Author: Rui Wang
Publisher: Springer Nature
ISBN: 9811504741
Category : Technology & Engineering
Languages : en
Pages : 1340
Book Description
This book includes original, peer-reviewed research papers from the 11th International Conference on Modelling, Identification and Control (ICMIC2019), held in Tianjin, China on July 13-15, 2019. The topics covered include but are not limited to: System Identification, Linear/Nonlinear Control Systems, Data-driven Modelling and Control, Process Modelling and Process Control, Fault Diagnosis and Reliable Control, Intelligent Systems, and Machine Learning and Artificial Intelligence.The papers showcased here share the latest findings on methodologies, algorithms and applications in modelling, identification, and control, integrated with Artificial Intelligence (AI), making the book a valuable asset for researchers, engineers, and university students alike.
Ferroelectrics
Author: Mickaël Lallart
Publisher: BoD – Books on Demand
ISBN: 9533074566
Category : Science
Languages : en
Pages : 266
Book Description
Ferroelectric materials have been and still are widely used in many applications, that have moved from sonar towards breakthrough technologies such as memories or optical devices. This book is a part of a four volume collection (covering material aspects, physical effects, characterization and modeling, and applications) and focuses on the application of ferroelectric devices to innovative systems. In particular, the use of these materials as varying capacitors, gyroscope, acoustics sensors and actuators, microgenerators and memory devices will be exposed, providing an up-to-date review of recent scientific findings and recent advances in the field of ferroelectric devices.
Publisher: BoD – Books on Demand
ISBN: 9533074566
Category : Science
Languages : en
Pages : 266
Book Description
Ferroelectric materials have been and still are widely used in many applications, that have moved from sonar towards breakthrough technologies such as memories or optical devices. This book is a part of a four volume collection (covering material aspects, physical effects, characterization and modeling, and applications) and focuses on the application of ferroelectric devices to innovative systems. In particular, the use of these materials as varying capacitors, gyroscope, acoustics sensors and actuators, microgenerators and memory devices will be exposed, providing an up-to-date review of recent scientific findings and recent advances in the field of ferroelectric devices.
Proceedings of the 11th International Conference on Modelling, Identification and Control (ICMIC2019)
Author: Rui Wang
Publisher: Springer Nature
ISBN: 9811504741
Category : Technology & Engineering
Languages : en
Pages : 1340
Book Description
This book includes original, peer-reviewed research papers from the 11th International Conference on Modelling, Identification and Control (ICMIC2019), held in Tianjin, China on July 13-15, 2019. The topics covered include but are not limited to: System Identification, Linear/Nonlinear Control Systems, Data-driven Modelling and Control, Process Modelling and Process Control, Fault Diagnosis and Reliable Control, Intelligent Systems, and Machine Learning and Artificial Intelligence.The papers showcased here share the latest findings on methodologies, algorithms and applications in modelling, identification, and control, integrated with Artificial Intelligence (AI), making the book a valuable asset for researchers, engineers, and university students alike.
Publisher: Springer Nature
ISBN: 9811504741
Category : Technology & Engineering
Languages : en
Pages : 1340
Book Description
This book includes original, peer-reviewed research papers from the 11th International Conference on Modelling, Identification and Control (ICMIC2019), held in Tianjin, China on July 13-15, 2019. The topics covered include but are not limited to: System Identification, Linear/Nonlinear Control Systems, Data-driven Modelling and Control, Process Modelling and Process Control, Fault Diagnosis and Reliable Control, Intelligent Systems, and Machine Learning and Artificial Intelligence.The papers showcased here share the latest findings on methodologies, algorithms and applications in modelling, identification, and control, integrated with Artificial Intelligence (AI), making the book a valuable asset for researchers, engineers, and university students alike.
Proceedings of the 11th National Technical Seminar on Unmanned System Technology 2019
Author: Zainah Md Zain
Publisher: Springer Nature
ISBN: 9811552819
Category : Technology & Engineering
Languages : en
Pages : 1239
Book Description
This book includes research papers from the 11th National Technical Symposium on Unmanned System Technology. Covering a number of topics, including intelligent robotics, novel sensor technology, control algorithms, acoustics signal processing, imaging techniques, biomimetic robots, green energy sources, and underwater communication backbones and protocols, it will appeal to researchers developing marine technology solutions and policy-makers interested in technologies to facilitate the exploration of coastal and oceanic regions.
Publisher: Springer Nature
ISBN: 9811552819
Category : Technology & Engineering
Languages : en
Pages : 1239
Book Description
This book includes research papers from the 11th National Technical Symposium on Unmanned System Technology. Covering a number of topics, including intelligent robotics, novel sensor technology, control algorithms, acoustics signal processing, imaging techniques, biomimetic robots, green energy sources, and underwater communication backbones and protocols, it will appeal to researchers developing marine technology solutions and policy-makers interested in technologies to facilitate the exploration of coastal and oceanic regions.
3D and Circuit Integration of MEMS
Author: Masayoshi Esashi
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Publisher: John Wiley & Sons
ISBN: 3527823255
Category : Technology & Engineering
Languages : en
Pages : 528
Book Description
Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.
Fundamentals and Applications of Ultrasonic Waves
Author: J. David N. Cheeke
Publisher: CRC Press
ISBN: 143985498X
Category : Science
Languages : en
Pages : 504
Book Description
Written at an intermediate level in a way that is easy to understand, Fundamentals and Applications of Ultrasonic Waves, Second Edition provides an up-to-date exposition of ultrasonics and some of its main applications. Designed specifically for newcomers to the field, this fully updated second edition emphasizes underlying physical concepts over mathematics. The first half covers the fundamentals of ultrasonic waves for isotropic media. Starting with bulk liquid and solid media, discussion extends to surface and plate effects, at which point the author introduces new modes such as Rayleigh and Lamb waves. This focus on only isotropic media simplifies the usually complex mathematics involved, enabling a clearer understanding of the underlying physics to avoid the complicated tensorial description characteristic of crystalline media. The second part of the book addresses a broad spectrum of industrial and research applications, including quartz crystal resonators, surface acoustic wave devices, MEMS and microacoustics, and acoustic sensors. It also provides a broad discussion on the use of ultrasonics for non-destructive evaluation. The author concentrates on the developing area of microacoustics, including exciting new work on the use of probe microscopy techniques in nanotechnology. Focusing on the physics of acoustic waves, as well as their propagation, technology, and applications, this book addresses viscoelasticity, as well as new concepts in acoustic microscopy. It updates coverage of ultrasonics in nature and developments in sonoluminescence, and it also compares new technologies, including use of atomic force acoustic microscopy and lasers. Highlighting both direct and indirect applications for readers working in neighboring disciplines, the author presents particularly important sections on the use of microacoustics and acoustic nanoprobes in next-generation devices and instruments.
Publisher: CRC Press
ISBN: 143985498X
Category : Science
Languages : en
Pages : 504
Book Description
Written at an intermediate level in a way that is easy to understand, Fundamentals and Applications of Ultrasonic Waves, Second Edition provides an up-to-date exposition of ultrasonics and some of its main applications. Designed specifically for newcomers to the field, this fully updated second edition emphasizes underlying physical concepts over mathematics. The first half covers the fundamentals of ultrasonic waves for isotropic media. Starting with bulk liquid and solid media, discussion extends to surface and plate effects, at which point the author introduces new modes such as Rayleigh and Lamb waves. This focus on only isotropic media simplifies the usually complex mathematics involved, enabling a clearer understanding of the underlying physics to avoid the complicated tensorial description characteristic of crystalline media. The second part of the book addresses a broad spectrum of industrial and research applications, including quartz crystal resonators, surface acoustic wave devices, MEMS and microacoustics, and acoustic sensors. It also provides a broad discussion on the use of ultrasonics for non-destructive evaluation. The author concentrates on the developing area of microacoustics, including exciting new work on the use of probe microscopy techniques in nanotechnology. Focusing on the physics of acoustic waves, as well as their propagation, technology, and applications, this book addresses viscoelasticity, as well as new concepts in acoustic microscopy. It updates coverage of ultrasonics in nature and developments in sonoluminescence, and it also compares new technologies, including use of atomic force acoustic microscopy and lasers. Highlighting both direct and indirect applications for readers working in neighboring disciplines, the author presents particularly important sections on the use of microacoustics and acoustic nanoprobes in next-generation devices and instruments.
Piezoelectric and Acoustic Materials for Transducer Applications
Author: Ahmad Safari
Publisher: Springer Science & Business Media
ISBN: 0387765409
Category : Technology & Engineering
Languages : en
Pages : 483
Book Description
The book discusses the underlying physical principles of piezoelectric materials, important properties of ferroelectric/piezoelectric materials used in today’s transducer technology, and the principles used in transducer design. It provides examples of a wide range of applications of such materials along with the appertaining rationales. With contributions from distinguished researchers, this is a comprehensive reference on all the pertinent aspects of piezoelectric materials.
Publisher: Springer Science & Business Media
ISBN: 0387765409
Category : Technology & Engineering
Languages : en
Pages : 483
Book Description
The book discusses the underlying physical principles of piezoelectric materials, important properties of ferroelectric/piezoelectric materials used in today’s transducer technology, and the principles used in transducer design. It provides examples of a wide range of applications of such materials along with the appertaining rationales. With contributions from distinguished researchers, this is a comprehensive reference on all the pertinent aspects of piezoelectric materials.
Physics for Medical Imaging Applications
Author: Yves Lemoigne
Publisher: Springer Science & Business Media
ISBN: 1402056494
Category : Science
Languages : en
Pages : 403
Book Description
This book introduces the fundamental aspects of digital imaging and covers four main themes: ultrasound techniques and imaging applications, magnetic resonance and MPJ in hospital, digital imaging with X-rays, and emission tomography (PET and SPECT). Each topic is developed by analyzing the underlying physics principles and their implementation, quality and safety aspects, clinical performance, and recent advancements in the field.
Publisher: Springer Science & Business Media
ISBN: 1402056494
Category : Science
Languages : en
Pages : 403
Book Description
This book introduces the fundamental aspects of digital imaging and covers four main themes: ultrasound techniques and imaging applications, magnetic resonance and MPJ in hospital, digital imaging with X-rays, and emission tomography (PET and SPECT). Each topic is developed by analyzing the underlying physics principles and their implementation, quality and safety aspects, clinical performance, and recent advancements in the field.
Ultrasonics
Author: Dale Ensminger
Publisher: CRC Press
ISBN: 1000994953
Category : Science
Languages : en
Pages : 904
Book Description
Updated, revised, and restructured to reflect the latest advances in science and applications, the fourth edition of this best-selling industry and research reference covers the fundamental physical acoustics of ultrasonics and transducers, with a focus on piezoelectric and magnetostrictive modalities. It then discusses the full breadth of ultrasonics applications involving low power (sensing) and high power (processing) for research, industrial, and medical use. This book includes new content covering computer modeling used for acoustic and elastic wave phenomena, including scattering, mode conversion, transmission through layered media, Rayleigh and Lamb waves and flexural plates, modern horn design tools, Langevin transducers, and material characterization. There is more attention on process monitoring and advanced nondestructive testing and evaluation (NDT/NDE), including phased array ultrasound (PAUT), long-range inspection, using guided ultrasonic waves (GUW), internally rotary inspection systems (IRIS), time-of-flight diffraction (TOFD), and acoustic emission (AE). These methods are discussed and applied to both metals and nonmetals using illustrations in various industries, including now additionally for food and beverage products. The topics of defect sizing, capabilities, and limitations, including the probability of detection (POD), are introduced. Three chapters provide a new treatment of high-power ultrasonics, for both fluids and solids, and again, with examples of industrial engineering, food and beverage, pharmaceuticals, petrochemicals, and other process applications. Expanded coverage is given to medical and biological applications, covering diagnostics, therapy, and, at the highest powers, surgery. Key Features Provides an overview of fundamental analysis and transducer technologies needed to design and develop both measurement and processing systems Considers applications in material characterization and metrology Covers ultrasonic nondestructive testing and evaluation and high-power ultrasonics, which involves interactions that change the state of material Highlights medical and biomedical applications of ultrasound, focusing on the physical acoustics and the technology employed for diagnosis, therapy, surgery, and research This book is intended for both the undergraduate and graduate scientists and engineers, as well as the working professional, who seeks to understand the fundamentals together with a holistic treatment of the field of ultrasonics and its diversity of applications.
Publisher: CRC Press
ISBN: 1000994953
Category : Science
Languages : en
Pages : 904
Book Description
Updated, revised, and restructured to reflect the latest advances in science and applications, the fourth edition of this best-selling industry and research reference covers the fundamental physical acoustics of ultrasonics and transducers, with a focus on piezoelectric and magnetostrictive modalities. It then discusses the full breadth of ultrasonics applications involving low power (sensing) and high power (processing) for research, industrial, and medical use. This book includes new content covering computer modeling used for acoustic and elastic wave phenomena, including scattering, mode conversion, transmission through layered media, Rayleigh and Lamb waves and flexural plates, modern horn design tools, Langevin transducers, and material characterization. There is more attention on process monitoring and advanced nondestructive testing and evaluation (NDT/NDE), including phased array ultrasound (PAUT), long-range inspection, using guided ultrasonic waves (GUW), internally rotary inspection systems (IRIS), time-of-flight diffraction (TOFD), and acoustic emission (AE). These methods are discussed and applied to both metals and nonmetals using illustrations in various industries, including now additionally for food and beverage products. The topics of defect sizing, capabilities, and limitations, including the probability of detection (POD), are introduced. Three chapters provide a new treatment of high-power ultrasonics, for both fluids and solids, and again, with examples of industrial engineering, food and beverage, pharmaceuticals, petrochemicals, and other process applications. Expanded coverage is given to medical and biological applications, covering diagnostics, therapy, and, at the highest powers, surgery. Key Features Provides an overview of fundamental analysis and transducer technologies needed to design and develop both measurement and processing systems Considers applications in material characterization and metrology Covers ultrasonic nondestructive testing and evaluation and high-power ultrasonics, which involves interactions that change the state of material Highlights medical and biomedical applications of ultrasound, focusing on the physical acoustics and the technology employed for diagnosis, therapy, surgery, and research This book is intended for both the undergraduate and graduate scientists and engineers, as well as the working professional, who seeks to understand the fundamentals together with a holistic treatment of the field of ultrasonics and its diversity of applications.
Medical Imaging
Author: Krzysztof Iniewski
Publisher: John Wiley & Sons
ISBN: 0470391642
Category : Science
Languages : en
Pages : 324
Book Description
A must-read for anyone working in electronics in the healthcare sector This one-of-a-kind book addresses state-of-the-art integrated circuit design in the context of medical imaging of the human body. It explores new opportunities in ultrasound, computed tomography (CT), magnetic resonance imaging (MRI), nuclear medicine (PET, SPECT), emerging detector technologies, circuit design techniques, new materials, and innovative system approaches. Divided into four clear parts and with contributions from a panel of international experts, Medical Imaging systematically covers: X-ray imaging and computed tomography–X-ray and CT imaging principles; Active Matrix Flat Panel Imagers (AMFPI) for diagnostic medical imaging applications; photon counting and integrating readout circuits; noise coupling in digital X-ray imaging Nuclear medicine–SPECT and PET imaging principles; low-noise electronics for radiation sensors Ultrasound imaging–Electronics for diagnostic ultrasonic imaging Magnetic resonance imaging–Magnetic resonance imaging principles; MRI technology
Publisher: John Wiley & Sons
ISBN: 0470391642
Category : Science
Languages : en
Pages : 324
Book Description
A must-read for anyone working in electronics in the healthcare sector This one-of-a-kind book addresses state-of-the-art integrated circuit design in the context of medical imaging of the human body. It explores new opportunities in ultrasound, computed tomography (CT), magnetic resonance imaging (MRI), nuclear medicine (PET, SPECT), emerging detector technologies, circuit design techniques, new materials, and innovative system approaches. Divided into four clear parts and with contributions from a panel of international experts, Medical Imaging systematically covers: X-ray imaging and computed tomography–X-ray and CT imaging principles; Active Matrix Flat Panel Imagers (AMFPI) for diagnostic medical imaging applications; photon counting and integrating readout circuits; noise coupling in digital X-ray imaging Nuclear medicine–SPECT and PET imaging principles; low-noise electronics for radiation sensors Ultrasound imaging–Electronics for diagnostic ultrasonic imaging Magnetic resonance imaging–Magnetic resonance imaging principles; MRI technology
5th Kuala Lumpur International Conference on Biomedical Engineering 2011
Author: Hua-Nong Ting
Publisher: Springer Science & Business Media
ISBN: 364221729X
Category : Technology & Engineering
Languages : en
Pages : 892
Book Description
The Biomed 2011 brought together academicians and practitioners in engineering and medicine in this ever progressing field. This volume presents the proceedings of this international conference which was hold in conjunction with the 8th Asian Pacific Conference on Medical and Biological Engineering (APCMBE 2011) on the 20th to the 23rd of June 2011 at Berjaya Times Square Hotel, Kuala Lumpur. The topics covered in the conference proceedings include: Artificial organs, bioengineering education, bionanotechnology, biosignal processing, bioinformatics, biomaterials, biomechanics, biomedical imaging, biomedical instrumentation, BioMEMS, clinical engineering, prosthetics.
Publisher: Springer Science & Business Media
ISBN: 364221729X
Category : Technology & Engineering
Languages : en
Pages : 892
Book Description
The Biomed 2011 brought together academicians and practitioners in engineering and medicine in this ever progressing field. This volume presents the proceedings of this international conference which was hold in conjunction with the 8th Asian Pacific Conference on Medical and Biological Engineering (APCMBE 2011) on the 20th to the 23rd of June 2011 at Berjaya Times Square Hotel, Kuala Lumpur. The topics covered in the conference proceedings include: Artificial organs, bioengineering education, bionanotechnology, biosignal processing, bioinformatics, biomaterials, biomechanics, biomedical imaging, biomedical instrumentation, BioMEMS, clinical engineering, prosthetics.