Handbook of VLSI Microlithography, 2nd Edition PDF Download
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Author: John N. Helbert
Publisher: Cambridge University Press
ISBN: 0080946801
Category : Technology & Engineering
Languages : en
Pages : 1026
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Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: John N. Helbert
Publisher: Cambridge University Press
ISBN: 0080946801
Category : Technology & Engineering
Languages : en
Pages : 1026
Get Book Here
Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production. Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: John N. Helbert
Publisher: William Andrew
ISBN: 0815517807
Category : Technology & Engineering
Languages : en
Pages : 1025
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Book Description
This handbook gives readers a close look at the entire technology of printing very high resolution and high density integrated circuit (IC) patterns into thin resist process transfer coatingsùincluding optical lithography, electron beam, ion beam, and x-ray lithography. The book's main theme is the special printing process needed to achieve volume high density IC chip production, especially in the Dynamic Random Access Memory (DRAM) industry. The book leads off with a comparison of various lithography methods, covering the three major patterning parameters of line/space, resolution, line edge and pattern feature dimension control. The book's explanation of resist and resist process equipment technology may well be the first practical description of the relationship between the resist process and equipment parameters. The basics of resist technology are completely coveredùincluding an entire chapter on resist process defectivity and the potential yield limiting effect on device production.Each alternative lithographic technique and testing method is considered and evaluated: basic metrology including optical, scanning-electron-microscope (SEM) techniques and electrical test devices, along with explanations of actual printing tools and their design, construction and performance. The editor devotes an entire chapter to today's sophisticated, complex electron-beam printers, and to the emerging x-ray printing technology now used in high-density CMOS devices. Energetic ion particle printing is a controllable, steerable technology that does not rely on resist, and occupies a final section of the handbook.
Author: Olga A. Shenderova
Publisher: William Andrew
ISBN: 0815519427
Category : Science
Languages : en
Pages : 621
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Book Description
Ultrananocrystalline Diamond: Syntheses, Properties, and Applications is a unique practical reference handbook that brings together the basic science of nanoscale carbon structures, particularly its diamond phase, with detailed information on nanodiamond synthesis, properties, and applications. Here you will learn about UNCD in its two forms, as a dispersed powder made by detonation techniques and as a chemical vapor deposited film. You will also learn about the superior mechanical, tribological, transport, electrochemical, and electron emission properties of UNCD for a wide range of applications including MEMS, NEMS, surface acoustic wave (SAW) devices, electrochemical sensors, coatings for field emission arrays, photonic and RF switching, biosensors, and neural prostheses, and more. This ôEverything about Ultra-nanocrystalline Diamondö book with 16 chapters is written by leading experts worldwide. It is for everyone who researches carbon nanostructures, everyone who produces them, everyone who characterizes them, and everyone who builds devices using them.
Author: Carl C. Koch
Publisher: William Andrew
ISBN: 0815518420
Category : Technology & Engineering
Languages : en
Pages : 785
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Book Description
Nanostructured materials are one of the highest profile classes of materials in science and engineering today, and will continue to be well into the future. Potential applications are widely varied, including washing machine sensors, drug delivery devices to combat avian flu, and more efficient solar panels. Broad and multidisciplinary, the field includes multilayer films, atomic clusters, nanocrystalline materials, and nanocomposites having remarkable variations in fundamental electrical, optic, and magnetic properties.Nanostructured Materials: Processing, Properties and Applications, 2nd Edition is an extensive update to the exceptional first edition snapshot of this rapidly advancing field. Retaining the organization of the first edition, Part 1 covers the important synthesis and processing methods for the production of nanocrystalline materials. Part 2 focuses on selected properties of nanostructured materials. Potential or existing applications are described as appropriate throughout the book. The second edition has been updated throughout for the latest advances and includes two additional chapters.
Author: Charles Bishop
Publisher: William Andrew
ISBN: 0815519478
Category : Technology & Engineering
Languages : en
Pages : 497
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Book Description
This new book from William Andrew Publishing is the only practical reference available for anyone employing the roll-to-roll deposition process. Vacuum Deposition onto Webs, Films and Foils is an expansive journey of the process; benefiting manufacturing efficiency, unit cost reduction, and financial results. It is a sweeping approach to the total design of the vacuum deposition process written by a successful and world renowned consultant with three decades of experience.Roll-to-roll deposition processing is a high growth industry and this reference covers a wide variety of important industrial products that use vacuum deposited coatings, including: optical storage devices, metallized packaging films, energy conservation windows, electronic information displays, and magnetic electronic article surveillance (EAS) tags among many others. This book is a must-have for roll-to-roll machine operators, process engineers, and research and development engineers throughout industry.The book provides a broad appreciation of roll-to-roll vacuum deposition systems and processes. It will encourage a more comprehensive look from material supply through to the downstream processes that the product will encounter. It is a truly unique reference written to guide operators and engineers as an onsite consultant would.
Author: Wolfram Schnabel
Publisher: John Wiley & Sons
ISBN: 3527611037
Category : Technology & Engineering
Languages : en
Pages : 396
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Book Description
This first book to focus on the important and topical effect of light on polymeric materials reflects the multidisciplinary nature of the topic, building a bridge between polymer chemistry and physics, photochemistry and photophysics, and materials science. Written by one experienced author, a consistent approach is maintained throughout, covering such applications as nonlinear optical materials, core materials for optical waveguides, photoresists in the production of computer chips, photoswitches and optical memories. Advanced reading for polymer, physical and organic chemists, manufacturers of optoelectronic devices, chemical engineers, and materials scientists.
Author: Alberto Pique
Publisher: Elsevier
ISBN: 0080504647
Category : Technology & Engineering
Languages : en
Pages : 754
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Book Description
Direct-Write Technologies covers applications, materials, and the techniques in using direct-write technologies. This book provides an overview of the different direct write techniques currently available, as well as a comparison between the strengths and special attributes for each of the techniques. The techniques described open the door for building prototypes and testing materials. The book also provides an overview of the state-of-the-art technology involved in this field. Basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. Others in this or related fields will want the book to read the introductory material summarizing isuses common to all approaches, in order to compare and contrast different techniques. Everyday applications include electronic components and sensors, especially chemical and biosensors. There is a wide range of research and development problems requiring state-of-the-art direct write tools. This book will appeal to basic researchers and development engineers in university engineering departments and at industrial and national research laboratories. This text should appeal equally well in the United States, Asia, and Europe. Both basic academic researchers and industrial development engineers who pattern thin film materials will want to have this text on their shelves as a resource for specific applications. - An overview of the different direct write techniques currently available - A comparison between the strengths and special attributes for each of the techniques - An overview of the state-of-the-art technology involved in this field
Author: Krishna Seshan
Publisher: William Andrew
ISBN: 0815517785
Category : Technology & Engineering
Languages : en
Pages : 659
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Book Description
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques.Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
Author: Kiyotaka Wasa
Publisher: William Andrew
ISBN: 0815519311
Category : Technology & Engineering
Languages : en
Pages : 533
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Book Description
An invaluable resource for industrial science and engineering newcomers to sputter deposition technology in thin film production applications, this book is rich in coverage of both historical developments and the newest experimental and technological information about ceramic thin films, a key technology for nano-materials in high-speed information applications and large-area functional coating such as automotive or decorative painting of plastic parts, among other topics. In seven concise chapters, the book thoroughly reviews basic thin film technology and deposition processes, sputtering processes, structural control of compound thin films, and microfabrication by sputtering.
Author: Whitson G. Waldo
Publisher: First Books
ISBN: 1592994830
Category : Business & Economics
Languages : en
Pages : 314
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Book Description
A Fully Integrated Presentation of New Hardware and Software Product Introductions Using Program Management Methodologies for System on Chip Platforms If you're an executive, manager, or engineer in the semiconductor, software, or systems industries, this book provides conceptual views ranging from the design of integrated circuits or systems on a chip, through fabrication, to integration of chips onto boards, and through development of enablement and runtime software for system and platform deliveries. Special features included this book are: - Program management methodologies - General management fundamentals - An overview of leadership principles - Basic discrete device technology - Internal structure and operation of some common logic gates - Basic integrated circuit design concepts, building blocks, and flow - Chip packaging technologies - Details of the fabrication process for integrated circuits - Printed circuit board design, manufacture, and test - Software design, development, and test - Integrated circuit test, silicon validation, and device qualification - Program management applications bringing it all together The book explores interactions and dependencies of technologies that impact systems and platforms. This is a valuable resource to learn these technologies or to use as a reference.
