International Conference on Frontiers of Characterization and Metrology for Nanoelectronics 2017 PDF Download
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Author: E. M. Secula
Publisher:
ISBN: 9781510839113
Category :
Languages : en
Pages :
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Book Description
Author: E. M. Secula
Publisher:
ISBN: 9781510839113
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: E. M. Secula
Publisher:
ISBN:
Category :
Languages : en
Pages :
Get Book Here
Book Description
Author: International Conference on Characterization and Metrology for ULSI Technology (5, 2005, Richardson, Tex.)
Publisher:
ISBN:
Category :
Languages : en
Pages : 141
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Book Description
Author: David G. Seiler
Publisher: American Inst. of Physics
ISBN: 9780735404410
Category : Science
Languages : en
Pages : 0
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Book Description
This book contains peer-reviewed papers presented at the 2007 International Conference on Frontiers of Characterization and Metrology. It emphasizes the frontiers of innovation in the characterization and metrology needed to advance nanoelectronics. It provides an effective portrayal of the industry’s characterization and metrology needs and how they are being addressed. It also offers a foundation for further advances in metrology and new ideas for research and development.
Author:
Publisher: ASM International
ISBN: 1627082735
Category : Technology & Engineering
Languages : en
Pages : 540
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Book Description
The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.
Author: Zhiyong Ma
Publisher: CRC Press
ISBN: 1351733958
Category : Science
Languages : en
Pages : 1454
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Book Description
Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.
Author: D.G. Seiler
Publisher: American Institute of Physics
ISBN: 9781563968679
Category : Technology & Engineering
Languages : en
Pages : 960
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Book Description
The proceedings of the 1998 International Conference on Characterization and Metrology for ULSI Technology was dedicated to summarizing major issues and giving critical reviews of important semiconductor techniques that are crucial to continue the advances in semiconductor technology. Characterization and metrology are key enablers for developing semiconductor process technology and in improving manufacturing. This is the only book that we know of that emphasizes the science and technology of semiconductor characterization in the factory environment. The increasing importance of monitoring and controlling semiconductor processes make it particularly timely.
Author: Yan Li
Publisher: Springer Nature
ISBN: 9811570906
Category : Technology & Engineering
Languages : en
Pages : 629
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Book Description
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
Author: Toru Yoshizawa
Publisher: CRC Press
ISBN: 1351831844
Category : Technology & Engineering
Languages : en
Pages : 744
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Book Description
Handbook of Optical Metrology: Principles and Applications begins by discussing key principles and techniques before exploring practical applications of optical metrology. Designed to provide beginners with an introduction to optical metrology without sacrificing academic rigor, this comprehensive text: Covers fundamentals of light sources, lenses, prisms, and mirrors, as well as optoelectronic sensors, optical devices, and optomechanical elements Addresses interferometry, holography, and speckle methods and applications Explains Moiré metrology and the optical heterodyne measurement method Delves into the specifics of diffraction, scattering, polarization, and near-field optics Considers applications for measuring length and size, displacement, straightness and parallelism, flatness, and three-dimensional shapes This new Second Edition is fully revised to reflect the latest developments. It also includes four new chapters—nearly 100 pages—on optical coherence tomography for industrial applications, interference microscopy for surface structure analysis, noncontact dimensional and profile metrology by video measurement, and optical metrology in manufacturing technology.
Author: Maria Losurdo
Publisher: Springer Science & Business Media
ISBN: 3642339565
Category : Technology & Engineering
Languages : en
Pages : 740
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Book Description
This book presents and introduces ellipsometry in nanoscience and nanotechnology making a bridge between the classical and nanoscale optical behaviour of materials. It delineates the role of the non-destructive and non-invasive optical diagnostics of ellipsometry in improving science and technology of nanomaterials and related processes by illustrating its exploitation, ranging from fundamental studies of the physics and chemistry of nanostructures to the ultimate goal of turnkey manufacturing control. This book is written for a broad readership: materials scientists, researchers, engineers, as well as students and nanotechnology operators who want to deepen their knowledge about both basics and applications of ellipsometry to nanoscale phenomena. It starts as a general introduction for people curious to enter the fields of ellipsometry and polarimetry applied to nanomaterials and progresses to articles by experts on specific fields that span from plasmonics, optics, to semiconductors and flexible electronics. The core belief reflected in this book is that ellipsometry applied at the nanoscale offers new ways of addressing many current needs. The book also explores forward-looking potential applications.
