Liquid-phase-deposited High Dielectric Barium-Doped Titanium Oxide for AlGaN/GaN Metal-Oxide-Semiconductor High Electron Mobility Transistor Applications PDF Download
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Author: 林茂森
Publisher:
ISBN:
Category :
Languages : en
Pages : 142
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Book Description
Author: 林茂森
Publisher:
ISBN:
Category :
Languages : en
Pages : 142
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Book Description
Author: 邱處安
Publisher:
ISBN:
Category :
Languages : en
Pages : 59
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Book Description
Author: Jung Hwan Yum
Publisher:
ISBN:
Category :
Languages : en
Pages : 226
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Book Description
The continuous improvement in the semiconductor industry has been successfully achieved by the reducing dimensions of CMOS (complementary metal oxide semiconductor) technology. For the last four decades, the scaling down of physical thickness of SiO2 gate dielectrics has improved the speed of output drive current by shrinking of transistor area in front-end-process of integrated circuits. A higher number of transistors on chip resulting in faster speed and lower cost can be allowable by the scaling down and these fruitful achievements have been mainly made by the thinning thickness of one key component - Gate Dielectric - at Si based MOSFET (metal-oxide-semiconductor field effect transistor) devices. So far, SiO2 (silicon dioxide) gate dielectric having the excellent material and electrical properties such as good interface (i.e., Dit ~ 2x1010 eV−1cm−2), low gate leakage current, higher dielectric breakdown immunity (≥10MV/cm) and excellent thermal stability at typical Si processing temperature has been popularly used as the leading gate oxide material. The next generation Si based MOSFETs will require more aggressive gate oxide scaling to meet the required specifications. Since high-k dielectrics provide the same capacitance with a thicker film, the leakage current reduction, therefore, less the standby power consumption is one of the huge advantages. Also, it is easier to fabricate during the process because the control of film thickness is still not in the critical range compared to the same leakage current characteristic of SiO2 film. HfO2 based gate dielectric is considered as the most promising candidate among materials being studied since it shows good characteristics with conventional Si technology and good device performance has been reported. However, it has still many problems like insufficient thermals stability on silicon such as low crystallization temperature, low k interfacial regrowth, charge trapping and so on. The integration of hafnium based high-k dielectric into CMOS technology is also limited by major issues such as degraded channel mobility and charge trapping. One approach to overcome these obstacles is using alternative substrate materials such as SiGe, GaAs, InGaAs, and InP to improve channel mobility. High electron mobility in the III-V materials has attracted significant attention for a possible application as a channel material in metal/oxide/semiconductor (MOS) transistors. One of the main challenges is that III-V MOSFETs generally lack thermodynamically stable insulators of high electrical quality, which would passivate the interface states at the dielectric/substrate interface and unpin the Fermi level. To address this issue, various dielectric, such as Si/SiO2, Ge, SiGe, SiN and Al2O3, were considered as an interface passivation layer (IPL). Atomic Layer Deposited (ALD) Al2O3 has demonstrated superior IPL characteristics compared to the other candidates due to its high dielectric constant and interface quality. However, defect density in Al2O3 is still too high even as several cleaning methods such as NH4OH, (NH4)2S and F treatment have been developed, which limits the performance of III-V MOSFETs. In the first part of this study, theoretical approaches to understand the motivation and requirements as an high-k gate dielectric or interfacial layer, and properties of ALD beryllium oxide (BeO) for Si and III-V MOS devices have been investigated. The second part of this study focuses on the precursor synthesis and fundamental material characterization of ALD BeO thin film using physical, optical and electrical analysis. Film properties such as self-cleaning reaction and oxygen diffusion barrier will be presented. At the third part, depletion mode transistor and self-aligned MOSFETs using ALD BeO on Si and InP high mobility substrates have been investigated. And as for the final part of this study, the density functional theory of Be(CH3)2 precursor, electromagnetics, and thermodynamics were investigated to understand the reaction mechanism and self-cleaning reaction, and to evaluate the gate dielectrics such as Al2O3, BeO, SiO2, and HfO2.
Author: Asim K. Ray
Publisher: John Wiley & Sons
ISBN: 1119529476
Category : Technology & Engineering
Languages : en
Pages : 628
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Book Description
Oxide Electronics Multiple disciplines converge in this insightful exploration of complex metal oxides and their functions and properties Oxide Electronics delivers a broad and comprehensive exploration of complex metal oxides designed to meet the multidisciplinary needs of electrical and electronic engineers, physicists, and material scientists. The distinguished author eschews complex mathematics whenever possible and focuses on the physical and functional properties of metal oxides in each chapter. Each of the sixteen chapters featured within the book begins with an abstract and an introduction to the topic, clear explanations are presented with graphical illustrations and relevant equations throughout the book. Numerous supporting references are included, and each chapter is self-contained, making them perfect for use both as a reference and as study material. Readers will learn how and why the field of oxide electronics is a key area of research and exploitation in materials science, electrical engineering, and semiconductor physics. The book encompasses every application area where the functional and electronic properties of various genres of oxides are exploited. Readers will also learn from topics like: Thorough discussions of High-k gate oxide for silicon heterostructure MOSFET devices and semiconductor-dielectric interfaces An exploration of printable high-mobility transparent amorphous oxide semiconductors Treatments of graphene oxide electronics, magnetic oxides, ferroelectric oxides, and materials for spin electronics Examinations of the calcium aluminate binary compound, perovoksites for photovoltaics, and oxide 2Degs Analyses of various applications for oxide electronics, including data storage, microprocessors, biomedical devices, LCDs, photovoltaic cells, TFTs, and sensors Suitable for researchers in semiconductor technology or working in materials science, electrical engineering, and physics, Oxide Electronics will also earn a place in the libraries of private industry researchers like device engineers working on electronic applications of oxide electronics. Engineers working on photovoltaics, sensors, or consumer electronics will also benefit from this book.
Author: Zhong Lin Wang
Publisher: Springer Science & Business Media
ISBN: 364234237X
Category : Technology & Engineering
Languages : en
Pages : 254
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Book Description
The fundamental principle of piezotronics and piezo-phototronics were introduced by Wang in 2007 and 2010, respectively. Due to the polarization of ions in a crystal that has non-central symmetry in materials, such as the wurtzite structured ZnO, GaN and InN, a piezoelectric potential (piezopotential) is created in the crystal by applying a stress. Owing to the simultaneous possession of piezoelectricity and semiconductor properties, the piezopotential created in the crystal has a strong effect on the carrier transport at the interface/junction. Piezotronics is for devices fabricated using the piezopotential as a “gate” voltage to control charge carrier transport at a contact or junction. The piezo-phototronic effect uses the piezopotential to control the carrier generation, transport, separation and/or recombination for improving the performance of optoelectronic devices, such as photon detector, solar cell and LED. The functionality offered by piezotroics and piezo-phototronics are complimentary to CMOS technology. There is an effective integration of piezotronic and piezo-phototronic devices with silicon based CMOS technology. Unique applications can be found in areas such as human-computer interfacing, sensing and actuating in nanorobotics, smart and personalized electronic signatures, smart MEMS/NEMS, nanorobotics and energy sciences. This book introduces the fundamentals of piezotronics and piezo-phototronics and advanced applications. It gives guidance to researchers, engineers and graduate students.
Author: Peter W. Epperlein
Publisher: John Wiley & Sons
ISBN: 1118481860
Category : Technology & Engineering
Languages : en
Pages : 522
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Book Description
This reference book provides a fully integrated novel approach to the development of high-power, single-transverse mode, edge-emitting diode lasers by addressing the complementary topics of device engineering, reliability engineering and device diagnostics in the same book, and thus closes the gap in the current book literature. Diode laser fundamentals are discussed, followed by an elaborate discussion of problem-oriented design guidelines and techniques, and by a systematic treatment of the origins of laser degradation and a thorough exploration of the engineering means to enhance the optical strength of the laser. Stability criteria of critical laser characteristics and key laser robustness factors are discussed along with clear design considerations in the context of reliability engineering approaches and models, and typical programs for reliability tests and laser product qualifications. Novel, advanced diagnostic methods are reviewed to discuss, for the first time in detail in book literature, performance- and reliability-impacting factors such as temperature, stress and material instabilities. Further key features include: practical design guidelines that consider also reliability related effects, key laser robustness factors, basic laser fabrication and packaging issues; detailed discussion of diagnostic investigations of diode lasers, the fundamentals of the applied approaches and techniques, many of them pioneered by the author to be fit-for-purpose and novel in the application; systematic insight into laser degradation modes such as catastrophic optical damage, and a wide range of technologies to increase the optical strength of diode lasers; coverage of basic concepts and techniques of laser reliability engineering with details on a standard commercial high power laser reliability test program. Semiconductor Laser Engineering, Reliability and Diagnostics reflects the extensive expertise of the author in the diode laser field both as a top scientific researcher as well as a key developer of high-power highly reliable devices. With invaluable practical advice, this new reference book is suited to practising researchers in diode laser technologies, and to postgraduate engineering students.
Author: M Razeghi
Publisher: Elsevier
ISBN: 9780080444260
Category : Science
Languages : en
Pages : 602
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Book Description
Tremendous progress has been made in the last few years in the growth, doping and processing technologies of the wide bandgap semiconductors. As a result, this class of materials now holds significant promis for semiconductor electronics in a broad range of applications. The principal driver for the current revival of interest in III-V Nitrides is their potential use in high power, high temperature, high frequency and optical devices resistant to radiation damage. This book provides a wide number of optoelectronic applications of III-V nitrides and covers the entire process from growth to devices and applications making it essential reading for those working in the semiconductors or microelectronics. Broad review of optoelectronic applications of III-V nitrides
Author: E. H. Nicollian
Publisher: John Wiley & Sons
ISBN: 047143079X
Category : Technology & Engineering
Languages : en
Pages : 928
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Book Description
Explains the theoretical and experimental foundations of the measurement of the electrical properties of the MOS system and the technology for controlling its properties. Emphasizes the silica and the silica-silicon interface. Provides a critical assessment of the literature, corrects incomplete or incorrect theoretical formulations, and gives critical comparisons of measurement methods. Contains information needed to grow an oxide, make an MOS capacitor array, and fabricate an integrated circuit with optimal performance and stability.
Author: Reza Ghodssi
Publisher: Springer Science & Business Media
ISBN: 0387473181
Category : Technology & Engineering
Languages : en
Pages : 1211
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Book Description
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
Author: George Gibbs
Publisher:
ISBN: 9781681176437
Category :
Languages : en
Pages : 284
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Book Description
Silicon (Si) is by far the most widely used semiconductor material for power devices. On the other hand, Si-based power devices are approaching their material limits, which has provoked a lot of efforts to find alternatives to Si-based power devices for better performance. With the rapid innovations and developments in the semiconductor industry, Silicon Carbide (SiC) power devices have progressed from immature prototypes in laboratories to a viable alternative to Si-based power devices in high-efficiency and high-power density applications. SiC devices have numerous persuasive advantages--high-breakdown voltage, high-operating electric field, high-operating temperature, high-switching frequency and low losses. Silicon Carbide (SiC) devices belong to the so-called wide band gap semiconductor group, which offers a number of attractive characteristics for high voltage power semiconductors when compared to commonly used silicon (Si). Recently, some SiC power devices, for example, Schottky-barrier diodes (SBDs), metal-oxide-semiconductor field-effecttransistors (MOSFETs), junction FETs (JFETs), and their integrated modules have come onto the market. Physics and Technology of Silicon Carbide Devices abundantly describes recent technologies on manufacturing, processing, characterization, modeling, etc. for SiC devices.
