regarded as a premier forum for the discussion of microelectronics reliability issues. In this fifth book, emphasis is on the fundamental understanding of failure phenomena in thin-film materials. Special attention is given to electromigration and mechanical stress effects. The reliability of thin dielectrics and hot carrier degradation of transistors are also featured. Topics include: modeling and simulation of failure mechanisms; reliability issues for submicron IC technologies and packaging; stresses in thin films/lines; gate oxides; barrier layers; electromigration mechanisms; reliability issues for Cu metallizations; electromigration and microstructure; electromigration and stress voiding in circuit interconnects; and resistance measurements of electromigration damage.
Author:
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ISBN:
Category : Microelectronics
Languages : en
Pages : 392
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Proceedings of the "MRS Symposium on Materials Reliability Issues in Microelectronics"--Dedication, p. xiii.
Author: Materials Research Society. Spring Meeting
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 666
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Author: Willem Dirk van Driel
Publisher: Springer Nature
ISBN: 3030815765
Category : Technology & Engineering
Languages : en
Pages : 552
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Book Description
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Author:
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Category : Electrodiffusion
Languages : en
Pages : 583
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