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Author: Daniel Post
Publisher: Springer Science & Business Media
ISBN: 1461243343
Category : Technology & Engineering
Languages : en
Pages : 451
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Book Description
A description of both the theory and practice of physical measurements that use high-sensitivity moiré - principally moiré interferometry. The focus here is on the mechanics and micromechanics of materials and structural elements and the book includes new studies published for the first time. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. All the methods can be applied for whole-field measurements on nearly and solid bodies. This reader-friendly book will serve engineers and scientists who are concerned with measurements of real phenomena, while also stimulating students to pursue the treasures of experimental analysis.
Author: Daniel Post
Publisher: Springer Science & Business Media
ISBN: 1461243343
Category : Technology & Engineering
Languages : en
Pages : 451
Get Book Here
Book Description
A description of both the theory and practice of physical measurements that use high-sensitivity moiré - principally moiré interferometry. The focus here is on the mechanics and micromechanics of materials and structural elements and the book includes new studies published for the first time. Diverse fields are addressed: advanced composite materials, thermal stresses, electronic packaging, fracture, metallurgy, time-dependence, strain gage calibration. All the methods can be applied for whole-field measurements on nearly and solid bodies. This reader-friendly book will serve engineers and scientists who are concerned with measurements of real phenomena, while also stimulating students to pursue the treasures of experimental analysis.
Author: C.A. Walker
Publisher: CRC Press
ISBN: 1420034219
Category : Science
Languages : en
Pages : 520
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Book Description
Since its development in the late 1970s, the Moire Fringe method has become a standard technique for the measurement of the behavior of materials and structures. Edited by one of the co-inventors of the technique, the Handbook of Moire Measurement brings together a series of extended case studies from recognized experts in the field. The emphasis i
Author: Cesar A. Sciammarella
Publisher: John Wiley & Sons
ISBN: 1119970091
Category : Science
Languages : en
Pages : 769
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Book Description
Experimental solid mechanics is the study of materials to determine their physical properties. This study might include performing a stress analysis or measuring the extent of displacement, shape, strain and stress which a material suffers under controlled conditions. In the last few years there have been remarkable developments in experimental techniques that measure shape, displacement and strains and these sorts of experiments are increasingly conducted using computational techniques. Experimental Mechanics of Solids is a comprehensive introduction to the topics, technologies and methods of experimental mechanics of solids. It begins by establishing the fundamentals of continuum mechanics, explaining key areas such as the equations used, stresses and strains, and two and three dimensional problems. Having laid down the foundations of the topic, the book then moves on to look at specific techniques and technologies with emphasis on the most recent developments such as optics and image processing. Most of the current computational methods, as well as practical ones, are included to ensure that the book provides information essential to the reader in practical or research applications. Key features: Presents widely used and accepted methodologies that are based on research and development work of the lead author Systematically works through the topics and theories of experimental mechanics including detailed treatments of the Moire, Speckle and holographic optical methods Includes illustrations and diagrams to illuminate the topic clearly for the reader Provides a comprehensive introduction to the topic, and also acts as a quick reference guide This comprehensive book forms an invaluable resource for graduate students and is also a point of reference for researchers and practitioners in structural and materials engineering.
Author: W. Steven Johnson
Publisher: ASTM International
ISBN: 0803109938
Category : Adhesive joints
Languages : en
Pages : 317
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Book Description
Author: Daining Fang
Publisher: Springer Science & Business Media
ISBN: 3642300871
Category : Science
Languages : en
Pages : 430
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Book Description
Fracture Mechanics of Piezoelectric and Ferroelectric Solids presents a systematic and comprehensive coverage of the fracture mechanics of piezoelectric/ferroelectric materials, which includes the theoretical analysis, numerical computations and experimental observations. The main emphasis is placed on the mechanics description of various crack problems such static, dynamic and interface fractures as well as the physical explanations for the mechanism of electrically induced fracture. The book is intended for postgraduate students, researchers and engineers in the fields of solid mechanics, applied physics, material science and mechanical engineering. Dr. Daining Fang is a professor at the School of Aerospace, Tsinghua University, China; Dr. Jinxi Liu is a professor at the Department of Engineering Mechanics, Shijiazhuang Railway Institute, China.
Author: Gary L. Cloud
Publisher: Cambridge University Press
ISBN: 9780521636421
Category : Science
Languages : en
Pages : 526
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Book Description
Fundamental measurement problems in engineering, mechanics, manufacturing, and physics are now being solved by powerful optical methods. This book presents a lucid, up-to-date discussion of these optical methods. Beginning from a firm base in modern optics, the book proceeds through relevant theory of interference and diffraction and integrates this theory with descriptions of laboratory techniques and apparatus. Among the techniques discussed are classical interferometry, photoelasticity, geometric moire, spatial filtering, moire interferometry, holography, holographic interferometry, laser speckle interferometry, and video-based speckle methods. By providing a firm base in the physical principles and at the same time allowing the reader to perform meaningful experiments related to the topic being studied, the book offers a unique user-oriented approach that will appeal to students, researchers and practising engineers.
Author: I. M. Allison
Publisher: Taylor & Francis US
ISBN: 9789058090157
Category : Engineering
Languages : en
Pages : 800
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Book Description
Author: Wolfgang Osten
Publisher: CRC Press
ISBN: 1420019163
Category : Science
Languages : en
Pages : 524
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Book Description
Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moiré techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts. Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.
Author: E.E. Gdoutos
Publisher: Springer Science & Business Media
ISBN: 0306484102
Category : Science
Languages : en
Pages : 834
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Book Description
This book contains 71 papers presented at the symposium on “Recent Advances in Experimental Mechanics” which was organized in honor of Professor Isaac M. Daniel. The symposium took place at Virginia Polytechnic Institute and State University on th June 23-28, 2002, in conjunction with the 14 US National Congress of Applied Mechanics. The book is a tribute to Isaac Daniel, a pioneer of experimental mechanics and composite materials, in recognition of his continuous, original, diversified and outstanding contributions for half a century. The book consists of invited papers written by leading experts in the field. It contains original contributions concerning the latest developments in experimental mechanics. It covers a wide range of subjects, including optical methods of stress analysis (photoelasticity, moiré, etc.), composite materials, sandwich construction, fracture mechanics, fatigue and damage, nondestructive evaluation, dynamic problems, fiber optic sensors, speckle metrology, digital image processing, nanotechnology, neutron diffraction and synchrotron radiation methods. The papers are arranged in the following nine sections: Mechanical characterization of material behavior, composite materials, fracture and fatigue, optical methods, n- destructive evaluation, neutron diffraction and synchrotron radiation methods, hybrid methods, composite structures, and structural testing and analysis.
Author: John Lau
Publisher: Springer Science & Business Media
ISBN: 1468477676
Category : Technology & Engineering
Languages : en
Pages : 904
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Book Description
Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
