Materials for Mechanical and Optical Microsystems: Volume 444 PDF Download
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Author: Michael L. Reed
Publisher:
ISBN:
Category : Mathematics
Languages : en
Pages : 264
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Book Description
A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR
Author: Michael L. Reed
Publisher:
ISBN:
Category : Mathematics
Languages : en
Pages : 264
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Book Description
A selection of 33 reviewed papers explore the materials aspects of microsystems, especially those involving mechanical, optical, and thermal components. The topics include technology for micro- assembling, selective electroless copper metallization of epoxy substrates, an improved auto-adhesion measurement method for micro-machines polysilicon beams, patterned sol-gel structures by micro-molding in capillaries, the experimental analysis of the process of anodic bonding using an evaporated glass layer, the effect of inorganic thin film material processing and properties on stress in silicon piezoresistive pressure sensors, and photoconductivity in vacuum-deposited films of silicon-based polymers. Annotation copyrighted by Book News, Inc., Portland, OR
Author:
Publisher:
ISBN:
Category : Eyeglasses, Protective
Languages : en
Pages : 360
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Book Description
Author: Anthony F. Flannery (Jr.)
Publisher: Stanford University
ISBN:
Category :
Languages : en
Pages : 146
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Book Description
around the gaskets.
Author: Richard Lee Sutherland
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 358
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Book Description
The proliferation of lasers and systems employing lasers has brought with it the potential for adverse effects from these bright, coherent light sources. This includes the possibility of damage from pulsed lasers, as well as temporary blinding by continuous-waver lasers. With nearly every wavelength possible being emitted by these sources, there exists a need to develop optical limiters and tunable filters which can suppress undesired radiation of any wavelength. This book addresses a number of materials and devices which have the potential for meeting the challenge. The proceedings is divided into five parts. Parts I and II cover research in organic and inorganic materials primarily based on nonlinear absorption or phase transitions for optical limiting of pulsed lasers. Part III includes photo-refractive materials and liquid crystals which find primary applications in dynamic filters. Part IV covers various aspects of device and material characterization, including nonlinear beam propagation effects. Theoretical modelling of materials properties is the subject of Part V.
Author: J. Joseph Clement
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 488
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Book Description
The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 488
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Book Description
Author: André Lagendijk
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
Low-dielectric constant materials are needed to improve the performance and speed of future integrated circuits. In fact, the diversity of contributors to this book is testimony to the global significance of the topic to the future of semiconductor manufacturing. Presentations include those by semiconductor equipment manufacturers and chemical source suppliers, academia from six countries, four government laboratories and five major device manufacturers. Approaches to designing and implementing reduction in dielectric constant for intermetal dielectric materials are featured and range from the evolution of silicon dioxide to fluorinated silicate glass, to the use of inorganic/organic polymers and spin-on-material, to fluorinated diamond-like carbon and nanoporous silica. The book also addresses the practical aspects of the use of low-dielectric constant materials such as chemical mechanical polishing of these materials and optimization of wiring delays in devices utilizing low-k material.
Author: Steven K. Groothuis
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 344
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Book Description
While this book continues the spirit of the MRS series on materials science related to the development of electronic packaging, it also focuses on three very specific technological areas - technology for flip-chip packaging, materials metrology and characterization, and packaging reliability and testing. These are important areas for technology development in electronic packaging, particularly since materials and processing play an important role in controlling system performance and reliability. Topics include: flip-chip and solder technology; future packaging technology; manufacturing technology in packaging; packaging materials and metrology; interfacial adhesion and fracture and packaging reliability and testing.
Author: Vasyl Michael Harik
Publisher: Springer Science & Business Media
ISBN: 9400710135
Category : Technology & Engineering
Languages : en
Pages : 251
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Book Description
This volume consists of the state-of-the-art reports on new developments in micromechanics and the modeling of nanoscale effects, and is a companion book to the recent Kluwer volume on nanomechanics and mul- scale modeling (it is entitled Trends in Nanoscale Mechanics). The two volumes grew out of a series of discussions held at NASA Langley Research Center (LaRC), lectures and other events shared by many researchers from the national research laboratories and academia. The key events include the 2001 Summer Series of Round-Table Discussions on Nanotechnology at ICASE Institute (NASA LaRC) organized by Drs. V. M. Harik and M. D. Salas and the 2002 NASA LaRC Workshop on Multi-scale Modeling. The goal of these interactions was to foster collaborations between academic researchers and the ICASE Institute (NASA LaRC), a universi- based institute, which has pioneered world-class computational, theoretical and experimental research in the disciplines that are important to NASA. Editors gratefully acknowledge help of Ms. E. Todd (ICASE, NASA LaRC), the ICASE Director M. D. Salas and all reviewers, in particular, Dr. B. Diskin (ICASE/NIA, NASA LaRC), Prof. R. Haftka (University of Florida), Dr. V. M. Harik (ICASE/Swales Aerospace, NASA LaRC), Prof.
Author: Arthur H. Heuer
Publisher:
ISBN:
Category : Microelectromechanical systems
Languages : en
Pages : 274
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Book Description
