Author: Rao Tummala
Publisher: McGraw-Hill Education
ISBN: 9781259861550
Category : Technology & Engineering
Languages : en
Pages : 848
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Book Description
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. A fully updated, comprehensive guide to microelectronic device and systems packaging principles and practices This thoroughly revised book offers the latest, comprehensive fundamentals in device and systems packaging technologies and applications. You will get in-depth explanations of the 15 core packaging technologies that make up any electronic system, including electrical design for power, signal, and EMI; thermal design by conduction, convection,and radiation heat transfer; thermo-mechanical failures and reliability;advanced packaging materials at micro and nanoscales; ceramic, organic, glass,and silicon substrates. This resource also discusses passive components such as capacitors, inductors, and resistors and their proximity integration with actives; chip-to-package interconnections and assembly; wafer and panel embedding technologies; 3D packaging with and without TS; RF and millimeter-wave packaging; role of optoelectronics; mems and sensor packaging;encapsulation, molding and sealing; and printed wiring board and its assembly to form end-product systems. Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition introduces the concept of Moore’s Law for packaging, as Moore’s Law for ICs is coming to an end due to physical, material, electrical, and financial limitations. Moore’s Law for Packaging (MLP) can be viewed as interconnecting and integrating many smaller chips with high aggregate transistor density, at higher performance and lower cost than Moore’s Law for ICs. This book lays the groundwork for Moore’s Law for Packaging by showing how I/Os have evolved from one package family node to the next, starting with
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 1259861562
Category : Technology & Engineering
Languages : en
Pages : 849
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Book Description
A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level. You will get in-depth guidance on the latest technologies from academic and industry leaders. New chapters cover topics highly relevant to today's small and ultra-small systems. Fundamentals of Microsystems Packaging, Second Edition, discusses the entire field, from wafer to systems, and clearly explains every major contributing technology. The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Microelectronics, photonics, MEMS, sensors, RF, and wireless technologies are fully covered. • Covers the electrical, mechanical, chemical, and materials aspects of each technology • Contains examples of all common configurations and technologies • Written by the leading author in the field
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071500596
Category : Technology & Engineering
Languages : en
Pages : 979
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Book Description
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author: John H. Lau
Publisher: Springer
ISBN: 9811372241
Category : Technology & Engineering
Languages : en
Pages : 381
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Book Description
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Author: Rao Tummala
Publisher: McGraw Hill Professional
ISBN: 0071593322
Category : Technology & Engineering
Languages : en
Pages : 807
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Book Description
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Author: Masuo Hosokawa
Publisher: Elsevier
ISBN: 008055802X
Category : Technology & Engineering
Languages : en
Pages : 645
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Book Description
Nanoparticle technology, which handles the preparation, processing, application and characterisation of nanoparticles, is a new and revolutionary technology. It becomes the core of nanotechnology as an extension of the conventional Fine Particle / Powder Technology. Nanoparticle technology plays an important role in the implementation of nanotechnology in many engineering and industrial fields including electronic devices, advanced ceramics, new batteries, engineered catalysts, functional paint and ink, Drug Delivery System, biotechnology, etc.; and makes use of the unique properties of the nanoparticles which are completely different from those of the bulk materials.This new handbook is the first to explain complete aspects of nanoparticles with many application examples showing their advantages and advanced development. There are handbooks which briefly mention the nanosized particles or their related applications, but no handbook describing the complete aspects of nanoparticles has been published so far.The handbook elucidates of the basic properties of nanoparticles and various nanostructural materials with their characterisation methods in the first part. It also introduces more than 40 examples of practical and potential uses of nanoparticles in the later part dealing with applications. It is intended to give readers a clear picture of nanoparticles as well as new ideas or hints on their applications to create new materials or to improve the performance of the advanced functional materials developed with the nanoparticles.* Introduces all aspects of nanoparticle technology, from the fundamentals to applications.* Includes basic information on the preparation through to the characterization of nanoparticles from various viewpoints * Includes information on nanostructures, which play an important role in practical applications.
Author: Gabor L. Hornyak
Publisher: CRC Press
ISBN: 142004804X
Category : Technology & Engineering
Languages : en
Pages : 812
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Book Description
WINNER 2009 CHOICE AWARD OUTSTANDING ACADEMIC TITLE! Nanotechnology is no longer a subdiscipline of chemistry, engineering, or any other field. It represents the convergence of many fields, and therefore demands a new paradigm for teaching. This textbook is for the next generation of nanotechnologists. It surveys the field’s broad landscape, exploring the physical basics such as nanorheology, nanofluidics, and nanomechanics as well as industrial concerns such as manufacturing, reliability, and safety. The authors then explore the vast range of nanomaterials and systematically outline devices and applications in various industrial sectors. This color text is an ideal companion to Introduction to Nanoscience by the same group of esteemed authors. Both titles are also available as the single volume Introduction to Nanoscience and Nanotechnology Qualifying instructors who purchase either of these volumes (or the combined set) are given online access to a wealth of instructional materials. These include detailed lecture notes, review summaries, slides, exercises, and more. The authors provide enough material for both one- and two-semester courses.
Author: Hong Xiao
Publisher:
ISBN: 9780130224040
Category : Semiconductor industry
Languages : en
Pages : 0
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Book Description
For courses in Semiconductor Manufacturing Technology, IC Fabrication Technology, and Devices: Conventional Flow. This up-to-date text on semiconductor manufacturing processes takes into consideration the rapid development of the industry's technology. It thoroughly describes the complicated and new IC chip fabrication processes in detail with minimum mathematics, physics, and chemistry. Advanced technologies are covered along with older ones to assist students in understanding the development processes from a historic point of view.
Author: Mike Tooley
Publisher: Routledge
ISBN: 100073398X
Category : Technology & Engineering
Languages : en
Pages : 1170
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Book Description
Electronics explained in one volume, using both theoretical and practical applications. Mike Tooley provides all the information required to get to grips with the fundamentals of electronics, detailing the underpinning knowledge necessary to appreciate the operation of a wide range of electronic circuits, including amplifiers, logic circuits, power supplies and oscillators. The 5th edition includes an additional chapter showing how a wide range of useful electronic applications can be developed in conjunction with the increasingly popular Arduino microcontroller, as well as a new section on batteries for use in electronic equipment and some additional/updated student assignments. The book's content is matched to the latest pre-degree level courses (from Level 2 up to, and including, Foundation Degree and HND), making this an invaluable reference text for all study levels, and its broad coverage is combined with practical case studies based in real-world engineering contexts. In addition, each chapter includes a practical investigation designed to reinforce learning and provide a basis for further practical work. A companion website at http://www.key2electronics.com offers the reader a set of spreadsheet design tools that can be used to simplify circuit calculations, as well as circuit models and templates that will enable virtual simulation of circuits in the book. These are accompanied by online self-test multiple choice questions for each chapter with automatic marking, to enable students to continually monitor their own progress and understanding. A bank of online questions for lecturers to set as assignments is also available.
Author: P.J. Fellows
Publisher: Elsevier
ISBN: 1845696344
Category : Technology & Engineering
Languages : en
Pages : 932
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Book Description
The first edition of Food processing technology was quickly adopted as the standard text by many food science and technology courses. This completely revised and updated third edition consolidates the position of this textbook as the best single-volume introduction to food manufacturing technologies available. This edition has been updated and extended to include the many developments that have taken place since the second edition was published. In particular, advances in microprocessor control of equipment, 'minimal' processing technologies, functional foods, developments in 'active' or 'intelligent' packaging, and storage and distribution logistics are described. Technologies that relate to cost savings, environmental improvement or enhanced product quality are highlighted. Additionally, sections in each chapter on the impact of processing on food-borne micro-organisms are included for the first time. - Introduces a range of processing techniques that are used in food manufacturing - Explains the key principles of each process, including the equipment used and the effects of processing on micro-organisms that contaminate foods - Describes post-processing operations, including packaging and distribution logistics
