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Author: Werner Karl Schomburg
Publisher: Springer
ISBN: 3662470233
Category : Technology & Engineering
Languages : en
Pages : 384
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Book Description
This book systematically describes the design options for micro systems as well as the equations needed for calculating the behavior of their basic elements. The fundamental equations needed to calculate the effects and forces that are important in micro systems are also provided. Readers do not require previous knowledge of fabrication processes. This second edition of the volume is a thoroughly revised and extended update. The target audience primarily comprises experts in the field of micro systems and the book is also suitable for graduate engineering students. For quick reference, equations are presented in tables that can be found in an index at the end of the book.
Author: Werner Karl Schomburg
Publisher: Springer
ISBN: 3662470233
Category : Technology & Engineering
Languages : en
Pages : 384
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Book Description
This book systematically describes the design options for micro systems as well as the equations needed for calculating the behavior of their basic elements. The fundamental equations needed to calculate the effects and forces that are important in micro systems are also provided. Readers do not require previous knowledge of fabrication processes. This second edition of the volume is a thoroughly revised and extended update. The target audience primarily comprises experts in the field of micro systems and the book is also suitable for graduate engineering students. For quick reference, equations are presented in tables that can be found in an index at the end of the book.
Author: Stephen D. Senturia
Publisher: Springer Science & Business Media
ISBN: 0306476010
Category : Technology & Engineering
Languages : en
Pages : 699
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Book Description
It is a real pleasure to write the Foreword for this book, both because I have known and respected its author for many years and because I expect this book’s publication will mark an important milestone in the continuing worldwide development of microsystems. By bringing together all aspects of microsystem design, it can be expected to facilitate the training of not only a new generation of engineers, but perhaps a whole new type of engineer – one capable of addressing the complex range of problems involved in reducing entire systems to the micro- and nano-domains. This book breaks down disciplinary barriers to set the stage for systems we do not even dream of today. Microsystems have a long history, dating back to the earliest days of mic- electronics. While integrated circuits developed in the early 1960s, a number of laboratories worked to use the same technology base to form integrated sensors. The idea was to reduce cost and perhaps put the sensors and circuits together on the same chip. By the late-60s, integrated MOS-photodiode arrays had been developed for visible imaging, and silicon etching was being used to create thin diaphragms that could convert pressure into an electrical signal. By 1970, selective anisotropic etching was being used for diaphragm formation, retaining a thick silicon rim to absorb package-induced stresses. Impurity- and electrochemically-based etch-stops soon emerged, and "bulk micromachining" came into its own.
Author: Yufeng Jin
Publisher: CRC Press
ISBN: 1439865973
Category : Technology & Engineering
Languages : en
Pages : 232
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Book Description
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author: Gerald Gerlach
Publisher: John Wiley & Sons
ISBN: 0470770929
Category : Technology & Engineering
Languages : en
Pages : 376
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Book Description
Over half a century after the discovery of the piezoresistive effect, microsystem technology has experienced considerable developments. Expanding the opportunities of microelectronics to non-electronic systems, its number of application fields continues to increase. Microsensors are one of the most important fields, used in medical applications and micromechanics. Microfluidic systems are also a significant area, most commonly used in ink-jet printer heads. This textbook focuses on the essentials of microsystems technology, providing a knowledgeable grounding and a clear path through this well-established scientific dicipline. With a methodical, student-orientated approach, Introduction to Microsystem Technology covers the following: microsystem materials (including silicon, polymers and thin films), and the scaling effects of going micro; fabrication techniques based on different material properties, descriptions of their limitations and functional and shape elements produced by these techniques; sensors and actuators based on elements such as mechanical, fluidic, and thermal (yaw rate sensor components are described); the influence of technology parameters on microsystem properties, asking, for example, when is the function of a microsystem device robust and safe? The book presents problems at the end of each chapter so that you may test your understanding of the key concepts (full solutions for these are given on an accompanying website). Practical examples are included also, as well as case studies that enable a better understanding of the technology as a whole. With its extensive treatment on the fundamentals of microsystem technology, this book also serves as a compendium for engineers and technicians working with microsystem technology.
Author: Swarup Bhunia
Publisher: Elsevier
ISBN: 0323261906
Category : Technology & Engineering
Languages : en
Pages : 337
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Book Description
Research and innovation in areas such as circuits, microsystems, packaging, biocompatibility, miniaturization, power supplies, remote control, reliability, and lifespan are leading to a rapid increase in the range of devices and corresponding applications in the field of wearable and implantable biomedical microsystems, which are used for monitoring, diagnosing, and controlling the health conditions of the human body. This book provides comprehensive coverage of the fundamental design principles and validation for implantable microsystems, as well as several major application areas. Each component in an implantable device is described in details, and major case studies demonstrate how these systems can be optimized for specific design objectives. The case studies include applications of implantable neural signal processors, brain-machine interface (BMI) systems intended for both data recording and treatment, neural prosthesis, bladder pressure monitoring for treating urinary incontinence, implantable imaging devices for early detection and diagnosis of diseases as well as electrical conduction block of peripheral nerve for chronic pain management. Implantable Biomedical Microsystems is the first comprehensive coverage of bioimplantable system design providing an invaluable information source for researchers in Biomedical, Electrical, Computer, Systems, and Mechanical Engineering as well as engineers involved in design and development of wearable and implantable bioelectronic devices and, more generally, teams working on low-power microsystems and their corresponding wireless energy and data links. - First time comprehensive coverage of system-level and component-level design and engineering aspects for implantable microsystems. - Provides insight into a wide range of proven applications and application specific design trade-offs of bioimplantable systems, including several major case studies - Enables Engineers involved in development of implantable electronic systems to optimize applications for specific design objectives.
Author: Eugene C. Nelson
Publisher: John Wiley & Sons
ISBN: 1118046838
Category : Medical
Languages : en
Pages : 507
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Book Description
Quality by Design reflects the research and applied training conducted at Dartmouth Medical School under the leadership of Gene Nelson, Paul Batalden, and Marjorie Godfrey. The book includes the research results of high-performing clinical microsystems, illustrative case studies that highlight individual clinical programs, guiding principles that are easily applied, and tools, techniques, and methods that can be adapted by clinical practices and interdisciplinary clinical teams. The authors describe how to develop microsystems that can attain peak performance through active engagement of interdisciplinary teams in learning and applying improvement science and measurement; explore the essence of leadership for clinical Microsystems; show what mid-level leaders can do to enable peak performance at the front lines of care; outline the design and redesign of services and planning care to match patient needs with services offered; examine the issue of safety; describe the vital role of data in creating a rich and useful information environment; provide a core curriculum that can build microsystems’ capability, provide excellent care, promote a positive work environment, and contribute to the larger organization. Ancillary materials for use in classroom teaching, training, or coaching are available at https://clinicalmicrosystem.org/
Author: Alberto Corigliano
Publisher: John Wiley & Sons
ISBN: 1119053838
Category : Technology & Engineering
Languages : en
Pages : 332
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Book Description
Mechanics of Microsystems Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability Mechanics of Microsystems takes a mechanical approach to microsystems and covers fundamental concepts including MEMS design, modelling and reliability. The book examines the mechanical behaviour of microsystems from a ‘design for reliability’ point of view and includes examples of applications in industry. Mechanics of Microsystems is divided into two main parts. The first part recalls basic knowledge related to the microsystems behaviour and offers an overview on microsystems and fundamental design and modelling tools from a mechanical point of view, together with many practical examples of real microsystems. The second part covers the mechanical characterization of materials at the micro-scale and considers the most important reliability issues (fracture, fatigue, stiction, damping phenomena, etc) which are fundamental to fabricate a real working device. Key features: Provides an overview of MEMS, with special focus on mechanical-based Microsystems and reliability issues. Includes examples of applications in industry. Accompanied by a website hosting supplementary material. The book provides essential reading for researchers and practitioners working with MEMS, as well as graduate students in mechanical, materials and electrical engineering.
Author: Nadim Maluf
Publisher: Artech House
ISBN: 9781580535915
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Bringing you up-to-date with the latest developments in MEMS technology, this major revision of the best-selling An Introduction to Microelectromechanical Systems Engineering offers you a current understanding of this cutting-edge technology. You gain practical knowledge of MEMS materials, design, and manufacturing, and learn how it is being applied in industrial, optical, medical and electronic markets. The second edition features brand new sections on RF MEMS, photo MEMS, micromachining on materials other than silicon, reliability analysis, plus an expanded reference list. With an emphasis on commercialized products, this unique resource helps you determine whether your application can benefit from a MEMS solution, understand how other applications and companies have benefited from MEMS, and select and define a manufacturable MEMS process for your application. You discover how to use MEMS technology to enable new functionality, improve performance, and reduce size and cost. The book teaches you the capabilities and limitations of MEMS devices and processes, and helps you communicate the relative merits of MEMS to your company's management. From critical discussions on design operation and process fabrication of devices and systems, to a thorough explanation of MEMS packaging, this easy-to-understand book clearly explains the basics of MEMS engineering, making it an invaluable reference for your work in the field.
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979
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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: S.G.K. Ananthasuresh
Publisher: Springer Science & Business Media
ISBN: 1461504872
Category : Technology & Engineering
Languages : en
Pages : 326
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Book Description
The field of "microelectromechanical systems," or "MEMS," has gradually evolved from a "discipline" populated by a small group of researchers to an "enabling technology" supporting a variety of products in such diverse areas as mechanical and inertial sensors, optical projection displays, telecommunications equipment, and biology and medicine. Critical to the success of these products is the ability to design them, and this invariably involves detailed modeling of proposed designs. Over the past twenty years, such modeling has become increasingly sophisticated, with full suites of MEMS-oriented computer-aided-design tools now available worldwide. But there is another equally important side to the design process In my own book, Microsystem figuring out what to build in the first place. Design, I chose to emphasize the modeling aspect of design. The task of figuring out what to build was defined by a vague step called "creative thinking." I used practical product examples to illustrate the many subtle characteristics of successful designs, but I made no attempt to systematize the generation ofdesign proposals or optimized designs. That systemization is called "synthesis," which is the subjectofthis book.
