III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535 PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535 PDF full book. Access full book title III-V and IV-IV Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics: Volume 535 by S. A. Ringel. Download full books in PDF and EPUB format.
Author: S. A. Ringel
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 338
Get Book Here
Book Description
This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.
Author: S. A. Ringel
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 338
Get Book Here
Book Description
This book contains the proceedings of two symposia - 'Integration of Dissimilar Materials in Micro- and Optoelectronics' and 'III-V and SiGe Group IV Device/IC Processing Challenges for Commercial Applications'. The publication stems from the desire to achieve new levels of device functionality and higher levels of performance via integration of devices based on dissimilar semiconductors, where the constraint of lattice-matching on the breadth of attainable devices can be reduced. It covers fundamental topics germane to integration of a wide range of dissimilar materials spanning wide-bandgap III-V nitrides, III-V/Si integration, II-VI and II-VI/III-V compounds, heterovalent structures, oxides, photonic bandgap structures and others. Topics such as compliancy, dislocation control, selective area growth, bonding methodologies, etc. are featured. It also addresses processing issues in the manufacturing of III-V and Si-based heterostructures for commercial products. Here, the success enjoyed by silicon germanium technology is contrasted by the promise of silicon-carbon alloys which have opportunities and challenges for the new generation of process developers.
Author:
Publisher:
ISBN:
Category : Microelectronics
Languages : en
Pages : 336
Get Book Here
Book Description
Author: British Library. Document Supply Centre
Publisher:
ISBN:
Category : Conference proceedings
Languages : en
Pages : 844
Get Book Here
Book Description
Author: Ed Bowker Staff
Publisher: R. R. Bowker
ISBN: 9780835246422
Category : Reference
Languages : en
Pages : 3274
Get Book Here
Book Description
Author:
Publisher:
ISBN:
Category : Engineering
Languages : en
Pages : 470
Get Book Here
Book Description
Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 9783540210498
Category : Science
Languages : en
Pages : 524
Get Book Here
Book Description
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Author: Dieter K. Schroder
Publisher: John Wiley & Sons
ISBN: 0471739065
Category : Technology & Engineering
Languages : en
Pages : 800
Get Book Here
Book Description
This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Author: Rose Arny
Publisher:
ISBN:
Category : American literature
Languages : en
Pages : 1608
Get Book Here
Book Description
Author: David J. Lockwood
Publisher: Springer Science & Business Media
ISBN: 3642105068
Category : Science
Languages : en
Pages : 264
Get Book Here
Book Description
This book is volume II of a series of books on silicon photonics. It gives a fascinating picture of the state-of-the-art in silicon photonics from a component perspective. It presents a perspective on what can be expected in the near future. It is formed from a selected number of reviews authored by world leaders in the field, and is written from both academic and industrial viewpoints. An in-depth discussion of the route towards fully integrated silicon photonics is presented. This book will be useful not only to physicists, chemists, materials scientists, and engineers but also to graduate students who are interested in the fields of micro- and nanophotonics and optoelectronics.
Author: Paul R. Prucnal
Publisher: CRC Press
ISBN: 1498725244
Category : Science
Languages : en
Pages : 445
Get Book Here
Book Description
This book sets out to build bridges between the domains of photonic device physics and neural networks, providing a comprehensive overview of the emerging field of "neuromorphic photonics." It includes a thorough discussion of evolution of neuromorphic photonics from the advent of fiber-optic neurons to today’s state-of-the-art integrated laser neurons, which are a current focus of international research. Neuromorphic Photonics explores candidate interconnection architectures and devices for integrated neuromorphic networks, along with key functionality such as learning. It is written at a level accessible to graduate students, while also intending to serve as a comprehensive reference for experts in the field.
