Author: Charles J. Alpert
Publisher: CRC Press
ISBN: 1000654192
Category : Computers
Languages : en
Pages : 1044

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Book Description
The physical design flow of any project depends upon the size of the design, the technology, the number of designers, the clock frequency, and the time to do the design. As technology advances and design-styles change, physical design flows are constantly reinvented as traditional phases are removed and new ones are added to accommodate changes in

Author: Marcello Coppola
Publisher: CRC Press
ISBN: 1420044729
Category : Technology & Engineering
Languages : en
Pages : 292

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Book Description
Streamlined Design Solutions Specifically for NoC To solve critical network-on-chip (NoC) architecture and design problems related to structure, performance and modularity, engineers generally rely on guidance from the abundance of literature about better-understood system-level interconnection networks. However, on-chip networks present several distinct challenges that require novel and specialized solutions not found in the tried-and-true system-level techniques. A Balanced Analysis of NoC Architecture As the first detailed description of the commercial Spidergon STNoC architecture, Design of Cost-Efficient Interconnect Processing Units: Spidergon STNoC examines the highly regarded, cost-cutting technology that is set to replace well-known shared bus architectures, such as STBus, for demanding multiprocessor system-on-chip (SoC) applications. Employing a balanced, well-organized structure, simple teaching methods, numerous illustrations, and easy-to-understand examples, the authors explain: how the SoC and NoC technology works why developers designed it the way they did the system-level design methodology and tools used to configure the Spidergon STNoC architecture differences in cost structure between NoCs and system-level networks From professionals in computer sciences, electrical engineering, and other related fields, to semiconductor vendors and investors – all readers will appreciate the encyclopedic treatment of background NoC information ranging from CMPs to the basics of interconnection networks. The text introduces innovative system-level design methodology and tools for efficient design space exploration and topology selection. It also provides a wealth of key theoretical and practical MPSoC and NoC topics, such as technological deep sub-micron effects, homogeneous and heterogeneous processor architectures, multicore SoC, interconnect processing units, generic NoC components, and embeddings of common communication patterns.

Author: Surendra M. Gupta
Publisher: CRC Press
ISBN: 1351645617
Category : Business & Economics
Languages : en
Pages : 154

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Book Description
In order to ensure environmentally responsible production and disposal of products, local governments are imposing stricter environmental regulations, some of which even require manufacturers to take back their products at the end of the product's useful life. These government regulations, together with increasing environmental awareness, have forced manufacturers to invest in environment-conscious manufacturing. The multiple Criteria Decision Making Techniques presented in this book can be employed to solve the problems of environment-conscious manufacturers in product design, logistics, disassembly and remanufacturing.

Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 634

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Book Description

Author: Monica Carfagni
Publisher: Springer Nature
ISBN: 303158094X
Category :
Languages : en
Pages : 630

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Book Description

Author: Aida Todri-Sanial
Publisher: CRC Press
ISBN: 1498710379
Category : Technology & Engineering
Languages : en
Pages : 397

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Book Description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Author: Ban Wong
Publisher: John Wiley & Sons
ISBN: 0471678864
Category : Technology & Engineering
Languages : en
Pages : 413

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Book Description
Based on the authors' expansive collection of notes taken over the years, Nano-CMOS Circuit and Physical Design bridges the gap between physical and circuit design and fabrication processing, manufacturability, and yield. This innovative book covers: process technology, including sub-wavelength optical lithography; impact of process scaling on circuit and physical implementation and low power with leaky transistors; and DFM, yield, and the impact of physical implementation.

Author: Surendra M. Gupta
Publisher: CRC Press
ISBN: 1420018795
Category : Business & Economics
Languages : en
Pages : 560

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Book Description
Hotter temperatures, less arctic ice, loss of habitat-every other day, it seems, global warming and environmental issues make headlines. Consumer-driven environmental awareness combined with stricter recycling regulations have put the pressure on companies to produce and dispose of products in an environmentally responsible manner. Redefining indus

Author: Jess Chen
Publisher: Lulu.com
ISBN: 130003520X
Category : Technology & Engineering
Languages : en
Pages : 410

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Book Description
This book, the Mixed-signal Methodology Guide: Advanced Methodology for AMS IP and SoC Design, Verification, and Implementation provides a broad overview of the design, verification and implementation methodologies required for today's mixed-signal designs. The book covers mixed-signal design trends and challenges, abstraction of analog using behavioral models, assertion-based metric-driven verification methodology applied on analog and mixed-signal and verification of low power intent in mixed-signal design. It also describes methodology for physical implementation in context of concurrent mixed-signal design and for handling advanced node physical effects. The book contains many practical examples of models and techniques. The authors believe it should serve as a reference to many analog, digital and mixed-signal designers, verification, physical implementation engineers and managers in their pursuit of information for a better methodology required to address the challenges of modern mixed-signal design.

Author: Lars W. Liebmann
Publisher: SPIE-International Society for Optical Engineering
ISBN:
Category : Business & Economics
Languages : en
Pages : 336

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Book Description
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.