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Author: Radia Perlman
Publisher: Addison-Wesley Professional
ISBN: 9780201634488
Category : Computers
Languages : en
Pages : 566
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Book Description
Perlman, a bestselling author and senior consulting engineer for Sun Microsystems, provides insight for building more robust, reliable, secure and manageable networks. Coverage also includes routing and addressing strategies, VLANs, multicasting, IPv6, and more.
Author: Radia Perlman
Publisher: Addison-Wesley Professional
ISBN: 9780201634488
Category : Computers
Languages : en
Pages : 566
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Book Description
Perlman, a bestselling author and senior consulting engineer for Sun Microsystems, provides insight for building more robust, reliable, secure and manageable networks. Coverage also includes routing and addressing strategies, VLANs, multicasting, IPv6, and more.
Author: Jonathan M. Bowman
Publisher: Cengage Learning
ISBN: 9781285449333
Category : Performing Arts
Languages : en
Pages : 384
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Book Description
With its intriguing anecdotes, current research and storytelling narrative, Bowman's INTERCONNECTIONS illustrates the relevance of interpersonal communication to readers' everyday lives. It is written specifically for readers whose lives are increasingly mediated via Instagram, Twitter and Facebook. The text integrates issues of social diversity throughout, while boxed features offer in-depth coverage of technology, diversity and ethics. It also includes self-assessment via both journal activities and research-based questionnaires to help readers analyze their own communication style--and equips them with the tools to change it, if they want. Important Notice: Media content referenced within the product description or the product text may not be available in the ebook version.
Author: Ashok K. Goel
Publisher: John Wiley & Sons
ISBN: 0470165960
Category : Technology & Engineering
Languages : en
Pages : 433
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Book Description
This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Author: William James Dally
Publisher: Elsevier
ISBN: 0080497802
Category : Computers
Languages : en
Pages : 581
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Book Description
One of the greatest challenges faced by designers of digital systems is optimizing the communication and interconnection between system components. Interconnection networks offer an attractive and economical solution to this communication crisis and are fast becoming pervasive in digital systems. Current trends suggest that this communication bottleneck will be even more problematic when designing future generations of machines. Consequently, the anatomy of an interconnection network router and science of interconnection network design will only grow in importance in the coming years.This book offers a detailed and comprehensive presentation of the basic principles of interconnection network design, clearly illustrating them with numerous examples, chapter exercises, and case studies. It incorporates hardware-level descriptions of concepts, allowing a designer to see all the steps of the process from abstract design to concrete implementation. - Case studies throughout the book draw on extensive author experience in designing interconnection networks over a period of more than twenty years, providing real world examples of what works, and what doesn't. - Tightly couples concepts with implementation costs to facilitate a deeper understanding of the tradeoffs in the design of a practical network. - A set of examples and exercises in every chapter help the reader to fully understand all the implications of every design decision.
Author: Patricia Voydanoff
Publisher: Psychology Press
ISBN: 131782427X
Category : Business & Economics
Languages : en
Pages : 217
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Book Description
Research in recent decades has proven that the seemingly disparate worlds of family life and the workplace are in fact closely intertwined. Moreover, scholars have begun to recognize the extent to which community life influences the work-family interface, for instance, the lack of fit between school hours and work hours, and assistance provided by community-based child care services. Work, Family, and Community is the first to provide a comprehensive review and analysis of the theoretical and empirical research that has examined the complex interconnections among these domains. This book integrates literature from several disciplines, including sociology, industrial-organizational and occupational health psychology, human development and family studies, management, gender studies, and social work. It documents significant patterns and trends in the economy and looks at the health of communities and neighborhoods, exploring the level of social integration, availability of community services, and the extent to which such services meet the needs of working families. Author Patricia Voydanoff takes an important step in conceptualizing the components and processes that comprise the work-family-community relationship, and provides direction for future theoretical and empirical work on the topic. This volume speaks to scholars, researchers, and students who address the theoretical, empirical, and policy-relevant issues associated with the work-family-community interface.
Author: Zhenya Liu
Publisher: Academic Press
ISBN: 0128044063
Category : Political Science
Languages : en
Pages : 396
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Book Description
Global energy network is an important platform to guarantee effective exploitation of global clean energy and ensure reliable energy supply for everybody. Global Energy Interconnection analyzes the current situation and challenges of global energy development, provides the strategic thinking, overall objective, basic pattern, construction method and development mode for the development of global energy network. Based on the prediction of global energy and electricity supply and demand in the future, with the development of UHV AC/DC and smart grid technologies, this book offers new solutions to drive the safe, clean, highly efficient and sustainable development of global energy. The concept and development ideas concerning global energy interconnection in this book are based on the author's thinking of strategic issues about China's and the world's energy and electricity development for many years, especially combined with successful practices of China's UHV development. This book is particularly suitable for researchers and graduated students engaged in energy sector, as well as energy economics researchers, economists, consultants, and government energy policy makers in relevant fields. - Based on the author's many years' experience in developing Smart Grid solutions within national and international projects. - Combines both solid background information and cutting-edge technology progress, coupled with a useful and impressive list of references. - The key energy problems which are challenging us nowadays are well stated and explained in this book, which facilitates a better understanding of the development of global energy interconnection with UHV AC/DC and smart grid technologies.
Author: William Greig
Publisher: Springer Science & Business Media
ISBN: 0387339132
Category : Technology & Engineering
Languages : en
Pages : 312
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Book Description
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Author: Jose Duato
Publisher: Morgan Kaufmann
ISBN: 1558608524
Category : Computers
Languages : en
Pages : 626
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Book Description
Foreword -- Foreword to the First Printing -- Preface -- Chapter 1 -- Introduction -- Chapter 2 -- Message Switching Layer -- Chapter 3 -- Deadlock, Livelock, and Starvation -- Chapter 4 -- Routing Algorithms -- Chapter 5 -- CollectiveCommunicationSupport -- Chapter 6 -- Fault-Tolerant Routing -- Chapter 7 -- Network Architectures -- Chapter 8 -- Messaging Layer Software -- Chapter 9 -- Performance Evaluation -- Appendix A -- Formal Definitions for Deadlock Avoidance -- Appendix B -- Acronyms -- References -- Index.
Author: Francesc Moll
Publisher: Springer Science & Business Media
ISBN: 0306487195
Category : Technology & Engineering
Languages : en
Pages : 214
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Book Description
This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is towards giving general information rather than a compilation of practical cases. Each chapter contains a list of references for the topics.
Author: Karl J. Puttlitz
Publisher: Springer Science & Business Media
ISBN: 1461513898
Category : Technology & Engineering
Languages : en
Pages : 1250
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Book Description
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
