International Integrated Reliability Workshop Final Report PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download International Integrated Reliability Workshop Final Report PDF full book. Access full book title International Integrated Reliability Workshop Final Report by . Download full books in PDF and EPUB format.
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 202
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 202
Get Book Here
Book Description
Author: ASM International
Publisher: ASM International
ISBN: 161503076X
Category : Technology & Engineering
Languages : en
Pages : 453
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 62
Get Book Here
Book Description
Author: Robert Osiander
Publisher: CRC Press
ISBN: 1420027743
Category : Technology & Engineering
Languages : en
Pages : 402
Get Book Here
Book Description
The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere. The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices. Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.
Author: Eishi H. Ibe
Publisher: John Wiley & Sons
ISBN: 1118479297
Category : Technology & Engineering
Languages : en
Pages : 292
Get Book Here
Book Description
This book provides the reader with knowledge on a wide variety of radiation fields and their effects on the electronic devices and systems. The author covers faults and failures in ULSI devices induced by a wide variety of radiation fields, including electrons, alpha-rays, muons, gamma rays, neutrons and heavy ions. Readers will learn how to make numerical models from physical insights, to determine the kind of mathematical approaches that should be implemented to analyze radiation effects. A wide variety of prediction, detection, characterization and mitigation techniques against soft-errors are reviewed and discussed. The author shows how to model sophisticated radiation effects in condensed matter in order to quantify and control them, and explains how electronic systems including servers and routers are shut down due to environmental radiation. Provides an understanding of how electronic systems are shut down due to environmental radiation by constructing physical models and numerical algorithms Covers both terrestrial and avionic-level conditions Logically presented with each chapter explaining the background physics to the topic followed by various modelling techniques, and chapter summary Written by a widely-recognized authority in soft-errors in electronic devices Code samples available for download from the Companion Website This book is targeted at researchers and graduate students in nuclear and space radiation, semiconductor physics and electron devices, as well as other areas of applied physics modelling. Researchers and students interested in how a variety of physical phenomena can be modelled and numerically treated will also find this book to present helpful methods.
Author: Mark Tehranipoor
Publisher: CRC Press
ISBN: 1351965905
Category : Computers
Languages : en
Pages : 401
Get Book Here
Book Description
The research community lacks both the capability to explain the effectiveness of existing techniques and the metrics to predict the security properties and vulnerabilities of the next generation of nano-devices and systems. This book provides in-depth viewpoints on security issues and explains how nano devices and their unique properties can address the opportunities and challenges of the security community, manufacturers, system integrators, and end users. This book elevates security as a fundamental design parameter, transforming the way new nano-devices are developed. Part 1 focuses on nano devices and building security primitives. Part 2 focuses on emerging technologies and integrations.
Author: Samares Kar
Publisher: The Electrochemical Society
ISBN: 1566778220
Category : Science
Languages : en
Pages : 621
Get Book Here
Book Description
The issue of ECS Transactions will cover comprehensively all the aspects of high-k material physics and technology: Diverse High Mobility Substrates, High-k Materials, Metal Gate Electrode Materials, Deposition Techniques, Bulk Material Properties, Flat-Band Voltage Issues and Control, Interfaces, Gate Stack Reliability, Electrical, Chemical, and Physical Chatracterization, Novel Applications, High-k and Diverse Insulators for Photonics, High-k Processing/ Manufacturing.
Author: Souvik Mahapatra
Publisher: Springer
ISBN: 8132225082
Category : Technology & Engineering
Languages : en
Pages : 282
Get Book Here
Book Description
This book aims to cover different aspects of Bias Temperature Instability (BTI). BTI remains as an important reliability concern for CMOS transistors and circuits. Development of BTI resilient technology relies on utilizing artefact-free stress and measurement methods and suitable physics-based models for accurate determination of degradation at end-of-life and understanding the gate insulator process impact on BTI. This book discusses different ultra-fast characterization techniques for recovery artefact free BTI measurements. It also covers different direct measurements techniques to access pre-existing and newly generated gate insulator traps responsible for BTI. The book provides a consistent physical framework for NBTI and PBTI respectively for p- and n- channel MOSFETs, consisting of trap generation and trapping. A physics-based compact model is presented to estimate measured BTI degradation in planar Si MOSFETs having differently processed SiON and HKMG gate insulators, in planar SiGe MOSFETs and also in Si FinFETs. The contents also include a detailed investigation of the gate insulator process dependence of BTI in differently processed SiON and HKMG MOSFETs. The book then goes on to discuss Reaction-Diffusion (RD) model to estimate generation of new traps for DC and AC NBTI stress and Transient Trap Occupancy Model (TTOM) to estimate charge occupancy of generated traps and their contribution to BTI degradation. Finally, a comprehensive NBTI modeling framework including TTOM enabled RD model and hole trapping to predict time evolution of BTI degradation and recovery during and after DC stress for different stress and recovery biases and temperature, during consecutive arbitrary stress and recovery cycles and during AC stress at different frequency and duty cycle. The contents of this book should prove useful to academia and professionals alike.
Author: Shojiro Asai
Publisher: Springer
ISBN: 4431565949
Category : Technology & Engineering
Languages : en
Pages : 792
Get Book Here
Book Description
This book discusses the new roles that the VLSI (very-large-scale integration of semiconductor circuits) is taking for the safe, secure, and dependable design and operation of electronic systems. The book consists of three parts. Part I, as a general introduction to this vital topic, describes how electronic systems are designed and tested with particular emphasis on dependability engineering, where the simultaneous assessment of the detrimental outcome of failures and cost of their containment is made. This section also describes the related research project “Dependable VLSI Systems,” in which the editor and authors of the book were involved for 8 years. Part II addresses various threats to the dependability of VLSIs as key systems components, including time-dependent degradations, variations in device characteristics, ionizing radiation, electromagnetic interference, design errors, and tampering, with discussion of technologies to counter those threats. Part III elaborates on the design and test technologies for dependability in such applications as control of robots and vehicles, data processing, and storage in a cloud environment and heterogeneous wireless telecommunications. This book is intended to be used as a reference for engineers who work on the design and testing of VLSI systems with particular attention to dependability. It can be used as a textbook in graduate courses as well. Readers interested in dependable systems from social and industrial–economic perspectives will also benefit from the discussions in this book.
Author: Michael G. Pecht
Publisher: John Wiley & Sons
ISBN: 1119515351
Category : Technology & Engineering
Languages : en
Pages : 973
Get Book Here
Book Description
An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.
