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Author: Edwin Bradley
Publisher: John Wiley & Sons
ISBN: 9780470171462
Category : Technology & Engineering
Languages : en
Pages : 472
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Book Description
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Author: Edwin Bradley
Publisher: John Wiley & Sons
ISBN: 9780470171462
Category : Technology & Engineering
Languages : en
Pages : 472
Get Book Here
Book Description
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Author:
Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 744
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Book Description
The management magazine for the electronics industry.
Author: Gregory Henshall
Publisher: John Wiley & Sons
ISBN: 1118102746
Category : Technology & Engineering
Languages : en
Pages : 241
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Book Description
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Author: United States. Congress. House. Committee on Financial Services. Subcommittee on International Monetary Policy and Trade
Publisher:
ISBN:
Category : Economic sanctions, American
Languages : en
Pages : 390
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Book Description
Author: Anthony Tarantino
Publisher: John Wiley & Sons
ISBN: 0470245557
Category : Business & Economics
Languages : en
Pages : 1123
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Book Description
Providing a comprehensive framework for a sustainable governance model, and how to leverage it in competing global markets, Governance, Risk, and Compliance Handbook presents a readable overview to the political, regulatory, technical, process, and people considerations in complying with an ever more demanding regulatory environment and achievement of good corporate governance. Offering an international overview, this book features contributions from sixty-four industry experts from fifteen countries.
Author: Xiu-Tian Yan
Publisher: Springer Science & Business Media
ISBN: 1848002394
Category : Technology & Engineering
Languages : en
Pages : 870
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Book Description
Recent rapid globalisation of manufacturing industries leads to a drive and thirst for rapid advancements in technological development and expertise in the fields of advanced design and manufacturing, especially at their interfaces. This development results in many economical benefits to and improvement of quality of life for many people all over the world. Technically speaking, this rapid development also create many opportunities and challenges for both industrialists and academics, as the design requirements and constraints have completely changed in this global design and manufacture environment. Consequently the way to design, manufacture and realise products have changed as well. The days of designing for a local market and using local suppliers in manufacturing have gone, if enterprises aim to maintain their competitiveness and global expansion leading to further success. In this global context and scenario, both industry and the academia have an urgent need to equip themselves with the latest knowledge, technology and methods developed for engineering design and manufacture. To address this shift in engineering design and manufacture, supported by the European Commission under the Asia Link Programme with a project title FASTAHEAD (A Framework Approach to Strengthening Asian Higher Education in Advanced Design and Manufacture), three key project partners, namely the University of Strathclyde of the United Kingdom, Northwestern Polytechncial University of China, and the Troyes University of Technology of France organised a third international conference.
Author:
Publisher: Business & Legal Reports, Inc.
ISBN: 1556456271
Category :
Languages : en
Pages : 24
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Book Description
Author:
Publisher:
ISBN:
Category : Offshore assembly industry
Languages : en
Pages : 68
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Book Description
Author: Hwaiyu Geng
Publisher: McGraw Hill Professional
ISBN: 007183978X
Category : Technology & Engineering
Languages : en
Pages : 624
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Book Description
The new edition of this professional resource reveals how to optimize all aspects of the global manufacturing process to build the highest quality goods at the lowest price in the shortest possible time. How can one apply technical and business knowledge to develop a strategic plan that delivers increased productivity, quality, sustainability, reliability, agility, resilience, and best practices with rapid time to production and value? The answers are found in the fully updated new edition of Manufacturing Engineering Handbook. The goal of this second edition is to provide the essential knowledge needed to build products with the highest quality at the lowest cost in the least amount of time by optimizing all aspects of the manufacturing process—design, development, tools, processes, quality, speed, output, safety, and sustainability. You will gain access to information on conventional and modern technologies, manufacturing processes, and operations management that will assist you in achieving these goals. The book is written by a team of more than 100 internationally renowned manufacturing engineering experts, and pared down from its original 1200 pages. The new and vastly improved second edition is specifically designed to concisely and succinctly cover traditional manufacturing processes and advanced technologies as well as newer manufacturing software and systems to integrate them into the modern, global manufacturing world. Brand-new chapters on: eco-design and sustainability; nano materials and nano manufacturing; facilities planning; operations research New sections on plastics, composites, and moldmaking; global manufacturing and supply chain management Increased coverage of Design for Six Sigma and adaptive manufacturing Affiliated web site with color illustrations, graphs, charts, discussions on future trends, additional technical papers, and suggestions for further reading
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 290
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Book Description
