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Author: Yash Agrawal
Publisher: Springer Nature
ISBN: 9819944767
Category : Technology & Engineering
Languages : en
Pages : 286
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Book Description
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Author: Yash Agrawal
Publisher: Springer Nature
ISBN: 9819944767
Category : Technology & Engineering
Languages : en
Pages : 286
Get Book Here
Book Description
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Author: Yash Agrawal
Publisher: Springer
ISBN: 9789819944750
Category : Technology & Engineering
Languages : en
Pages : 0
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Book Description
This contributed book provides a thorough understanding of the basics along with detailed state-of-the-art emerging interconnect technologies for integrated circuit design and flexible electronics. It focuses on the investigation of advanced on-chip interconnects which match the current as well as future technology requirements. The contents focus on different aspects of interconnects such as material, physical characteristics, parasitic extraction, design, structure, modeling, machine learning, and neural network-based models for interconnects, signaling schemes, varying signal integrity performance analysis, variability, reliability aspects, associated electronic design automation tools. The book also explores interconnect technologies for flexible electronic systems. It also highlights the integration of sensors with stretchable interconnects to demonstrate the concept of a stretchable sensing network for wearable and flexible applications. This book is a useful guide for those working in academia and industry to understand the fundamentals and application of interconnect technologies.
Author: Young Suh Song
Publisher: Springer Nature
ISBN: 9819966493
Category :
Languages : en
Pages : 930
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Book Description
Author: Muhannad S. Bakir
Publisher: Artech House
ISBN: 1596932473
Category : Technology & Engineering
Languages : en
Pages : 551
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Book Description
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
Author: H Mattila
Publisher: Woodhead Publishing
ISBN: 1845691628
Category : Technology & Engineering
Languages : en
Pages : 525
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Book Description
The use of intelligent textiles in clothing is an exciting new field with wide-ranging applications. Intelligent textiles and clothing summarises some of the main types of intelligent textiles and their uses.Part one of the book reviews phase change materials (PCM), their role in such areas as thermal regulation and ways they can be integrated into outdoor and other types of clothing. The second part of the book discusses shape memory materials (SMM) and their applications in medical textiles, clothing and composite materials. Part three deals with chromic (colour change) and conductive materials and their use in such areas as sensors within clothing. The final part of the book looks at current and potential applications, including work wear and medical applications.With its distinguished editor and international team of contributors, Intelligent textiles and clothing is an essential guide for textile manufacturers in such areas as specialist clothing (for example, protective, sports and outdoor clothing) as well as medical textiles. - Summarises the main types of intelligent textiles and their uses - Reviews phase change materials and their role in clothing - Discusses shape memory materials and their applications
Author: Beth Keser
Publisher: John Wiley & Sons
ISBN: 1119793890
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Author: Safa Kasap
Publisher: Springer
ISBN: 331948933X
Category : Technology & Engineering
Languages : en
Pages : 1536
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Book Description
The second, updated edition of this essential reference book provides a wealth of detail on a wide range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications. Its extensive coverage, with clear illustrations and applications, carefully selected chapter sequencing and logical flow, makes it very different from other electronic materials handbooks. It has been written by professionals in the field and instructors who teach the subject at a university or in corporate laboratories. The Springer Handbook of Electronic and Photonic Materials, second edition, includes practical applications used as examples, details of experimental techniques, useful tables that summarize equations, and, most importantly, properties of various materials, as well as an extensive glossary. Along with significant updates to the content and the references, the second edition includes a number of new chapters such as those covering novel materials and selected applications. This handbook is a valuable resource for graduate students, researchers and practicing professionals working in the area of electronic, optoelectronic and photonic materials.
Author: An Chen
Publisher: John Wiley & Sons
ISBN: 1119869587
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
Advances in Semiconductor Technologies Discover the broad sweep of semiconductor technologies in this uniquely curated resource Semiconductor technologies and innovations have been the backbone of numerous different fields: electronics, online commerce, the information and communication industry, and the defense industry. For over fifty years, silicon technology and CMOS scaling have been the central focus and primary driver of innovation in the semiconductor industry. Traditional CMOS scaling has approached some fundamental limits, and as a result, the pace of scientific research and discovery for novel semiconductor technologies is increasing with a focus on novel materials, devices, designs, architectures, and computer paradigms. In particular, new computing paradigms and systems—such as quantum computing, artificial intelligence, and Internet of Things—have the potential to unlock unprecedented power and application space. Advances in Semiconductor Technologies provides a comprehensive overview of selected semiconductor technologies and the most up-to-date research topics, looking in particular at mainstream developments in current industry research and development, from emerging materials and devices, to new computing paradigms and applications. This full-coverage volume gives the reader valuable insights into state-of-the-art advances currently being fabricated, a wide range of novel applications currently under investigation, and a glance into the future with emerging technologies in development. Advances in Semiconductor Technologies readers will also find: A comprehensive approach that ensures a thorough understanding of state-of-the-art technologies currently being fabricated Treatments on all aspects of semiconductor technologies, including materials, devices, manufacturing, modeling, design, architecture, and applications Articles written by an impressive team of international academics and industry insiders that provide unique insights into a wide range of topics Advances in Semiconductor Technologies is a useful, time-saving reference for electrical engineers working in industry and research, who are looking to stay abreast of rapidly advancing developments in semiconductor electronics, as well as academics in the field and government policy advisors.
Author: Tünde Kirstein
Publisher: Elsevier
ISBN: 0857093533
Category : Technology & Engineering
Languages : en
Pages : 540
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Book Description
Smart-textiles developers draw on diverse fields of knowledge to produce unique materials with enhanced properties and vast potential. Several disciplines outside the traditional textile area are involved in the construction of these smart textiles, and each individual field has its own language, specific terms and approaches. Multidisciplinary know-how for smart-textiles developers provides a filtered knowledge of these areas of expertise, explaining key expressions and demonstrating their relevance to the smart-textiles field.Following an introduction to the new enabling technologies, commercialisation and market trends that make up the future of smart-textiles development, part one reviews materials employed in the production of smart textiles. Types and processing of electro-conductive and semiconducting materials, optical fibres for smart photonic textiles, conductive nanofibres and nanocoatings, polymer-based resistive sensors, and soft capacitance fibres for touch-sensitive smart textiles are all discussed. Part two then investigates such technologies as the embedding of electronic functions, the integration of thin-film electronics, and the development of organic and large-area electronic (OLAE) technologies for smart textiles. Joining technologies are also discussed, alongside kinetic, thermoelectric and solar energy harvesting technologies, and signal processing technologies for activity-aware smart textiles. Finally, product development and applications are the focus of part three, which investigates strategies for technology management, innovation and improved sustainability, before the book concludes by exploring medical, automotive and architectural applications of smart textiles.With its distinguished editor and international team of expert contributors, Multidisciplinary know-how for smart-textiles developers is a key tool for readers working in industries including design, fashion, textiles, through to electronics, computing and material science. It also provides a useful guide to the subject for academics working across a wide range of fields. - Reviews materials used in the production of smart textiles - Examines the technologies used in smart textiles, such as optical fibres and polymer based resistive sensors - Investigates strategies for technology management, innovation and improved development
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
