ISTFA 2007 Proceedings of the 33rd International Symposium for Testing and Failure Analysis PDF Download
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Author: ASM International
Publisher: ASM International
ISBN: 1615030905
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author: ASM International
Publisher: ASM International
ISBN: 1615030905
Category : Technology & Engineering
Languages : en
Pages : 372
Get Book Here
Book Description
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author: ASM International
Publisher: ASM International(OH)
ISBN: 9780871708632
Category : Technology & Engineering
Languages : en
Pages : 356
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Book Description
Printbegrænsninger: Der kan printes 10 sider ad gangen og max. 40 sider pr. session
Author:
Publisher: ASM International
ISBN: 1615030921
Category : Technology & Engineering
Languages : en
Pages : 371
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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Author: ASM International
Publisher: ASM International
ISBN: 1615030913
Category : Electronic apparatus and appliances
Languages : en
Pages : 551
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Book Description
Author:
Publisher: ASM International
ISBN: 1615038507
Category : Technology & Engineering
Languages : en
Pages : 479
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Book Description
Author: A. S. M. International
Publisher: ASM International
ISBN: 1627080740
Category : Technology & Engineering
Languages : en
Pages : 561
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Book Description
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.
Author: Tejinder Gandhi
Publisher: ASM International
ISBN: 1627082468
Category : Technology & Engineering
Languages : en
Pages : 719
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Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Author:
Publisher: ASM International
ISBN: 1615037276
Category : Technology & Engineering
Languages : en
Pages : 487
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Book Description
Author: ASM International
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
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Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: Mark Tehranipoor
Publisher: CRC Press
ISBN: 1351965905
Category : Computers
Languages : en
Pages : 401
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Book Description
The research community lacks both the capability to explain the effectiveness of existing techniques and the metrics to predict the security properties and vulnerabilities of the next generation of nano-devices and systems. This book provides in-depth viewpoints on security issues and explains how nano devices and their unique properties can address the opportunities and challenges of the security community, manufacturers, system integrators, and end users. This book elevates security as a fundamental design parameter, transforming the way new nano-devices are developed. Part 1 focuses on nano devices and building security primitives. Part 2 focuses on emerging technologies and integrations.
