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Author: Materials Research Society. Spring Meeting
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 666
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Book Description
Author: Materials Research Society. Spring Meeting
Publisher:
ISBN:
Category : Electrodiffusion
Languages : en
Pages : 666
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Book Description
Author: Y.-L. Shen
Publisher: Springer Science & Business Media
ISBN: 144196312X
Category : Technology & Engineering
Languages : en
Pages : 290
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Book Description
"Constrained Deformation of Materials: Devices, Heterogeneous Structures and Thermo-Mechanical Modeling" is an in-depth look at the mechanical analyses and modeling of advanced small-scale structures and heterogeneous material systems. Mechanical deformations in thin films and miniaturized materials, commonly found in microelectronic devices and packages, MEMS, nanostructures and composite and multi-phase materials, are heavily influenced by the external or internal physical confinement. A continuum mechanics-based approach is used, together with discussions on micro-mechanisms, to treat the subject in a systematic manner under the unified theme. Readers will find valuable information on the proper application of thermo-mechanics in numerical modeling as well as in the interpretation and prediction of physical material behavior, along with many case studies. Additionally, particular attention is paid to practical engineering relevance. Thus real-life reliability issues are discussed in detail to serve the needs of researchers and engineers alike.
Author:
Publisher:
ISBN:
Category : DEC computers
Languages : en
Pages : 412
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Book Description
Author: Jeremy Gilbert
Publisher: ASM International
ISBN: 1615031243
Category : Technology & Engineering
Languages : en
Pages : 261
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Book Description
"Proceedings from the only conference on medical devices that brings together scientists and product, research, design and development engineers from around the globe to present the latest developments in materials, processes, product performance and new technologies for medical/dental devices." "This volume includes contributions from the world's foremost experts from academia, industry, and national laboratories involved in cardiac, vascular, neurological, and orthopaedic implants, dental devices, and surgical instrumentation/devices." "Materials addressed include biomedical alloys (stainless steels, titanium alloys, cobalt-chromium alloys, nickel-titanium alloys, noble and refractory metals) biopolymers, bioceramics, surface coatings, and nanomaterials." "Topics covered include: degradation, wear fracture, corrosion, processing, biomimetics, biocompatibility, bioelectric phenomena and electrode behavior, surface engineering, and cell-material interactions."--BOOK JACKET.
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 756
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Book Description
Author:
Publisher:
ISBN:
Category : Mechanics, Applied
Languages : en
Pages : 400
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Book Description
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 470
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Book Description
Author: Deborah D.L. Chung
Publisher: Springer Science & Business Media
ISBN: 1447137329
Category : Technology & Engineering
Languages : en
Pages : 297
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Book Description
Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.
Author: Eitan N. Shauly
Publisher: CRC Press
ISBN: 1000631354
Category : Technology & Engineering
Languages : en
Pages : 831
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Book Description
Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
Author: United States. Department of the Army
Publisher:
ISBN:
Category : Military research
Languages : en
Pages : 428
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Book Description
