Author: Brenda Haendler
Publisher:
ISBN:
Category :
Languages : en
Pages : 114
Book Description
Liquid to Vapor Phase Change in Constant Cross-section Silicon Microchannels
Author: Brenda Haendler
Publisher:
ISBN:
Category :
Languages : en
Pages : 114
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 114
Book Description
Silicon Microchannel Heat Sinks
Author: Lian Zhang
Publisher: Springer Science & Business Media
ISBN: 3662098997
Category : Technology & Engineering
Languages : en
Pages : 148
Book Description
Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.
Publisher: Springer Science & Business Media
ISBN: 3662098997
Category : Technology & Engineering
Languages : en
Pages : 148
Book Description
Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase-flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 nm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes.
Heat Transfer and Fluid Flow in Minichannels and Microchannels
Author: Satish Kandlikar
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Publisher: Elsevier
ISBN: 9780080445274
Category : Science
Languages : en
Pages : 492
Book Description
&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
Heat Convection in Micro Ducts
Author: Yitshak Zohar
Publisher: Springer Science & Business Media
ISBN: 147573607X
Category : Science
Languages : en
Pages : 210
Book Description
As the field of Microsystems expands into more disciplines and new applications such as RF-MEMS, Optical MEMS and Bio-MEMS, thermal management is becoming a critical issue in the operation of many microdevices, including microelectronic chips. Heat Convection in Micro Ducts focuses on the fundamental physics of convective heat transfer in microscale and specific applications such as: microchannel heat sinks, micro heat pipes, microcoolers and micro capillary pumped loops. This book will be of interest to the professional engineer and graduate student interested in learning about heat removal and temperature control in advanced integrated circuits and microelectromechanical systems.
Publisher: Springer Science & Business Media
ISBN: 147573607X
Category : Science
Languages : en
Pages : 210
Book Description
As the field of Microsystems expands into more disciplines and new applications such as RF-MEMS, Optical MEMS and Bio-MEMS, thermal management is becoming a critical issue in the operation of many microdevices, including microelectronic chips. Heat Convection in Micro Ducts focuses on the fundamental physics of convective heat transfer in microscale and specific applications such as: microchannel heat sinks, micro heat pipes, microcoolers and micro capillary pumped loops. This book will be of interest to the professional engineer and graduate student interested in learning about heat removal and temperature control in advanced integrated circuits and microelectromechanical systems.
Integrated Interconnect Technologies for 3D Nanoelectronic Systems
Author: Muhannad S. Bakir
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551
Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551
Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Electromagnetic Generators for Portable Power Applications
Author: Matthew Kurt Senesky
Publisher:
ISBN:
Category :
Languages : en
Pages : 390
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 390
Book Description
Applied Mechanics Reviews
Author:
Publisher:
ISBN:
Category : Mechanical engineering
Languages : en
Pages : 604
Book Description
Publisher:
ISBN:
Category : Mechanical engineering
Languages : en
Pages : 604
Book Description
Compact Heat Exchangers
Author: Alexander Louis London
Publisher: CRC Press
ISBN: 9781560320128
Category : Heat exchangers
Languages : en
Pages : 798
Book Description
Heat exchangers are a crucial part of aerospace, marine, cryogenic and refrigeration technology. These essays cover such topics as complicated flow arrangements, complex extended surfaces, two-phase flow and irreversibility in heat exchangers, and single-phase heat transfer.
Publisher: CRC Press
ISBN: 9781560320128
Category : Heat exchangers
Languages : en
Pages : 798
Book Description
Heat exchangers are a crucial part of aerospace, marine, cryogenic and refrigeration technology. These essays cover such topics as complicated flow arrangements, complex extended surfaces, two-phase flow and irreversibility in heat exchangers, and single-phase heat transfer.
VDI Heat Atlas
Author: VDI Gesellschaft
Publisher: Springer Science & Business Media
ISBN: 3540778764
Category : Science
Languages : en
Pages : 1608
Book Description
For more than 50 years, the Springer VDI Heat Atlas has been an indispensable working means for engineers dealing with questions of heat transfer. Featuring 50% more content, this new edition covers most fields of heat transfer in industrial and engineering applications. It presents the interrelationships between basic scientific methods, experimental techniques, model-based analysis and their transfer to technical applications.
Publisher: Springer Science & Business Media
ISBN: 3540778764
Category : Science
Languages : en
Pages : 1608
Book Description
For more than 50 years, the Springer VDI Heat Atlas has been an indispensable working means for engineers dealing with questions of heat transfer. Featuring 50% more content, this new edition covers most fields of heat transfer in industrial and engineering applications. It presents the interrelationships between basic scientific methods, experimental techniques, model-based analysis and their transfer to technical applications.
Journal of Thermophysics and Heat Transfer
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 1238
Book Description
This journal is devoted to the advancement of the science and technology of thermophysics and heat transfer through the dissemination of original research papers disclosing new technical knowledge and exploratory developments and applications based on new knowledge. It publishes papers that deal with the properties and mechanisms involved in thermal energy transfer and storage in gases, liquids, and solids or combinations thereof. These studies include conductive, convective, and radiative modes alone or in combination and the effects of the environment.
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 1238
Book Description
This journal is devoted to the advancement of the science and technology of thermophysics and heat transfer through the dissemination of original research papers disclosing new technical knowledge and exploratory developments and applications based on new knowledge. It publishes papers that deal with the properties and mechanisms involved in thermal energy transfer and storage in gases, liquids, and solids or combinations thereof. These studies include conductive, convective, and radiative modes alone or in combination and the effects of the environment.