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Author: Mikael Sahrling
Publisher: Cambridge University Press
ISBN: 1108498450
Category : Computers
Languages : en
Pages : 257
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Book Description
Learn how to use estimation techniques to solve real-world IC design problems and accelerate design processes with this practical guide.
Author: Mikael Sahrling
Publisher: Cambridge University Press
ISBN: 1108498450
Category : Computers
Languages : en
Pages : 257
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Book Description
Learn how to use estimation techniques to solve real-world IC design problems and accelerate design processes with this practical guide.
Author: Tony Chan Carusone
Publisher:
ISBN: 9781118092330
Category : Analog electronic systems
Languages : en
Pages : 794
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Book Description
The 2nd Edition of Analog Integrated Circuit Design focuses on more coverage about several types of circuits that have increased in importance in the past decade. Furthermore, the text is enhanced with material on CMOS IC device modeling, updated processing layout and expanded coverage to reflect technical innovations. CMOS devices and circuits have more influence in this edition as well as a reduced amount of text on BiCMOS and bipolar information. New chapters include topics on frequency response of analog ICs and basic theory of feedback amplifiers.
Author: Yuan Xie
Publisher: Springer Science & Business Media
ISBN: 144190784X
Category : Technology & Engineering
Languages : en
Pages : 292
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Book Description
We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).
Author: Stephen J. Gaul
Publisher: John Wiley & Sons
ISBN: 1118701879
Category : Technology & Engineering
Languages : en
Pages : 392
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Book Description
A practical guide to the effects of radiation on semiconductor components of electronic systems, and techniques for the designing, laying out, and testing of hardened integrated circuits This book teaches the fundamentals of radiation environments and their effects on electronic components, as well as how to design, lay out, and test cost-effective hardened semiconductor chips not only for today’s space systems but for commercial terrestrial applications as well. It provides a historical perspective, the fundamental science of radiation, and the basics of semiconductors, as well as radiation-induced failure mechanisms in semiconductor chips. Integrated Circuits Design for Radiation Environments starts by introducing readers to semiconductors and radiation environments (including space, atmospheric, and terrestrial environments) followed by circuit design and layout. The book introduces radiation effects phenomena including single-event effects, total ionizing dose damage and displacement damage) and shows how technological solutions can address both phenomena. Describes the fundamentals of radiation environments and their effects on electronic components Teaches readers how to design, lay out and test cost-effective hardened semiconductor chips for space systems and commercial terrestrial applications Covers natural and man-made radiation environments, space systems and commercial terrestrial applications Provides up-to-date coverage of state-of-the-art of radiation hardening technology in one concise volume Includes questions and answers for the reader to test their knowledge Integrated Circuits Design for Radiation Environments will appeal to researchers and product developers in the semiconductor, space, and defense industries, as well as electronic engineers in the medical field. The book is also helpful for system, layout, process, device, reliability, applications, ESD, latchup and circuit design semiconductor engineers, along with anyone involved in micro-electronics used in harsh environments.
Author: Vasilis F. Pavlidis
Publisher: Newnes
ISBN: 0124104843
Category : Technology & Engineering
Languages : en
Pages : 770
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Book Description
Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires Offers practical guidance on designing 3-D heterogeneous systems Provides power delivery of 3-D ICs Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more Provides experimental case studies in power delivery, synchronization, and thermal characterization
Author: Ugur Cilingiroglu
Publisher: McGraw Hill Professional
ISBN: 1260441466
Category : Technology & Engineering
Languages : en
Pages : 576
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Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. Learn the principles and practices of simulation-based analog IC design This comprehensive textbook and on-the-job reference offers clear instruction on analog integrated circuit design using the latest simulation techniques. Ideal for graduate students and professionals alike, the book shows, step by step, how to develop and deploy integrated circuits for cutting-edge Internet of Things (IoT) and other applications. Analog Integrated Circuit Design by Simulation: Techniques, Tools, and Methods lays out practical, ready-to-apply engineering strategies. Application layer, device layer, and circuit layer IC design are covered in complete detail. You will learn how to tackle real-world design problems and avoid long cycles of trial and error. Coverage includes: •First-order DC response•Unified closed-loop model•Accurate modeling of DC response•Frequency and step response•Multi-pole dynamic response and stability•Effect of external network on differential gain•Continuous-time and discrete-time amplifiers•MOSFET, NMOS, and PMOS characteristics•Small-signal modeling and circuit analysis•Resistor and capacitor design•Current sources, sinks, and mirrors•Basic, symmetrical, folded-cascode, and Miller OTAs•Opamps with source-follower and common-source output stages•Fully differential OTAs and opamps
Author: John W. M. Rogers
Publisher: Artech House
ISBN: 1607839806
Category : Technology & Engineering
Languages : en
Pages : 535
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Book Description
This newly revised and expanded edition of the 2003 Artech House classic, Radio Frequency Integrated Circuit Design, serves as an up-to-date, practical reference for complete RFIC know-how. The second edition includes numerous updates, including greater coverage of CMOS PA design, RFIC design with on-chip components, and more worked examples with simulation results. By emphasizing working designs, this book practically transports you into the authors' own RFIC lab so you can fully understand the function of each design detailed in this book. Among the RFIC designs examined are RF integrated LC-based filters, VCO automatic amplitude control loops, and fully integrated transformer-based circuits, as well as image reject mixers and power amplifiers. If you are new to RFIC design, you can benefit from the introduction to basic theory so you can quickly come up to speed on how RFICs perform and work together in a communications device. A thorough examination of RFIC technology guides you in knowing when RFICs are the right choice for designing a communication device. This leading-edge resource is packed with over 1,000 equations and more than 435 illustrations that support key topics.
Author: John E. Ayers
Publisher: CRC Press
ISBN: 1420069888
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
Exponential improvement in functionality and performance of digital integrated circuits has revolutionized the way we live and work. The continued scaling down of MOS transistors has broadened the scope of use for circuit technology to the point that texts on the topic are generally lacking after a few years. The second edition of Digital Integrated Circuits: Analysis and Design focuses on timeless principles with a modern interdisciplinary view that will serve integrated circuits engineers from all disciplines for years to come. Providing a revised instructional reference for engineers involved with Very Large Scale Integrated Circuit design and fabrication, this book delves into the dramatic advances in the field, including new applications and changes in the physics of operation made possible by relentless miniaturization. This book was conceived in the versatile spirit of the field to bridge a void that had existed between books on transistor electronics and those covering VLSI design and fabrication as a separate topic. Like the first edition, this volume is a crucial link for integrated circuit engineers and those studying the field, supplying the cross-disciplinary connections they require for guidance in more advanced work. For pedagogical reasons, the author uses SPICE level 1 computer simulation models but introduces BSIM models that are indispensable for VLSI design. This enables users to develop a strong and intuitive sense of device and circuit design by drawing direct connections between the hand analysis and the SPICE models. With four new chapters, more than 200 new illustrations, numerous worked examples, case studies, and support provided on a dynamic website, this text significantly expands concepts presented in the first edition.
Author: Ke-Horng Chen
Publisher: John Wiley & Sons
ISBN: 1118896831
Category : Technology & Engineering
Languages : en
Pages : 774
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Book Description
This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors’ manuals, and program downloads
Author: Kenneth R. Laker
Publisher: McGraw-Hill Science, Engineering & Mathematics
ISBN:
Category : Computers
Languages : en
Pages : 944
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Book Description
It follows with a thorough treatment of design operational and operational transconductance amplifiers, and concludes with a unified presentation of sample-data and continuous-time signal processing systems.
