Author: M. Garfinkel
Publisher:
ISBN:
Category :
Languages : en
Pages : 92
Book Description
Floating substrate process
Author: M. Garfinkel
Publisher:
ISBN:
Category :
Languages : en
Pages : 92
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 92
Book Description
CMOS Memory Circuits
Author: Tegze P. Haraszti
Publisher: Springer Science & Business Media
ISBN: 0306470357
Category : Technology & Engineering
Languages : en
Pages : 567
Book Description
CMOS Memory Circuits is a systematic and comprehensive reference work designed to aid in the understanding of CMOS memory circuits, architectures, and design techniques. CMOS technology is the dominant fabrication method and almost the exclusive choice for semiconductor memory designers. Both the quantity and the variety of complementary-metal-oxide-semiconductor (CMOS) memories are staggering. CMOS memories are traded as mass-products worldwide and are diversified to satisfy nearly all practical requirements in operational speed, power, size, and environmental tolerance. Without the outstanding speed, power, and packing density characteristics of CMOS memories, neither personal computing, nor space exploration, nor superior defense systems, nor many other feats of human ingenuity could be accomplished. Electronic systems need continuous improvements in speed performance, power consumption, packing density, size, weight, and costs. These needs continue to spur the rapid advancement of CMOS memory processing and circuit technologies. CMOS Memory Circuits is essential for those who intend to (1) understand, (2) apply, (3) design and (4) develop CMOS memories.
Publisher: Springer Science & Business Media
ISBN: 0306470357
Category : Technology & Engineering
Languages : en
Pages : 567
Book Description
CMOS Memory Circuits is a systematic and comprehensive reference work designed to aid in the understanding of CMOS memory circuits, architectures, and design techniques. CMOS technology is the dominant fabrication method and almost the exclusive choice for semiconductor memory designers. Both the quantity and the variety of complementary-metal-oxide-semiconductor (CMOS) memories are staggering. CMOS memories are traded as mass-products worldwide and are diversified to satisfy nearly all practical requirements in operational speed, power, size, and environmental tolerance. Without the outstanding speed, power, and packing density characteristics of CMOS memories, neither personal computing, nor space exploration, nor superior defense systems, nor many other feats of human ingenuity could be accomplished. Electronic systems need continuous improvements in speed performance, power consumption, packing density, size, weight, and costs. These needs continue to spur the rapid advancement of CMOS memory processing and circuit technologies. CMOS Memory Circuits is essential for those who intend to (1) understand, (2) apply, (3) design and (4) develop CMOS memories.
Solar Energy Update
Author:
Publisher:
ISBN:
Category : Solar energy
Languages : en
Pages : 490
Book Description
Publisher:
ISBN:
Category : Solar energy
Languages : en
Pages : 490
Book Description
ULSI Process Integration 6
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Publisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Monthly Catalog of United States Government Publications
Author:
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1096
Book Description
Publisher:
ISBN:
Category : Government publications
Languages : en
Pages : 1096
Book Description
Handbook of Deposition Technologies for Films and Coatings
Author: Peter M. Martin
Publisher: William Andrew
ISBN: 0815520328
Category : Technology & Engineering
Languages : en
Pages : 932
Book Description
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
Publisher: William Andrew
ISBN: 0815520328
Category : Technology & Engineering
Languages : en
Pages : 932
Book Description
This 3e, edited by Peter M. Martin, PNNL 2005 Inventor of the Year, is an extensive update of the many improvements in deposition technologies, mechanisms, and applications. This long-awaited revision includes updated and new chapters on atomic layer deposition, cathodic arc deposition, sculpted thin films, polymer thin films and emerging technologies. Extensive material was added throughout the book, especially in the areas concerned with plasma-assisted vapor deposition processes and metallurgical coating applications.
Metallized Plastics 5&6: Fundamental and Applied Aspects
Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 1466562102
Category : Science
Languages : en
Pages : 438
Book Description
This book chronicles the proceedings of the 5th and 6th symposia on Metallized Plastics: Fundamental and Applied Aspects, held in May 1996 and September 1997 respectively. This volume contains 29, carefully reviewed, revised and up-dated papers which were presented at both symposia. The book is divided in the following three parts: Metallization Te
Publisher: CRC Press
ISBN: 1466562102
Category : Science
Languages : en
Pages : 438
Book Description
This book chronicles the proceedings of the 5th and 6th symposia on Metallized Plastics: Fundamental and Applied Aspects, held in May 1996 and September 1997 respectively. This volume contains 29, carefully reviewed, revised and up-dated papers which were presented at both symposia. The book is divided in the following three parts: Metallization Te
Thin Film Processes II
Author: Werner Kern
Publisher: Elsevier
ISBN: 0080524214
Category : Technology & Engineering
Languages : en
Pages : 881
Book Description
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. Provides an all-new sequel to the 1978 classic, Thin Film Processes Introduces new topics, and several key topics presented in the original volume are updated Emphasizes practical applications of major thin film deposition and etching processes Helps readers find the appropriate technology for a particular application
Publisher: Elsevier
ISBN: 0080524214
Category : Technology & Engineering
Languages : en
Pages : 881
Book Description
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. Provides an all-new sequel to the 1978 classic, Thin Film Processes Introduces new topics, and several key topics presented in the original volume are updated Emphasizes practical applications of major thin film deposition and etching processes Helps readers find the appropriate technology for a particular application
Rapid Thermal and Other Short-time Processing Technologies II
Author: Dim-Lee Kwong
Publisher: The Electrochemical Society
ISBN: 9781566773157
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Publisher: The Electrochemical Society
ISBN: 9781566773157
Category : Technology & Engineering
Languages : en
Pages : 458
Book Description
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
ERDA Energy Research Abstracts
Author: United States. Energy Research and Development Administration
Publisher:
ISBN:
Category : Medicine
Languages : en
Pages : 1314
Book Description
Publisher:
ISBN:
Category : Medicine
Languages : en
Pages : 1314
Book Description