Interfacial Compatibility in Microelectronics PDF Download
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Author: Tomi Laurila
Publisher: Springer Science & Business Media
ISBN: 1447124707
Category : Technology & Engineering
Languages : en
Pages : 221
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Book Description
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Author: Tomi Laurila
Publisher: Springer Science & Business Media
ISBN: 1447124707
Category : Technology & Engineering
Languages : en
Pages : 221
Get Book
Book Description
Interfaces between dissimilar materials are met everywhere in microelectronics and microsystems. In order to ensure faultless operation of these highly sophisticated structures, it is mandatory to have fundamental understanding of materials and their interactions in the system. In this difficult task, the “traditional” method of trial and error is not feasible anymore; it takes too much time and repeated efforts. In Interfacial Compatibility in Microelectronics, an alternative approach is introduced. In this revised method four fundamental disciplines are combined: i) thermodynamics of materials ii) reaction kinetics iii) theory of microstructures and iv) stress and strain analysis. The advantages of the method are illustrated in Interfacial Compatibility in Microelectronics which includes: solutions to several common reliability issues in microsystem technology, methods to understand and predict failure mechanisms at interfaces between dissimilar materials and an approach to DFR based on deep understanding in materials science, rather than on the use of mechanistic tools, such as FMEA. Interfacial Compatibility in Microelectronics provides a clear and methodical resource for graduates and postgraduates alike.
Author:
Publisher:
ISBN: 9781447124719
Category :
Languages : en
Pages : 228
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Book Description
Author:
Publisher:
ISBN: 9781280397103
Category : Technology & Engineering
Languages : en
Pages : 217
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Book Description
Annotation This volume provides solutions to several common reliability issues in microsystem packaging. It teaches the reader methods to understand and predict failure mechanisms at interfaces between dissimilar materials.
Author: James E. Morris
Publisher: Springer
ISBN: 3319903624
Category : Technology & Engineering
Languages : en
Pages : 996
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Book Description
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Author: Markku Tilli
Publisher: William Andrew
ISBN: 0323312233
Category : Technology & Engineering
Languages : en
Pages : 826
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Book Description
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures Geared towards practical applications rather than theory
Author: Werner Bindmann
Publisher: Psychology Press
ISBN: 9780415173407
Category : Foreign Language Study
Languages : en
Pages : 712
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Book Description
Covers semiconductor electronics, microlithographic process, components, microelectronic circuit technology, microprocessor technology and software technology. Includes some 29,000 terms and 40,000 translations in the field.
Author: John Lau
Publisher: Springer Science & Business Media
ISBN: 1468477676
Category : Technology & Engineering
Languages : en
Pages : 904
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Book Description
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Author: Marcel Van de Voorde
Publisher: John Wiley & Sons
ISBN: 3527679227
Category : Technology & Engineering
Languages : en
Pages : 756
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Book Description
Controlling the properties of materials by modifying their composition and by manipulating the arrangement of atoms and molecules is a dream that can be achieved by nanotechnology. As one of the fastest developing and innovative -- as well as well-funded -- fields in science, nanotechnology has already significantly changed the research landscape in chemistry, materials science, and physics, with numerous applications in consumer products, such as sunscreens and water-repellent clothes. It is also thanks to this multidisciplinary field that flat panel displays, highly efficient solar cells, and new biological imaging techniques have become reality. This second, enlarged edition has been fully updated to address the rapid progress made within this field in recent years. Internationally recognized experts provide comprehensive, first-hand information, resulting in an overview of the entire nano-micro world. In so doing, they cover aspects of funding and commercialization, the manufacture and future applications of nanomaterials, the fundamentals of nanostructures leading to macroscale objects as well as the ongoing miniaturization toward the nanoscale domain. Along the way, the authors explain the effects occurring at the nanoscale and the nanotechnological characterization techniques. An additional topic on the role of nanotechnology in energy and mobility covers the challenge of developing materials and devices, such as electrodes and membrane materials for fuel cells and catalysts for sustainable transportation. Also new to this edition are the latest figures for funding, investments, and commercialization prospects, as well as recent research programs and organizations.
Author: Marcel Van de Voorde
Publisher: John Wiley & Sons
ISBN: 3527336338
Category : Technology & Engineering
Languages : en
Pages : 771
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Book Description
Controlling the properties of materials by modifying their composition and by manipulating the arrangement of atoms and molecules is a dream that can be achieved by nanotechnology. As one of the fastest developing and innovative -- as well as well-funded -- fields in science, nanotechnology has already significantly changed the research landscape in chemistry, materials science, and physics, with numerous applications in consumer products, such as sunscreens and water-repellent clothes. It is also thanks to this multidisciplinary field that flat panel displays, highly efficient solar cells, and new biological imaging techniques have become reality. This second, enlarged edition has been fully updated to address the rapid progress made within this field in recent years. Internationally recognized experts provide comprehensive, first-hand information, resulting in an overview of the entire nano-micro world. In so doing, they cover aspects of funding and commercialization, the manufacture and future applications of nanomaterials, the fundamentals of nanostructures leading to macroscale objects as well as the ongoing miniaturization toward the nanoscale domain. Along the way, the authors explain the effects occurring at the nanoscale and the nanotechnological characterization techniques. An additional topic on the role of nanotechnology in energy and mobility covers the challenge of developing materials and devices, such as electrodes and membrane materials for fuel cells and catalysts for sustainable transportation. Also new to this edition are the latest figures for funding, investments, and commercialization prospects, as well as recent research programs and organizations.
Author: E-H Wong
Publisher: Woodhead Publishing
ISBN: 0857099116
Category : Technology & Engineering
Languages : en
Pages : 477
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Book Description
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study
