Interfacial Engineering for Optimized Properties III: Volume 819 PDF Download
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Author: Christopher A. Schuh
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 336
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Christopher A. Schuh
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 336
Get Book Here
Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Grain boundaries
Languages : en
Pages : 336
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Book Description
Author: Kathryn J. Wahl
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 444
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Book Description
This volume focuses on methods to measures and model small-volume mechanical and tribological properties. Nanoscale characterization of the mechanical and tribological properties of surfaces is important in many engineering applications.
Author:
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ISBN:
Category : Surfaces (Technology)
Languages : en
Pages : 392
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Book Description
Author:
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ISBN:
Category : Nanotechnology
Languages : en
Pages : 440
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Book Description
Author: Materials Research Society. Meeting
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 586
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author:
Publisher:
ISBN:
Category : Ions
Languages : en
Pages : 408
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Book Description
Author:
Publisher:
ISBN:
Category : Compound semiconductors
Languages : en
Pages : 570
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Book Description
Author: Cato T. Laurencin
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 416
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Book Description
Author: R. J. Carter
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
