Mastering Surface Mount Technology PDF Download
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Author: Vincent Himpe
Publisher:
ISBN: 9781907920127
Category : Printed circuits
Languages : en
Pages : 282
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Book Description
Author: Vincent Himpe
Publisher:
ISBN: 9781907920127
Category : Printed circuits
Languages : en
Pages : 282
Get Book Here
Book Description
Author: Ray Prasad
Publisher: Springer Science & Business Media
ISBN: 1461540844
Category : Technology & Engineering
Languages : en
Pages : 791
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Book Description
A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.
Author: Glenn R. Blackwell
Publisher: Delmar Thomson Learning
ISBN:
Category : Computers
Languages : en
Pages : 548
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Book Description
Learn to generate high manufacturing yields, low testing costs, and reproducible designs using the latest components of surface mount technology (SMT)! Manufacturers, managers, engineers, students, and others who work with printed-circuit boards will find a wealth of cutting-edge information about SMT and fine pitch technology (FPT) in this new edition. Practical data and clear illustrations combine to clearly and accurately present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.
Author: Carmen Capillo
Publisher: McGraw-Hill Companies
ISBN:
Category : Computers
Languages : en
Pages : 376
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Book Description
Author: Stephen W. Hinch
Publisher: Longman Scientific and Technical
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 512
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Book Description
Author: Rudolf Strauss
Publisher: Butterworth-Heinemann
ISBN:
Category : Printed circuits
Languages : en
Pages : 392
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Book Description
Surface mount technology has had a profound influence on the electronics industry. Changes have involved the use of new materials, techniques and manufacturing processes, and have resulted in a significantly new approach to electronics assembly. This book looks at surface mount technology.
Author: James K. Hollomon
Publisher:
ISBN: 9788176564502
Category : Printed circuits
Languages : en
Pages : 509
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Book Description
Manufacturers, Managers, Engineers And Others Who Work With Printed-Circuit Boards Will Find A Wealth Of Information About Surface-Mount Technology (Smt) And Fine-Pitch Technology (Fpt) In This Book. Practical Data And Clear Illustrations Plainly Present The Details Of Design-For-Manufacturability, Environmental Compliance, Design-For-Test, And Quality/Reliability For Today's Miniaturized Electronics Packaging.
Author: John H. Lau
Publisher: Springer
ISBN:
Category : Computers
Languages : en
Pages : 732
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Book Description
Surface mount technology (SMT) is a mature technology. SMT allows placement of more surface mount components (SMC) into smaller and tighter printed circuit board (PCB) areas. This increased density means increased performance and power in smaller packaging systems, and allows manufacturing of smaller and higher performance products at lower cost. The advance of integrated circuit (IC) technology and the requirements of high density for high-speed circuity is driving the design of SM C to higher pin count and smaller package size. In general, the higher pin count and smaller package size are accomplished by reducing the bond pad size and spacing (pitch) on the chip level and the lead/pin/solder dimensions and pitch on the chip carrier (module) level. The last few years have witnessed an explosive growth in the research and development efforts devoted to FPT as a direct result of the rapid growth of SMT and miniaturization. Some examples are: hand held lightweight video recorders that can take sharp pictures, hand held lightweight devices that can track the worldwide package movements, and portable computers with tiny yet powerful microprocessors and large memory capability that can fit into a briefcase or into the palm of your hand.
Author: John E. Traister
Publisher:
ISBN:
Category : Printed circuits
Languages : en
Pages : 468
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Book Description
Author: Phil Zarrow
Publisher: Newnes
ISBN: 0750698756
Category : Education
Languages : en
Pages : 145
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Book Description
Surface Mount Technology Terms and Concepts is an invaluable resource for anyone involved in SMT. This book clearly defines more than 1000 of the most commonly used terms and concepts. By far the most comprehensive glossary of its kind, as well as more accessible and readable than most technical books devoted to assembly, Surface Mount Technology Terms and Concepts contains all of the terms that engineers and managers engaged in surface mount process, manufacturing, quality, design, and purchasing may encounter.
