3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility PDF Download
Are you looking for read ebook online? Search for your book and save it on your Kindle device, PC, phones or tablets. Download 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility PDF full book. Access full book title 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility by Lih-Tyng Hwang. Download full books in PDF and EPUB format.
Author: Lih-Tyng Hwang
Publisher: John Wiley & Sons
ISBN: 1119289661
Category : Technology & Engineering
Languages : en
Pages : 602
Get Book Here
Book Description
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
Author: Lih-Tyng Hwang
Publisher: John Wiley & Sons
ISBN: 1119289661
Category : Technology & Engineering
Languages : en
Pages : 602
Get Book Here
Book Description
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
Author: Jia-Sheng Hong
Publisher: John Wiley & Sons
ISBN: 1118002121
Category : Technology & Engineering
Languages : en
Pages : 608
Get Book Here
Book Description
The first edition of “Microstrip Filters for RF/Microwave Applications” was published in 2001. Over the years the book has been well received and is used extensively in both academia and industry by microwave researchers and engineers. From its inception as a manuscript the book is almost 8 years old. While the fundamentals of filter circuits have not changed, further innovations in filter realizations and other applications have occurred with changes in the technology and use of new fabrication processes, such as the recent advances in RF MEMS and ferroelectric films for tunable filters; the use of liquid crystal polymer (LCP) substrates for multilayer circuits, as well as the new filters for dual-band, multi-band and ultra wideband (UWB) applications. Although the microstrip filter remains as the main transmission line medium for these new developments, there has been a new trend of using combined planar transmission line structures such as co-planar waveguide (CPW) and slotted ground structures for novel physical implementations beyond the single layer in order to achieve filter miniaturization and better performance. Also, over the years, practitioners have suggested topics that should be added for completeness, or deleted in some cases, as they were not very useful in practice. In view of the above, the authors are proposing a revised version of the “Microstrip Filters for RF/Microwave Applications” text and a slightly changed book title of “Planar Filters for RF/Microwave Applications” to reflect the aforementioned trends in the revised book.
Author: Shenglin Ma
Publisher: Elsevier
ISBN: 0323996035
Category : Technology & Engineering
Languages : en
Pages : 294
Get Book Here
Book Description
TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology
Author: Duixian Liu
Publisher: John Wiley & Sons
ISBN: 1119556635
Category : Technology & Engineering
Languages : en
Pages : 416
Get Book Here
Book Description
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
Author: T. Laxminidhi
Publisher: Springer Nature
ISBN: 9813340584
Category : Technology & Engineering
Languages : en
Pages : 412
Get Book Here
Book Description
This book comprises the peer-reviewed proceedings of the International Conference on Communications, Signal Processing and VLSI (IC2SV) 2019. It explores the recent advances in the fields of signal and image processing, wireless and mobile communications, embedded systems, VLSI, microwave, and antennas. The contents provide insights into present technological challenges and discusses the emerging applications of different imaging techniques and communications systems. Given the range of topics covered, this book can be useful for students as well as researchers interested in the area of communications, signal processing, and VLSI technologies.
Author: Syed A. Ahson
Publisher: CRC Press
ISBN: 1420045482
Category : Technology & Engineering
Languages : en
Pages : 248
Get Book Here
Book Description
As the demand for broadband services continues to grow worldwide, traditional solutions, such as digital cable and fiber optics, are often difficult and expensive to implement, especially in rural and remote areas. The emerging WiMAX system satisfies the growing need for high data-rate applications such as voiceover IP, video conferencing, interactive gaming, and multimedia streaming. WiMAX deployments not only serve residential and enterprise users but can also be deployed as a backhaul for Wi-Fi hotspots or 3G cellular towers. By providing affordable wireless broadband access, the technology of WiMAX will revolutionize broadband communications in the developed world and bridge the digital divide in developing countries. Part of the WiMAX Handbook, this volume focuses on the applications of WiMAX. The book describes the logical architecture of IEEE 802.16, introduces some of the main IEEE 802.16 family standards, compares WiMAX to Wi-Fi, and studies the feasibility of supporting VoIP over WiMAX. It also looks at the residential use of WiMAX as well as the strategies of using WiMAX in remote locales and rural communities. In addition, the book examines the backhaul requirements of a large fixed wireless network and the problem of centralized routing and scheduling for IEEE 802.16 mesh networks. With the revolutionary technology of WiMAX, the lives of many will undoubtedly improve, thereby leading to greater economic empowerment.
Author: Vesna Crnojević-Bengin
Publisher: Cambridge University Press
ISBN: 1107081971
Category : Technology & Engineering
Languages : en
Pages : 331
Get Book Here
Book Description
The first of its kind, this comprehensive work details the theory and practical design of new multi-band filters.
Author: Electrochemical Society. Meeting
Publisher: The Electrochemical Society
ISBN: 9781566774123
Category : Technology & Engineering
Languages : en
Pages : 332
Get Book Here
Book Description
Author: Guennadi A. Kouzaev
Publisher: Springer Science & Business Media
ISBN: 3642303102
Category : Technology & Engineering
Languages : en
Pages : 542
Get Book Here
Book Description
This text, directed to the microwave engineers and Master and PhD students, is on the use of electromagnetics to the development and design of advanced integrated components distinguished by their extended field of applications. The results of hundreds of authors scattered in numerous journals and conference proceedings are carefully reviewed and classed. Several chapters are to refresh the knowledge of readers in advanced electromagnetics. New techniques are represented by compact electromagnetic–quantum equations which can be used in modeling of microwave-quantum integrated circuits of future In addition, a topological method to the boundary value problem analysis is considered with the results and examples. One extended chapter is for the development and design of integrated components for extended bandwidth applications, and the technology and electromagnetic issues of silicon integrated transmission lines, transitions, filters, power dividers, directional couplers, etc are considered. Novel prospective interconnects based on different physical effects are reviewed as well. The ideas of topology is applicable to the electromagnetic signaling and computing, when the vector field maps can carry discrete information, and this area and the results in topological signaling obtained by different authors are analyzed, including the recently designed predicate logic processor operating spatially represented signal units. The book is rich of practical examples, illustrations, and references and useful for the specialists working at the edge of contemporary technology and electromagnetics.
Author: Tzyh-Ghuang Ma
Publisher: John Wiley & Sons
ISBN: 1118975723
Category : Technology & Engineering
Languages : en
Pages : 214
Get Book Here
Book Description
An original advanced level reference appealing to both the microwave and antenna communities An overview of the research activity devoted to the synthesis of transmission lines by means of electrically small planar elements, highlighting the main microwave applications and the potential for circuit miniaturization Showcases the research of top experts in the field Presents innovative topics on synthesized transmission lines, which represent fundamental elements in microwave and mm-wave integrated circuits, including on-chip integration Covers topics that are related to the microwave community (transmission lines), and topics that are related to the antenna community (phased arrays), broadening the readership appeal
