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Author: F. H. Eisen
Publisher:
ISBN:
Category :
Languages : en
Pages : 22
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Book Description
This report presents the first quarter results of a program designed to develop a planar process technology for GaAs integrated circuits. Planar structures will be achieved by ion implantation into localized areas of semi-insulating substrates to form device areas with proper electrical characteristics. Caltech, Cornell University, and Crystal Specialties, Inc. are subcontractors in this program. In bulk crystal growth, progress in eliminating causes of boat wetting has led to a more stable substrate fabrication process with 65% yield. Keywords: Semi-insulating GaAs; Ion implantation, IC, and Integrated circuits.
Author: F. H. Eisen
Publisher:
ISBN:
Category :
Languages : en
Pages : 22
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Book Description
This report presents the first quarter results of a program designed to develop a planar process technology for GaAs integrated circuits. Planar structures will be achieved by ion implantation into localized areas of semi-insulating substrates to form device areas with proper electrical characteristics. Caltech, Cornell University, and Crystal Specialties, Inc. are subcontractors in this program. In bulk crystal growth, progress in eliminating causes of boat wetting has led to a more stable substrate fabrication process with 65% yield. Keywords: Semi-insulating GaAs; Ion implantation, IC, and Integrated circuits.
Author: F. H. Eisen
Publisher:
ISBN:
Category :
Languages : en
Pages : 67
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Book Description
This report covers the sixth quarter, Phase II of a program on ion implanted planar GaAs integrated circuit technology. The bulk of the work on this program is carried out at the Rockwell International Electronics Research Center (ERC). Significant assistance is provided by three subcontractors; Crystal Specialties Inc. in crystal growth, California Institute of Technology in ion implantation and related materials technologies, and Cornell University in device modeling. With MSI circuit complexity well demonstrated, the circuit developement work in this quarter was focused on the testing of MSI/LSI circuits (250-500 gates), and on the design of an LSI circuit (1000 gates). The preliminary data from the MSI/LSI circuits (from mask set AR4) are promising. Although the 5X5 but parallel multiplier (260 gates) did not operate completely and did not function at its predicted speed, the test data indicate that it can meet the design expectations when a mask error (a missing connection on 16 gates) is corrected. The 2 X 32 stage shift register (550 gates) has functioned up to 33 stages involving approximately 300 gates. Further testing is scheduled. An 8 X 8 bit parallel multiplier (1008 gates) has been designed, layed out, and the mask set containing this circuit is being fabricated. Keywords: Semi insulating, Ion implantation, Integrated circuits, High speed logic, Gallium arsenides.
Author: Emanuele Rimini
Publisher: Springer Science & Business Media
ISBN: 1461522595
Category : Technology & Engineering
Languages : en
Pages : 400
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Book Description
Ion implantation offers one of the best examples of a topic that starting from the basic research level has reached the high technology level within the framework of microelectronics. As the major or the unique procedure to selectively dope semiconductor materials for device fabrication, ion implantation takes advantage of the tremendous development of microelectronics and it evolves in a multidisciplinary frame. Physicists, chemists, materials sci entists, processing, device production, device design and ion beam engineers are all involved in this subject. The present monography deals with several aspects of ion implantation. The first chapter covers basic information on the physics of devices together with a brief description of the main trends in the field. The second chapter is devoted to ion im planters, including also high energy apparatus and a description of wafer charging and contaminants. Yield is a quite relevant is sue in the industrial surrounding and must be also discussed in the academic ambient. The slowing down of ions is treated in the third chapter both analytically and by numerical simulation meth ods. Channeling implants are described in some details in view of their relevance at the zero degree implants and of the available industrial parallel beam systems. Damage and its annealing are the key processes in ion implantation. Chapter four and five are dedicated to this extremely important subject.
Author: R. Zucca
Publisher:
ISBN:
Category :
Languages : en
Pages : 71
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Book Description
This report covers the fourth quarter of a program on LSI/VLSI ion implanted planar GaAs integrated circuit processing. The goal of this program is to realize the full potential of GaAs digital integrated circuits employing depletion mode MESFETs by developing the necessary processing methods and material capabilities to extend device complexity to VLSI. In the fourth quarter fabrication of the first wafers with mask set AR6, the last mask set to be employed with one inch wafers, was completed. Work on circuit reliability has continued, while process steps that may be limiting circuit yield are being investigated.
Author: Susumu Namba
Publisher: Springer Science & Business Media
ISBN: 1468421514
Category : Science
Languages : en
Pages : 716
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Book Description
The technique of ion implantation has become a very useful and stable technique in the field of semiconductor device fabrication. This use of ion implantation is being adopted by industry. Another important application is the fundamental study of the physical properties of materials. The First Conference on Ion Implantation in Semiconductors was held at Thousand Oaks, California in 1970. The second conference in this series was held at Garmish-Partenkirchen, Germany, in 1971. At the third conference, which convened at Yorktown Heights, New York in 1973, the emphasis was broadened to include metals and insulators as well as semiconductors. This scope of the conference was still accepted at the fourth conference which was held at Osaka, Japan, in 1974. A huge number of papers had been submitted to this conference. All papers which were presented at the Fourth International Conference on Ion Implantation in Semiconductors and Other Materials are included in this proceedings. The success of this conference was due to technical presentations and discussions of 224 participants from 14 countries as well as to financial support from many companies in Japan. On behalf of the committee, I wish to thank the authors for their excellent papers and the sponsors for their financial support. The International Committee responsible for advising this conference consisted of B.L. Crowder, J.A. Davies, G. Dearna1ey, F.H. Eisen, Ph. G1otin, T. Itoh, A.U. MacRae, J.W. Mayer, S. Namba, I. Ruge, and F.L. Vook.
Author: R. R. Zucca
Publisher:
ISBN:
Category :
Languages : en
Pages : 147
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Book Description
This report covers a program designed to realize the full potential of GaAs integrated circuits by expanding and improving fabrication and material techniques. The main accomplishment of the program was the successful implementation of the fabrication of integrated circuits on 3-inch diameter GaAs wafers. In addition, this program covered many activities related to GaAs IC processing. These include: work on semi-insulating material growth and characterization, investigation of ion implantation techniques (work carried out at the California Institute of Technology); evaluation of device uniformity, and investigation of its controlling factors; investigation of metallization yield and reliability, and improvements of processing techniques resulting from this study; design and testing of a multiplier and programmable shift registers/pattern generators; evaluation of mask programmable logic arrays to meet ERADCOMs needs for high performance communication systems; investigation of the hardness of GaAs ICs to total dose and transient ionizing radiation, and modelling of MESFET devices (this work carried out at North Carolina State University). (Author).
Author: J. S. Williams
Publisher: Academic Press
ISBN: 1483220648
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
Ion Implantation and Beam Processing covers the scientific and technological advances in the fields of ion implantation and beam processing. The book discusses the amorphization and crystallization of semiconductors; the application of the Boltzmann transport equation to ion implantation in semiconductors and multilayer targets; and the high energy density collision cascades and spike effects. The text also describes the implantation of insulators (ices and lithographic materials); the ion-bombardment-induced compositions changes in alloys and compounds; and the fundamentals and applications of ion beam and laser mixing. The high-dose implantation and the trends of ion implantation in silicon technology are also considered. The book further tackles the implantation in gaAs technology and the contacts and interconnections on semiconductors. Engineers and people involved in microelectronics will find the book invaluable.
Author: Milton L. Cone
Publisher:
ISBN:
Category :
Languages : en
Pages : 135
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Book Description
The unique properties of GaAs make it possible to construct integrated circuit devices that are impossible in Si. The Air Force Avionics Laboratory/AADR has been developing this technology for a number of years. The difficulty of introducing dopants by diffusion has lead ion implantation to play an increasing role in the fabrication process. The present production technique for high performance devices is to fabricate large quantities and select those few that meet the desired specifications. Having a nondestructive technique that can be used to characterize the implantation process during fabrication of the device so as to reject faulty device structures can save valuable time as well as money. Depth-resolved cathodoluminescence is a process that can be used for this purpose. This research develops and verifies a model of cathodoluminescence in ion implanted GaAs. This model can now be used as a tool for further study of ion implanted GaAs. This is the first step in developing cathodoluminescence as a tool for deducing the shape of the ion implanted depth profile in semiconductor materials. (Author).
Author: Michael Nastasi
Publisher: Springer Science & Business Media
ISBN: 3540452982
Category : Science
Languages : en
Pages : 271
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Book Description
Ion implantation is one of the key processing steps in silicon integrated circuit technology. Some integrated circuits require up to 17 implantation steps and circuits are seldom processed with less than 10 implantation steps. Controlled doping at controlled depths is an essential feature of implantation. Ion beam processing can also be used to improve corrosion resistance, to harden surfaces, to reduce wear and, in general, to improve materials properties. This book presents the physics and materials science of ion implantation and ion beam modification of materials. It covers ion-solid interactions used to predict ion ranges, ion straggling and lattice disorder. Also treated are shallow-junction formation and slicing silicon with hydrogen ion beams. Topics important for materials modification, such as ion-beam mixing, stresses, and sputtering, are also described.
Author: Billy Crowder
Publisher: Springer Science & Business Media
ISBN: 146842064X
Category : Science
Languages : en
Pages : 644
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Book Description
During the years since the first conference in this series was held at Thousand Oaks, California, in 1970, ion implantation has been an expanding and exciting research area. The advances in this field were so rapid that a second conference convened at Garmisch Partenkirchen, Germany, in 1971. At the present time, our under standing of the ion implantation process in semiconductors such as Si and Ge has reached a stage of maturity and ion implantation techniques are firmly established in semiconductor device technology. The advances in compound semiconductors have not been as rapid. There has also been a shift in emphasis in ion implanta tion research from semiconductors to other materials such as metals and insulators. It was appropriate to increase the scope of the conference and the IIIrd International Conference on Ion Implanta tion in Semiconductors and Other Materials was held at Yorktown Heights, New York, December 11 to 14, 1972. A significant number of the papers presented at this conference dealt with ion implanta tion in metals, insulators, and compound semiconductors. The International Committee responsible for organizing this conference consisted of B. L. Crowder, J. A. Davies, F. H. Eisen, Ph. Glotin, T. Itoh, A. U. MacRae, J. W. Mayer, G. Dearnaley, and I. Ruge. The Conference attracted 180 participants from twelve countries. The success of the Conference was due in large measure to the financial support of our sponsors, Air Force Cambridge Research Laboratories and the Office of Naval Research.
