Author: Valim Levitin
Publisher: John Wiley & Sons
ISBN: 3527335072
Category : Technology & Engineering
Languages : en
Pages : 323
Book Description
The connection between the quantum behavior of the structure elements of a substance and the parameters that determine the macroscopic behavior of materials has a major influence on the properties exhibited by different solids. Although quantum engineering and theory should complement each other, this is not always the case. This book aims to demonstrate how the properties of materials can be derived and predicted from the features of their structural elements, generally electrons. In a sense, electronic structure forms the glue holding solids together and it is central to determining structural, mechanical, chemical, electrical, magnetic, and vibrational properties. The main part of the book is devoted to an overview of the fundamentals of density functional theory and its applications to computational solid-state physics and chemistry. The author shows the technique for construction of models and the computer simulation methods in detail. He considers fundamentals of physical and chemical interatomic bonding in solids and analyzes the predicted theoretical outcome in comparison with experimental data. He applies first-principle simulation methods to predict the properties of transition metals, semiconductors, oxides, solid solutions, and molecular and ionic crystals. Uniquely, he presents novel theories of creep and fatigue that help to anticipate, and prevent, possibly fatal material failures. As a result, readers gain the knowledge and tools to simulate material properties and design materials with desired characteristics. Due to the interdisciplinary nature of the book, it is suitable for a variety of markets from students to engineers and researchers.
Interatomic Bonding in Solids
Author: Valim Levitin
Publisher: John Wiley & Sons
ISBN: 3527335072
Category : Technology & Engineering
Languages : en
Pages : 323
Book Description
The connection between the quantum behavior of the structure elements of a substance and the parameters that determine the macroscopic behavior of materials has a major influence on the properties exhibited by different solids. Although quantum engineering and theory should complement each other, this is not always the case. This book aims to demonstrate how the properties of materials can be derived and predicted from the features of their structural elements, generally electrons. In a sense, electronic structure forms the glue holding solids together and it is central to determining structural, mechanical, chemical, electrical, magnetic, and vibrational properties. The main part of the book is devoted to an overview of the fundamentals of density functional theory and its applications to computational solid-state physics and chemistry. The author shows the technique for construction of models and the computer simulation methods in detail. He considers fundamentals of physical and chemical interatomic bonding in solids and analyzes the predicted theoretical outcome in comparison with experimental data. He applies first-principle simulation methods to predict the properties of transition metals, semiconductors, oxides, solid solutions, and molecular and ionic crystals. Uniquely, he presents novel theories of creep and fatigue that help to anticipate, and prevent, possibly fatal material failures. As a result, readers gain the knowledge and tools to simulate material properties and design materials with desired characteristics. Due to the interdisciplinary nature of the book, it is suitable for a variety of markets from students to engineers and researchers.
Publisher: John Wiley & Sons
ISBN: 3527335072
Category : Technology & Engineering
Languages : en
Pages : 323
Book Description
The connection between the quantum behavior of the structure elements of a substance and the parameters that determine the macroscopic behavior of materials has a major influence on the properties exhibited by different solids. Although quantum engineering and theory should complement each other, this is not always the case. This book aims to demonstrate how the properties of materials can be derived and predicted from the features of their structural elements, generally electrons. In a sense, electronic structure forms the glue holding solids together and it is central to determining structural, mechanical, chemical, electrical, magnetic, and vibrational properties. The main part of the book is devoted to an overview of the fundamentals of density functional theory and its applications to computational solid-state physics and chemistry. The author shows the technique for construction of models and the computer simulation methods in detail. He considers fundamentals of physical and chemical interatomic bonding in solids and analyzes the predicted theoretical outcome in comparison with experimental data. He applies first-principle simulation methods to predict the properties of transition metals, semiconductors, oxides, solid solutions, and molecular and ionic crystals. Uniquely, he presents novel theories of creep and fatigue that help to anticipate, and prevent, possibly fatal material failures. As a result, readers gain the knowledge and tools to simulate material properties and design materials with desired characteristics. Due to the interdisciplinary nature of the book, it is suitable for a variety of markets from students to engineers and researchers.
Structure and Bonding in Crystals
Author: Aaron N. Bloch
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 356
Book Description
Structure and Bonding in crystals ...
Publisher:
ISBN:
Category : Science
Languages : en
Pages : 356
Book Description
Structure and Bonding in crystals ...
Engineering Physics
Author: Mani Naidu
Publisher: Pearson Education India
ISBN: 9332514127
Category : Engineering
Languages : en
Pages : 640
Book Description
Engineering Physics is designed to cater to the needs of first year undergraduate engineering students. Written in a lucid style, this book assimilates the best practices of conceptual pedagogy, dealing at length with various topics such as crystallography, principles of quantum mechanics, free electron theory of metals, dielectric and magnetic properties, semiconductors, nanotechnology, etc.
Publisher: Pearson Education India
ISBN: 9332514127
Category : Engineering
Languages : en
Pages : 640
Book Description
Engineering Physics is designed to cater to the needs of first year undergraduate engineering students. Written in a lucid style, this book assimilates the best practices of conceptual pedagogy, dealing at length with various topics such as crystallography, principles of quantum mechanics, free electron theory of metals, dielectric and magnetic properties, semiconductors, nanotechnology, etc.
University Physics
Author: OpenStax
Publisher:
ISBN: 9781680920451
Category : Science
Languages : en
Pages : 622
Book Description
University Physics is a three-volume collection that meets the scope and sequence requirements for two- and three-semester calculus-based physics courses. Volume 1 covers mechanics, sound, oscillations, and waves. Volume 2 covers thermodynamics, electricity and magnetism, and Volume 3 covers optics and modern physics. This textbook emphasizes connections between between theory and application, making physics concepts interesting and accessible to students while maintaining the mathematical rigor inherent in the subject. Frequent, strong examples focus on how to approach a problem, how to work with the equations, and how to check and generalize the result. The text and images in this textbook are grayscale.
Publisher:
ISBN: 9781680920451
Category : Science
Languages : en
Pages : 622
Book Description
University Physics is a three-volume collection that meets the scope and sequence requirements for two- and three-semester calculus-based physics courses. Volume 1 covers mechanics, sound, oscillations, and waves. Volume 2 covers thermodynamics, electricity and magnetism, and Volume 3 covers optics and modern physics. This textbook emphasizes connections between between theory and application, making physics concepts interesting and accessible to students while maintaining the mathematical rigor inherent in the subject. Frequent, strong examples focus on how to approach a problem, how to work with the equations, and how to check and generalize the result. The text and images in this textbook are grayscale.
Solid State Physics
Author: Philip Hofmann
Publisher: John Wiley & Sons
ISBN: 3527682031
Category : Science
Languages : en
Pages : 264
Book Description
A must-have textbook for any undergraduate studying solid state physics. This successful brief course in solid state physics is now in its second edition. The clear and concise introduction not only describes all the basic phenomena and concepts, but also such advanced issues as magnetism and superconductivity. Each section starts with a gentle introduction, covering basic principles, progressing to a more advanced level in order to present a comprehensive overview of the subject. The book is providing qualitative discussions that help undergraduates understand concepts even if they can?t follow all the mathematical detail. The revised edition has been carefully updated to present an up-to-date account of the essential topics and recent developments in this exciting field of physics. The coverage now includes ground-breaking materials with high relevance for applications in communication and energy, like graphene and topological insulators, as well as transparent conductors. The text assumes only basic mathematical knowledge on the part of the reader and includes more than 100 discussion questions and some 70 problems, with solutions free to lecturers from the Wiley-VCH website. The author's webpage provides Online Notes on x-ray scattering, elastic constants, the quantum Hall effect, tight binding model, atomic magnetism, and topological insulators. This new edition includes the following updates and new features: * Expanded coverage of mechanical properties of solids, including an improved discussion of the yield stress * Crystal structure, mechanical properties, and band structure of graphene * The coverage of electronic properties of metals is expanded by a section on the quantum hall effect including exercises. New topics include the tight-binding model and an expanded discussion on Bloch waves. * With respect to semiconductors, the discussion of solar cells has been extended and improved. * Revised coverage of magnetism, with additional material on atomic magnetism * More extensive treatment of finite solids and nanostructures, now including topological insulators * Recommendations for further reading have been updated and increased. * New exercises on Hall mobility, light penetrating metals, band structure
Publisher: John Wiley & Sons
ISBN: 3527682031
Category : Science
Languages : en
Pages : 264
Book Description
A must-have textbook for any undergraduate studying solid state physics. This successful brief course in solid state physics is now in its second edition. The clear and concise introduction not only describes all the basic phenomena and concepts, but also such advanced issues as magnetism and superconductivity. Each section starts with a gentle introduction, covering basic principles, progressing to a more advanced level in order to present a comprehensive overview of the subject. The book is providing qualitative discussions that help undergraduates understand concepts even if they can?t follow all the mathematical detail. The revised edition has been carefully updated to present an up-to-date account of the essential topics and recent developments in this exciting field of physics. The coverage now includes ground-breaking materials with high relevance for applications in communication and energy, like graphene and topological insulators, as well as transparent conductors. The text assumes only basic mathematical knowledge on the part of the reader and includes more than 100 discussion questions and some 70 problems, with solutions free to lecturers from the Wiley-VCH website. The author's webpage provides Online Notes on x-ray scattering, elastic constants, the quantum Hall effect, tight binding model, atomic magnetism, and topological insulators. This new edition includes the following updates and new features: * Expanded coverage of mechanical properties of solids, including an improved discussion of the yield stress * Crystal structure, mechanical properties, and band structure of graphene * The coverage of electronic properties of metals is expanded by a section on the quantum hall effect including exercises. New topics include the tight-binding model and an expanded discussion on Bloch waves. * With respect to semiconductors, the discussion of solar cells has been extended and improved. * Revised coverage of magnetism, with additional material on atomic magnetism * More extensive treatment of finite solids and nanostructures, now including topological insulators * Recommendations for further reading have been updated and increased. * New exercises on Hall mobility, light penetrating metals, band structure
Electronic Structure and the Properties of Solids
Author: Walter A. Harrison
Publisher: Courier Corporation
ISBN: 0486141780
Category : Science
Languages : en
Pages : 610
Book Description
This text offers basic understanding of the electronic structure of covalent and ionic solids, simple metals, transition metals and their compounds; also explains how to calculate dielectric, conducting, bonding properties.
Publisher: Courier Corporation
ISBN: 0486141780
Category : Science
Languages : en
Pages : 610
Book Description
This text offers basic understanding of the electronic structure of covalent and ionic solids, simple metals, transition metals and their compounds; also explains how to calculate dielectric, conducting, bonding properties.
Chemistry 2e
Author: Paul Flowers
Publisher:
ISBN: 9781951693008
Category :
Languages : en
Pages : 0
Book Description
Chemistry 2e is designed to meet the scope and sequence requirements of the two-semester general chemistry course. The textbook provides an important opportunity for students to learn the core concepts of chemistry and understand how those concepts apply to their lives and the world around them. The book also includes a number of innovative features, including interactive exercises and real-world applications, designed to enhance student learning. The second edition has been revised to incorporate clearer, more current, and more dynamic explanations, while maintaining the same organization as the first edition. Substantial improvements have been made in the figures, illustrations, and example exercises that support the text narrative. Changes made in Chemistry 2e are described in the preface to help instructors transition to the second edition.
Publisher:
ISBN: 9781951693008
Category :
Languages : en
Pages : 0
Book Description
Chemistry 2e is designed to meet the scope and sequence requirements of the two-semester general chemistry course. The textbook provides an important opportunity for students to learn the core concepts of chemistry and understand how those concepts apply to their lives and the world around them. The book also includes a number of innovative features, including interactive exercises and real-world applications, designed to enhance student learning. The second edition has been revised to incorporate clearer, more current, and more dynamic explanations, while maintaining the same organization as the first edition. Substantial improvements have been made in the figures, illustrations, and example exercises that support the text narrative. Changes made in Chemistry 2e are described in the preface to help instructors transition to the second edition.
The Chemical Bond
Author: Gernot Frenking
Publisher: John Wiley & Sons
ISBN: 3527333142
Category : Science
Languages : en
Pages : 450
Book Description
This is the perfect complement to "Chemical Bonding - Across the Periodic Table" by the same editors, who are two of the top scientists working on this topic, each with extensive experience and important connections within the community. The resulting book is a unique overview of the different approaches used for describing a chemical bond, including molecular-orbital based, valence-bond based, ELF, AIM and density-functional based methods. It takes into account the many developments that have taken place in the field over the past few decades due to the rapid advances in quantum chemical models and faster computers.
Publisher: John Wiley & Sons
ISBN: 3527333142
Category : Science
Languages : en
Pages : 450
Book Description
This is the perfect complement to "Chemical Bonding - Across the Periodic Table" by the same editors, who are two of the top scientists working on this topic, each with extensive experience and important connections within the community. The resulting book is a unique overview of the different approaches used for describing a chemical bond, including molecular-orbital based, valence-bond based, ELF, AIM and density-functional based methods. It takes into account the many developments that have taken place in the field over the past few decades due to the rapid advances in quantum chemical models and faster computers.
Chemistry
Author: Bruce Averill
Publisher:
ISBN: 9780321413703
Category : Chemistry
Languages : en
Pages : 1233
Book Description
Emphasises on contemporary applications and an intuitive problem-solving approach that helps students discover the exciting potential of chemical science. This book incorporates fresh applications from the three major areas of modern research: materials, environmental chemistry, and biological science.
Publisher:
ISBN: 9780321413703
Category : Chemistry
Languages : en
Pages : 1233
Book Description
Emphasises on contemporary applications and an intuitive problem-solving approach that helps students discover the exciting potential of chemical science. This book incorporates fresh applications from the three major areas of modern research: materials, environmental chemistry, and biological science.
3D and Circuit Integration of MEMS
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.