Handbook of Silicon Semiconductor Metrology PDF Download
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Author: Alain C. Diebold
Publisher: CRC Press
ISBN: 0203904540
Category : Technology & Engineering
Languages : en
Pages : 703
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Book Description
Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay
Author: Alain C. Diebold
Publisher: CRC Press
ISBN: 0203904540
Category : Technology & Engineering
Languages : en
Pages : 703
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Book Description
Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay
Author: Yoshio Nishi
Publisher: CRC Press
ISBN: 1420017667
Category : Technology & Engineering
Languages : en
Pages : 1722
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Book Description
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author: Markku Tilli
Publisher: Elsevier
ISBN: 0815519885
Category : Technology & Engineering
Languages : en
Pages : 670
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Book Description
A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: - Silicon as MEMS material - Material properties and measurement techniques - Analytical methods used in materials characterization - Modeling in MEMS - Measuring MEMS - Micromachining technologies in MEMS - Encapsulation of MEMS components - Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. - Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. - Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. - Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. - Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. - Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques - Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs - Discusses properties, preparation, and growth of silicon crystals and wafers - Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Author: Karen Reinhardt
Publisher: William Andrew
ISBN: 0815517734
Category : Technology & Engineering
Languages : en
Pages : 749
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Book Description
The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. - Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits - As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries - Covers processes and equipment, as well as new materials and changes required for the surface conditioning process - Editors are two of the top names in the field and are both extensively published - Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol
Author: David J. Whitehouse
Publisher: CRC Press
ISBN: 1420082027
Category : Science
Languages : en
Pages : 982
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Book Description
Since the publication of the first edition, miniaturization and nanotechnology have become inextricably linked to traditional surface geometry and metrology. This interdependence of scales has had profound practical implications.Updated and expanded to reflect many new developments, Handbook of Surface and Nanometrology, Second Edition determines h
Author: Bernd O. Kolbesen
Publisher: The Electrochemical Society
ISBN: 9781566773485
Category : Technology & Engineering
Languages : en
Pages : 572
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Book Description
.".. ALTECH 2003 was Symposium J1 held at the 203rd Meeting of the Electrochemical Society in Paris, France from April 27 to May 2, 2003 ... Symposium M1, Diagnostic Techniques for Semiconductor Materials and Devices, was part of the 202nd Meeting of the Electrochemical Society held in Salt Lake City, Utah, from October 21 to 25, 2002 ..."--p. iii.
Author: D. Keith Bowen
Publisher: CRC Press
ISBN: 1420005650
Category : Technology & Engineering
Languages : en
Pages : 297
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Book Description
The scales involved in modern semiconductor manufacturing and microelectronics continue to plunge downward. Effective and accurate characterization of materials with thicknesses below a few nanometers can be achieved using x-rays. While many books are available on the theory behind x-ray metrology (XRM), X-Ray Metrology in Semiconductor Manufacturing is the first book to focus on the practical aspects of the technology and its application in device fabrication and solving new materials problems. Following a general overview of the field, the first section of the book is organized by application and outlines the techniques that are best suited to each. The next section delves into the techniques and theory behind the applications, such as specular x-ray reflectivity, diffraction imaging, and defect mapping. Finally, the third section provides technological details of each technique, answering questions commonly encountered in practice. The authors supply real examples from the semiconductor and magnetic recording industries as well as more than 150 clearly drawn figures to illustrate the discussion. They also summarize the principles and key information about each method with inset boxes found throughout the text. Written by world leaders in the field, X-Ray Metrology in Semiconductor Manufacturing provides real solutions with a focus on accuracy, repeatability, and throughput.
Author: Dieter K. Schroder
Publisher: John Wiley & Sons
ISBN: 0471739065
Category : Technology & Engineering
Languages : en
Pages : 800
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Book Description
This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Author: Andrew Sarangan
Publisher: CRC Press
ISBN: 1315353423
Category : Technology & Engineering
Languages : en
Pages : 299
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Book Description
This book is designed to introduce typical cleanroom processes, techniques, and their fundamental principles. It is written for the practicing scientist or engineer, with a focus on being able to transition the information from the book to the laboratory. Basic theory such as electromagnetics and electrochemistry is described in as much depth as necessary to understand and explain the current practice and their limitations. Examples from various areas of interest will be covered, such as the fabrication of photonic devices including photo detectors, waveguides, and optical coatings, which are not commonly found in other fabrication texts.
Author: Waqar Ahmed
Publisher: William Andrew
ISBN: 0815519788
Category : Technology & Engineering
Languages : en
Pages : 413
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Book Description
Nanotechnology is a technology on the verge of commercialization. In this important work, an unrivalled team of international experts provides an exploration of the emerging nanotechnologies that are poised to make the nano-revolution a reality in the manufacturing sector. From their different perspectives, the contributors explore how developments in nanotechnology are transforming areas as diverse as medicine, advanced materials, energy, electronics and agriculture. Key topics covered include: Characterization of nanostructures Bionanotechnology Nanoelectronics Micro- and nanomachining Self-assembly techniques New applications of carbon nanotubes Environmental and health impacts This book provides an important and in-depth guide to the applications and impact of nanotechnology to different manufacturing sectors. As such, it will find a broad readership, from R&D scientists and engineers to venture capitalists. About the Authors Waqar Ahmed is Chair of Nanotechnology & Advanced Manufacturing and the Director of the Institute of Advanced Manufacturing and Innovation at the University of Central Lancashire, UK. He has contributed to the wider industrial adoption of surface coating solutions through fundamental research and modeling of gas phase processes in CVD and studies of tribological behavior. Mark J. Jackson is a Professor at the Birck Nanotechnology Center and Center for Advanced Manufacturing, College of Technology at Purdue University. Dr Jackson is active in research work concerned with understanding the properties of materials in the field of microscale metal cutting, micro- and nanoabrasive machining, and laser micromachining. He is also involved in developing next generation manufacturing processes and biomedical engineering. Explains how to use biological pathways to produce nanoelectric devices Presents data on new, experimental designs Discusses the history of carbon nanotubes and how they are synthesized to fabricate novel nanostructures (incl. data on laser ablation) Extensive use of illustrations, tables, and figures throughout
