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Author: Jalil Boukhobza
Publisher: Elsevier
ISBN: 008101158X
Category : Technology & Engineering
Languages : en
Pages : 268
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Book Description
4 zettabytes (4 billion terabytes) of data generated in 2013, 44 zettabytes predicted for 2020 and 185 zettabytes for 2025. These figures are staggering and perfectly illustrate this new era of data deluge. Data has become a major economic and social challenge. The speed of processing of these data is the weakest link in a computer system: the storage system. It is therefore crucial to optimize this operation. During the last decade, storage systems have experienced a major revolution: the advent of flash memory. Flash Memory Integration: Performance and Energy Issues contributes to a better understanding of these revolutions. The authors offer us an insight into the integration of flash memory in computer systems, their behavior in performance and in power consumption compared to traditional storage systems. The book also presents, in their entirety, various methods for measuring the performance and energy consumption of storage systems for embedded as well as desktop/server computer systems. We are invited on a journey to the memories of the future. - Ideal for computer scientists, featuring low level details to concentrate on system issues - Tackles flash memory aspects while spanning domains such as embedded systems and HPC - Contains an exhaustive set of experimental results conducted in the Lab-STICC laboratory - Provides details on methodologies to perform performance and energy measurements on flash storage systems
Author: Jalil Boukhobza
Publisher: Elsevier
ISBN: 008101158X
Category : Technology & Engineering
Languages : en
Pages : 268
Get Book Here
Book Description
4 zettabytes (4 billion terabytes) of data generated in 2013, 44 zettabytes predicted for 2020 and 185 zettabytes for 2025. These figures are staggering and perfectly illustrate this new era of data deluge. Data has become a major economic and social challenge. The speed of processing of these data is the weakest link in a computer system: the storage system. It is therefore crucial to optimize this operation. During the last decade, storage systems have experienced a major revolution: the advent of flash memory. Flash Memory Integration: Performance and Energy Issues contributes to a better understanding of these revolutions. The authors offer us an insight into the integration of flash memory in computer systems, their behavior in performance and in power consumption compared to traditional storage systems. The book also presents, in their entirety, various methods for measuring the performance and energy consumption of storage systems for embedded as well as desktop/server computer systems. We are invited on a journey to the memories of the future. - Ideal for computer scientists, featuring low level details to concentrate on system issues - Tackles flash memory aspects while spanning domains such as embedded systems and HPC - Contains an exhaustive set of experimental results conducted in the Lab-STICC laboratory - Provides details on methodologies to perform performance and energy measurements on flash storage systems
Author: Cor L. Claeys
Publisher: The Electrochemical Society
ISBN: 9781566772419
Category : Computers
Languages : en
Pages : 408
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Book Description
Author: Yangyuan Wang
Publisher: Springer Nature
ISBN: 9819928362
Category : Technology & Engineering
Languages : en
Pages : 2006
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Book Description
Written by hundreds experts who have made contributions to both enterprise and academics research, these excellent reference books provide all necessary knowledge of the whole industrial chain of integrated circuits, and cover topics related to the technology evolution trends, fabrication, applications, new materials, equipment, economy, investment, and industrial developments of integrated circuits. Especially, the coverage is broad in scope and deep enough for all kind of readers being interested in integrated circuit industry. Remarkable data collection, update marketing evaluation, enough working knowledge of integrated circuit fabrication, clear and accessible category of integrated circuit products, and good equipment insight explanation, etc. can make general readers build up a clear overview about the whole integrated circuit industry. This encyclopedia is designed as a reference book for scientists and engineers actively involved in integrated circuit research and development field. In addition, this book provides enough guide lines and knowledges to benefit enterprisers being interested in integrated circuit industry.
Author: Rino Micheloni
Publisher: Springer
ISBN: 9401775125
Category : Computers
Languages : en
Pages : 391
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Book Description
This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.
Author: Kyriazis, Dimosthenis
Publisher: IGI Global
ISBN: 1466639350
Category : Computers
Languages : en
Pages : 342
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Book Description
With the evolution of digitized data, our society has become dependent on services to extract valuable information and enhance decision making by individuals, businesses, and government in all aspects of life. Therefore, emerging cloud-based infrastructures for storage have been widely thought of as the next generation solution for the reliance on data increases. Data Intensive Storage Services for Cloud Environments provides an overview of the current and potential approaches towards data storage services and its relationship to cloud environments. This reference source brings together research on storage technologies in cloud environments and various disciplines useful for both professionals and researchers.
Author: Thomas M. Coughlin
Publisher: Newnes
ISBN: 0080558496
Category : Technology & Engineering
Languages : en
Pages : 311
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Book Description
Can you imagine life without your cell phone, laptop, digital camera, iPod, BlackBerry, flat-screen TV, or DVD player? The skyrocketing demand for devices that provide simple, immediate access to large amounts of content is driving required digital storage capacity to unprecedented levels. Designing digital storage into consumer electronics is crucial to the performance and cost of these devices. However, as our requirements for digital content storage grow, so does the formidable difficulty of implementing design solutions that are rugged, long-lasting, power-miserly, secure, network-accessible and can still fit in the palm of your hand!This book provides the background necessary to understand common digital storage devices and media. It helps readers decide which methods of storage work best for which kinds of devices, and then teaches designers how to successfully integrate them into consumer products. - Presents best practices for selecting, integrating, and using storage devices to achieve higher performance, greater reliability and lower cost - Teardown photos provide rare visuals of the "guts" of the devices discussed - Covers hot topics including flash memory, DVRs, Apple iPods, home networks, and automotive electronics, from basic layouts to standards, advanced features, and exciting growth opportunities
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1607682613
Category :
Languages : en
Pages : 429
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Book Description
Author: C. Claeys
Publisher: The Electrochemical Society
ISBN: 1566777445
Category : Integrated circuits
Languages : en
Pages : 547
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Book Description
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Author: Qing Luo
Publisher: CRC Press
ISBN: 1000888401
Category : Technology & Engineering
Languages : en
Pages : 107
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Book Description
This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications. Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts: 1: Associative Problems in Crossbar array and 3D architectures; 2: Selector Devices and Self-Selective Cells; 3: Integration of 3D RRAM; 4: Reliability Issues in 3D RRAM; 5: Applications of 3D RRAM beyond Storage. The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.
Author: Hideto Hidaka
Publisher: Springer
ISBN: 3319553062
Category : Technology & Engineering
Languages : en
Pages : 253
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Book Description
This book provides a comprehensive introduction to embedded flash memory, describing the history, current status, and future projections for technology, circuits, and systems applications. The authors describe current main-stream embedded flash technologies from floating-gate 1Tr, floating-gate with split-gate (1.5Tr), and 1Tr/1.5Tr SONOS flash technologies and their successful creation of various applications. Comparisons of these embedded flash technologies and future projections are also provided. The authors demonstrate a variety of embedded applications for auto-motive, smart-IC cards, and low-power, representing the leading-edge technology developments for eFlash. The discussion also includes insights into future prospects of application-driven non-volatile memory technology in the era of smart advanced automotive system, such as ADAS (Advanced Driver Assistance System) and IoE (Internet of Everything). Trials on technology convergence and future prospects of embedded non-volatile memory in the new memory hierarchy are also described. Introduces the history of embedded flash memory technology for micro-controller products and how embedded flash innovations developed; Includes comprehensive and detailed descriptions of current main-stream embedded flash memory technologies, sub-system designs and applications; Explains why embedded flash memory requirements are different from those of stand-alone flash memory and how to achieve specific goals with technology development and circuit designs; Describes a mature and stable floating-gate 1Tr cell technology imported from stand-alone flash memory products - that then introduces embedded-specific split-gate memory cell technologies based on floating-gate storage structure and charge-trapping SONOS technology and their eFlash sub-system designs; Describes automotive and smart-IC card applications requirements and achievements in advanced eFlash beyond 4 0nm node.
