Author: Jerry E. Sergent
Publisher: McGraw-Hill Companies
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 778
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Book Description
Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.
Author: Tapan Gupta
Publisher: Wiley-Interscience
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 432
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Book Description
This is the first handbook on the fabrication and design of hybrid microelectronic circuits. * Deals with all aspects of the technology, design, layout and processing of materials. * Fills the need for a comprehensive survey of a widely-used technology.
Author: Charles A. Harper
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author: Joseph Alison King
Publisher: Artech House Publishers
ISBN:
Category : Science
Languages : en
Pages : 682
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Book Description
The result of a joint effort between representatives of private industry and academia, the publication is divided into sections on elements, alloys, insulators and compound semi-conductors. An index and bibliography are lacking. Numerous simple graphs and charts are provided, in fact most of the boo
Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Integrated circuits
Languages : en
Pages : 698
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Book Description
Author: Joseph A. King
Publisher:
ISBN: 9780608005744
Category :
Languages : en
Pages : 628
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Book Description
Author: Charles A. Harper
Publisher: McGraw-Hill Companies
ISBN:
Category : Science
Languages : en
Pages : 712
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Book Description
Author:
Publisher: ASM International
ISBN: 9780871702852
Category : Technology & Engineering
Languages : en
Pages : 1234
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Book Description
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Author: James J. Licari
Publisher: Elsevier
ISBN: 081551798X
Category : Technology & Engineering
Languages : en
Pages : 603
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Book Description
The Hybrid Microcircuit Technology Handbook integrates the many diverse technologies used in the design, fabrication, assembly, and testing of hybrid segments crucial to the success of producing reliable circuits in high yields. Among these are: resistor trimming, wire bonding, die attachment, cleaning, hermetic sealing, and moisture analysis. In addition to thin films, thick films, and assembly processes, important chapters on substrate selections, handling (including electrostatic discharge), failure analysis, and documentation are included. A comprehensive chapter of design guidelines will be of value to materials and process engineers, chemists, and electrical engineers who design and test hybrid circuits.
Author: John L. B. Walker
Publisher: Cambridge University Press
ISBN: 0521760100
Category : Technology & Engineering
Languages : en
Pages : 705
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Book Description
This is a one-stop guide for circuit designers and system/device engineers, covering everything from CAD to reliability.
