Materials for Mechanical and Optical Microsystems: Volume 444

Materials for Mechanical and Optical Microsystems: Volume 444 PDF Author: Michael L. Reed
Publisher:
ISBN:
Category : Mathematics
Languages : en
Pages : 264

Get Book

Book Description
A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR

Materials for Mechanical and Optical Microsystems: Volume 444

Materials for Mechanical and Optical Microsystems: Volume 444 PDF Author: Michael L. Reed
Publisher:
ISBN:
Category : Mathematics
Languages : en
Pages : 264

Get Book

Book Description
A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR

Fabrication Methods for Environmentally Hardened Sensors

Fabrication Methods for Environmentally Hardened Sensors PDF Author: Anthony F. Flannery (Jr.)
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 146

Get Book

Book Description
around the gaskets.

Materials for Optical Limiting II: Volume 479

Materials for Optical Limiting II: Volume 479 PDF Author: Richard Lee Sutherland
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 358

Get Book

Book Description
The proliferation of lasers and systems employing lasers has brought with it the potential for adverse effects from these bright, coherent light sources. This includes the possibility of damage from pulsed lasers, as well as temporary blinding by continuous-waver lasers. With nearly every wavelength possible being emitted by these sources, there exists a need to develop optical limiters and tunable filters which can suppress undesired radiation of any wavelength. This book addresses a number of materials and devices which have the potential for meeting the challenge. The proceedings is divided into five parts. Parts I and II cover research in organic and inorganic materials primarily based on nonlinear absorption or phase transitions for optical limiting of pulsed lasers. Part III includes photo-refractive materials and liquid crystals which find primary applications in dynamic filters. Part IV covers various aspects of device and material characterization, including nonlinear beam propagation effects. Theoretical modelling of materials properties is the subject of Part V.

Materials for Optical Limiting

Materials for Optical Limiting PDF Author:
Publisher:
ISBN:
Category : Eyeglasses, Protective
Languages : en
Pages : 360

Get Book

Book Description


Materials Science of Microelectromechanical Systems (MEMS) Devices II: Volume 605

Materials Science of Microelectromechanical Systems (MEMS) Devices II: Volume 605 PDF Author: Maarten De Boer
Publisher: Mrs Proceedings
ISBN:
Category : Science
Languages : en
Pages : 344

Get Book

Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Materials Science of Microelectromechanical Systems (MEMS) Devices

Materials Science of Microelectromechanical Systems (MEMS) Devices PDF Author:
Publisher:
ISBN:
Category : Microactuators
Languages : en
Pages : 378

Get Book

Book Description


Low-Dielectric Constant Materials II: Volume 443

Low-Dielectric Constant Materials II: Volume 443 PDF Author: André Lagendijk
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 224

Get Book

Book Description
Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.

Electronic Packaging Materials Science IX: Volume 445

Electronic Packaging Materials Science IX: Volume 445 PDF Author: Steven K. Groothuis
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344

Get Book

Book Description
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.

Nanophase and Nanocomposite Materials II: Volume 457

Nanophase and Nanocomposite Materials II: Volume 457 PDF Author: Sridhar Komarneni
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 584

Get Book

Book Description
This book provides an international and interdisciplinary forum for the discussion of advances in the research of nanophase and nanocomposites. The term 'nanophase' refers to nanoscale particles of one phase, whereas the term 'nanocomposite'refers to a composite of more than one Gibbsian solid phase where at least one dimension is in the nanometer range. The book, the second in a series, features reports showing that bulk materials with nanostructure (‹ 0.5µm) often have enhanced and unique properties when compared to their coarse-structured (›1µm) equivalents. A wide range of science and engineering disciplines are represented, with topics ranging from synthesis and processing, to properties and applications. Topics include: nanophase oxides; nanophase metals, alloys and non-oxides; nanophases - simulation studies; magnetic and metal nanocomposites; oxide, non-oxide and oxide-metal nanocomposites; organic-inorganic and sol-gel nanocomposites; and nanocomposites of layered and mesoporous materials.

Defects in Electronic Materials II: Volume 442

Defects in Electronic Materials II: Volume 442 PDF Author: Jürgen Michel
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 744

Get Book

Book Description
The pervasive role of defects in determining the thermal, mechanical, electrical, optical and magnetic properties of materials is significant as is the knowledge and operation of generation and control of defects in electronic materials. Developing novel semiconductor materials, however, requires new insights into the role of defects to achieve new properties. New experimental techniques must be developed to study defects in small structures. Research groups come together in this book from MRS to provide a vivid picture of the current problems, progress and methods in defect studies in electronic materials. Topics include new techniques in defect studies; processing induced defects, plasma-induced point defects; processing induced defects -defects and gate-oxide integrity; point defects and reaction; point defects and interactions in Si; impurity diffusion and hydrogen in Si; dislocations in group IV semiconductors; point defects and defect interactions in SiGe; point defects in III-V compounds; compensation and structural defects in III-V compounds and layers and structures.