Author: William C. Johnson
Publisher: American Society of Civil Engineers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 456

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Book Description

Author: Pavel Lejcek
Publisher: Springer Science & Business Media
ISBN: 3642125050
Category : Technology & Engineering
Languages : en
Pages : 249

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Book Description
Grain boundaries are important structural components of polycrystalline materials used in the vast majority of technical applications. Because grain boundaries form a continuous network throughout such materials, their properties may limit their practical use. One of the serious phenomena which evoke these limitations is the grain boundary segregation of impurities. It results in the loss of grain boundary cohesion and consequently, in brittle fracture of the materials. The current book deals with fundamentals of grain boundary segregation in metallic materials and its relationship to the grain boundary structure, classification and other materials properties.

Author: William C. Johnson
Publisher: American Society of Civil Engineers
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 456

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Book Description

Author: W. C. Johnson
Publisher:
ISBN:
Category :
Languages : en
Pages : 438

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Book Description

Author: James Edward Krzanowski
Publisher:
ISBN:
Category :
Languages : en
Pages : 394

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Book Description

Author: Johannes G. Vos
Publisher: John Wiley & Sons
ISBN: 0470861509
Category : Science
Languages : en
Pages : 332

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Book Description
Describes the supramolecular properties of molecular assemblies that contain a solid phase, offering an integrated approach to measurement and addressibility. * Offers an integrated approach to measurement and addressibility. * Features case studies describing the major devices developed using this technology. * The prospects for the future of interfacial supramolecular assemblies are considered.

Author: Kenneth Raymond Shull
Publisher:
ISBN:
Category :
Languages : en
Pages : 342

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Book Description

Author: R.M. Latanison
Publisher: Springer Science & Business Media
ISBN: 1461335000
Category : Science
Languages : en
Pages : 1043

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Book Description
It is now more than 100 years since certain detrimental effects on the ductility of iron were first associated with the presence of hydrogen. Not only is hydrogen embrittlement still a major industri al problem, but it is safe to say that in a mechanistic sense we still do not know what hydrogen (but not nitrogen or oxygen, for example) does on an atomic scale to induce this degradation. The same applies to other examples of environmentally-induced fracture: what is it about the ubiquitous chloride ion that induces premature catastrophic fracture (stress corrosion cracking) of ordinarily ductile austenitic stainless steels? Why, moreover, are halide ions troublesome but the nitrate or sulfate anions not deleterious to such stainless steels? Likewise, why are some solid metals embrit tled catastrophically by same liquid metals (liquid metal embrit tlement) - copper and aluminum, for example, are embrittled by liquid mercury. In short, despite all that we may know about the materials science and mechanics of fracture on a macroscopic scale, we know little about the atomistics of fracture in the absence of environmental interactions and even less when embrittlement phe nomena such as those described above are involved. On the other hand, it is interesting to note that physical chemists and surface chemists also have interests in the same kinds of interactions that occur on an atomic scale when metals such as nickel or platinum are used, for example, as catalysts for chemical reactions.

Author: Colin Wood
Publisher: Springer Science & Business Media
ISBN: 0387683194
Category : Technology & Engineering
Languages : en
Pages : 523

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Book Description
This book presents the latest understanding of the solid physics, electronic implications and practical applications of the unique spontaneous or pyro-electric polarization charge of hexagonal semiconductors, and the piezo-electric effects in thin film hetero-structures which are used in wide forbidden band gap sensor, electronic and opto-electronic semiconductor devices.

Author: Siegfried Hofmann
Publisher: Springer Science & Business Media
ISBN: 3642273815
Category : Science
Languages : en
Pages : 545

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Book Description
To anyone who is interested in surface chemical analysis of materials on the nanometer scale, this book is prepared to give appropriate information. Based on typical application examples in materials science, a concise approach to all aspects of quantitative analysis of surfaces and thin films with AES and XPS is provided. Starting from basic principles which are step by step developed into practically useful equations, extensive guidance is given to graduate students as well as to experienced researchers. Key chapters are those on quantitative surface analysis and on quantitative depth profiling, including recent developments in topics such as surface excitation parameter and backscattering correction factor. Basic relations are derived for emission and excitation angle dependencies in the analysis of bulk material and of fractional nano-layer structures, and for both smooth and rough surfaces. It is shown how to optimize the analytical strategy, signal-to-noise ratio, certainty and detection limit. Worked examples for quantification of alloys and of layer structures in practical cases (e.g. contamination, evaporation, segregation and oxidation) are used to critically review different approaches to quantification with respect to average matrix correction factors and matrix relative sensitivity factors. State-of-the-art issues in quantitative, destructive and non-destructive depth profiling are discussed with emphasis on sputter depth profiling and on angle resolved XPS and AES. Taking into account preferential sputtering and electron backscattering corrections, an introduction to the mixing-roughness-information depth (MRI) model and its extensions is presented.