Author: Friedrich Beck
Publisher: John Wiley & Sons
ISBN: 9780471974017
Category : Technology & Engineering
Languages : en
Pages : 198
Book Description
Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.
Integrated Circuit Failure Analysis
Author: Friedrich Beck
Publisher: John Wiley & Sons
ISBN: 9780471974017
Category : Technology & Engineering
Languages : en
Pages : 198
Book Description
Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.
Publisher: John Wiley & Sons
ISBN: 9780471974017
Category : Technology & Engineering
Languages : en
Pages : 198
Book Description
Funktionstests an integrierten Schaltungen sind für deren Zuverlässigkeit von herausragender Bedeutung. Erstmals werden in diesem Werk die speziellen Präparationstechniken für die Fehleranalyse beschrieben. Ausgehend von den theoretischen Grundlagen erläutert der Autor in praxisnahem Stil die verschiedenen Techniken, die das Zurückverfolgen von Ausfällen ermöglichen.
Failure Analysis of Integrated Circuits
Author: Lawrence C. Wagner
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Publisher: Springer Science & Business Media
ISBN: 1461549191
Category : Technology & Engineering
Languages : en
Pages : 256
Book Description
This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.
Advanced Techniques for Integrated Circuit Failure Analysis ... and More!
Author: Karel Maria André Van Doorselaer
Publisher:
ISBN: 9789090071237
Category :
Languages : en
Pages : 202
Book Description
Publisher:
ISBN: 9789090071237
Category :
Languages : en
Pages : 202
Book Description
Techniques in Integrated Circuit (IC) Failure Analysis
Author: Z. Jamal
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages :
Book Description
Failure-Free Integrated Circuit Packages
Author: Charles Cohn
Publisher: McGraw Hill Professional
ISBN: 9780071434843
Category : Technology & Engineering
Languages : en
Pages : 394
Book Description
The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.
Publisher: McGraw Hill Professional
ISBN: 9780071434843
Category : Technology & Engineering
Languages : en
Pages : 394
Book Description
The shrinking of integrated circuits (ICs) puts tremendous stress on overall device reliability. This unique treatment uses graphic illustration to clearly identify all major failure mode types, so engineers can spot failures before they occur.
Microelectronics Failure Analysis
Author:
Publisher: ASM International
ISBN: 0871708043
Category : Technology & Engineering
Languages : en
Pages : 813
Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Publisher: ASM International
ISBN: 0871708043
Category : Technology & Engineering
Languages : en
Pages : 813
Book Description
For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron
Microelectronics Fialure Analysis Desk Reference, Seventh Edition
Author: Tejinder Gandhi
Publisher: ASM International
ISBN: 1627082468
Category : Technology & Engineering
Languages : en
Pages : 750
Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Publisher: ASM International
ISBN: 1627082468
Category : Technology & Engineering
Languages : en
Pages : 750
Book Description
The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
Failure Analysis of Minuteman Integrated Circuit Failures
Author: C. W. Scott
Publisher:
ISBN:
Category :
Languages : en
Pages : 168
Book Description
The report describes experience in determining the actual reliability of Minuteman integrated circuits. The device constructions and evolution are discussed in terms of the materials, design, testing, and failure analysis of these circuits. System failures are shown to occur because of either improper device designs or inefficient inspections and testing. (Author).
Publisher:
ISBN:
Category :
Languages : en
Pages : 168
Book Description
The report describes experience in determining the actual reliability of Minuteman integrated circuits. The device constructions and evolution are discussed in terms of the materials, design, testing, and failure analysis of these circuits. System failures are shown to occur because of either improper device designs or inefficient inspections and testing. (Author).
Microelectronics Failure Analysis
Author: EDFAS Desk Reference Committee
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
Book Description
Includes bibliographical references and index.
Publisher: ASM International
ISBN: 1615037268
Category : Technology & Engineering
Languages : en
Pages : 673
Book Description
Includes bibliographical references and index.
Proceedings of the ... International Symposium on the Physical & Failure Analysis of Integrated Circuits
Author:
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 378
Book Description
Publisher:
ISBN:
Category : Integrated circuits
Languages : en
Pages : 378
Book Description