Author: ASM International
Publisher:
ISBN: 9781627083331
Category :
Languages : en
Pages : 396
Book Description
The International Symposium for Testing and Failure Analysis is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques. ASM International and EDFAS has made the very difficult decision to cancel ISTFA 2020, that was scheduled for November 15-19, 2020 in Pasadena, California due to Covid -19 restrictions. This ISTFA 2020 publication includes the papers that were accepted for the planned 2020 conference. The theme of the planned conference was The Rise of MEMS (Microelectromechanical Systems) and 3D Failure Analysis. ISTFA 2021 will take place October 31- November 4, 2021 in Phoenix, Arizona.
ISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher:
ISBN: 9781627083331
Category :
Languages : en
Pages : 396
Book Description
The International Symposium for Testing and Failure Analysis is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques. ASM International and EDFAS has made the very difficult decision to cancel ISTFA 2020, that was scheduled for November 15-19, 2020 in Pasadena, California due to Covid -19 restrictions. This ISTFA 2020 publication includes the papers that were accepted for the planned 2020 conference. The theme of the planned conference was The Rise of MEMS (Microelectromechanical Systems) and 3D Failure Analysis. ISTFA 2021 will take place October 31- November 4, 2021 in Phoenix, Arizona.
Publisher:
ISBN: 9781627083331
Category :
Languages : en
Pages : 396
Book Description
The International Symposium for Testing and Failure Analysis is the premier event for scientists and engineers who work to evaluate failures and improve the performance and reliability of semiconductor devices and processing techniques. ASM International and EDFAS has made the very difficult decision to cancel ISTFA 2020, that was scheduled for November 15-19, 2020 in Pasadena, California due to Covid -19 restrictions. This ISTFA 2020 publication includes the papers that were accepted for the planned 2020 conference. The theme of the planned conference was The Rise of MEMS (Microelectromechanical Systems) and 3D Failure Analysis. ISTFA 2021 will take place October 31- November 4, 2021 in Phoenix, Arizona.
ISTFA 2014
Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
ISBN: 1627080996
Category : Technology & Engineering
Languages : en
Pages : 593
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
Publisher: ASM International
ISBN: 1627080996
Category : Technology & Engineering
Languages : en
Pages : 593
Book Description
The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.
ISTFA 2017: Proceedings from the 43rd International Symposium for Testing and Failure Analysis
Author: ASM International
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666
Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Publisher: ASM International
ISBN: 1627081518
Category : Technology & Engineering
Languages : en
Pages : 666
Book Description
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
ISTFA 2014
Author:
Publisher:
ISBN: 9781680155143
Category : Electronic apparatus and appliances
Languages : en
Pages : 560
Book Description
Publisher:
ISBN: 9781680155143
Category : Electronic apparatus and appliances
Languages : en
Pages : 560
Book Description
ISTFA 2013
Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080228
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Publisher: ASM International
ISBN: 1627080228
Category : Technology & Engineering
Languages : en
Pages : 634
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
ISTFA 2010
Author:
Publisher: ASM International
ISBN: 9781615030415
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
This volume features research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Publisher: ASM International
ISBN: 9781615030415
Category : Technology & Engineering
Languages : en
Pages : 0
Book Description
This volume features research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
ISTFA 2009
Author:
Publisher: ASM International
ISBN: 1615030921
Category : Technology & Engineering
Languages : en
Pages : 371
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Publisher: ASM International
ISBN: 1615030921
Category : Technology & Engineering
Languages : en
Pages : 371
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Istfa 2003
Author: ASM International
Publisher: ASM International
ISBN: 1615030867
Category : Technology & Engineering
Languages : en
Pages : 534
Book Description
Publisher: ASM International
ISBN: 1615030867
Category : Technology & Engineering
Languages : en
Pages : 534
Book Description
ISTFA 2012
Author: ASM International
Publisher:
ISBN: 9781615039791
Category : Electronic apparatus and appliances
Languages : en
Pages : 620
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Publisher:
ISBN: 9781615039791
Category : Electronic apparatus and appliances
Languages : en
Pages : 620
Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.