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Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562
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Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author: Ho-Ming Tong
Publisher: Springer Science & Business Media
ISBN: 1441957685
Category : Technology & Engineering
Languages : en
Pages : 562
Get Book Here
Book Description
Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Author: John Plant
Publisher: Clarkson Potter
ISBN: 198482368X
Category : Sports & Recreation
Languages : en
Pages : 194
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Book Description
From the craftsman behind the popular YouTube channel Primitive Technology comes a practical guide to building huts and tools using only natural materials from the wild. John Plant, the man behind the channel, Primitive Technology, is a bonafide YouTube star. With almost 10 million subscribers and an average of 5 million views per video, John's channel is beloved by a wide-ranging fan base, from campers and preppers to hipster woodworkers and craftsmen. Now for the first time, fans will get a detailed, behind-the-scenes look into John's process. Featuring 50 projects with step-by-step instructions on how to make tools, weapons, shelters, pottery, clothing, and more, Primitive Technology is the ultimate guide to the craft. Each project is accompanied by illustrations as well as mini-sidebars with the history behind each item, plus helpful tips for building, material sourcing, and so forth. Whether you're a wilderness aficionado or just eager to spend more time outdoors, Primitive Technology has something for everyone's inner nature lover.
Author: Daniel Lu
Publisher: Springer
ISBN: 3319450980
Category : Technology & Engineering
Languages : en
Pages : 974
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Book Description
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author: Michael Nicolaidis
Publisher: Springer Science & Business Media
ISBN: 1441969934
Category : Technology & Engineering
Languages : en
Pages : 331
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Book Description
This book provides a comprehensive presentation of the most advanced research results and technological developments enabling understanding, qualifying and mitigating the soft errors effect in advanced electronics, including the fundamental physical mechanisms of radiation induced soft errors, the various steps that lead to a system failure, the modelling and simulation of soft error at various levels (including physical, electrical, netlist, event driven, RTL, and system level modelling and simulation), hardware fault injection, accelerated radiation testing and natural environment testing, soft error oriented test structures, process-level, device-level, cell-level, circuit-level, architectural-level, software level and system level soft error mitigation techniques. The book contains a comprehensive presentation of most recent advances on understanding, qualifying and mitigating the soft error effect in advanced electronic systems, presented by academia and industry experts in reliability, fault tolerance, EDA, processor, SoC and system design, and in particular, experts from industries that have faced the soft error impact in terms of product reliability and related business issues and were in the forefront of the countermeasures taken by these companies at multiple levels in order to mitigate the soft error effects at a cost acceptable for commercial products. In a fast moving field, where the impact on ground level electronics is very recent and its severity is steadily increasing at each new process node, impacting one after another various industry sectors (as an example, the Automotive Electronics Council comes to publish qualification requirements on soft errors), research and technology developments and industrial practices have evolve very fast, outdating the most recent books edited at 2004.
Author: Cheng-Chung Lee
Publisher: Springer
ISBN: 9401793921
Category : Science
Languages : en
Pages : 543
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Book Description
Optics and photonics offer new and vibrant approaches to meeting the challenges of the 21st century concerning energy conservation, education, agriculture, personal health and the environment. One of the most effective ways to address these global problems is to provide updated and reliable content on light-based technologies. Optical thin films and meta-materials, lasers, optical communications, light-emitting diodes, solar cells, liquid crystal technology, nanophotonics and biophotonics all play vital roles in enriching our lives. We hope to raise readers’ awareness of how optical technologies are now promoting sustainable development and providing reliable solutions to basic human needs. Furthermore, in order to broaden new research fields, we hope to inspire them to pursue further cutting-edge breakthroughs on the basis of the accomplishments that have already been made.
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 590
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Book Description
Author: John H. Lau
Publisher: Springer Nature
ISBN: 9819721407
Category :
Languages : en
Pages : 515
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Book Description
Author: Thucydides Xanthopoulos
Publisher: Springer Science & Business Media
ISBN: 1441902619
Category : Technology & Engineering
Languages : en
Pages : 339
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Book Description
. . . ????????????????????????????????? ????????????? ????????????,????? ???? ??????????? ???????????????????? ???. THUCYDIDIS HISTORIAE IV:108 C. Hude ed. , Teubner, Lipsiae MCMXIII ???????????,????? ??,? ????????????????? ???????????????????? ?????? ?????? ?????? ??? ????????? ??? ?’ ?????????? ??’ ?????????? ? ??????? ??? ????????????? ???????. ???????????????????:108 ???????????? ?????????????????????? ?. ?????????????. ????????????,????? It being the fashion of men, what they wish to be true to admit even upon an ungrounded hope, and what they wish not, with a magistral kind of arguing to reject. Thucydides (the Peloponnesian War Part I), IV:108 Thomas Hobbes Trans. , Sir W. Molesworth ed. In The English Works of Thomas Hobbes of Malmesbury, Vol. VIII I have been introduced to clock design very early in my professional career when I was tapped right out of school to design and implement the clock generation and distribution of the Alpha 21364 microprocessor. Traditionally, Alpha processors - hibited highly innovative clocking systems, always worthy of ISSCC/JSSC publi- tions and for a while Alpha processors were leading the industry in terms of clock performance. I had huge shoes to ?ll. Obviously, I was overwhelmed, confused and highly con?dent that I would drag the entire project down.
Author: R.R. Tummala
Publisher: Springer Science & Business Media
ISBN: 1461560373
Category : Computers
Languages : en
Pages : 1060
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Book Description
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author: Ning-Cheng Lee
Publisher: Newnes
ISBN: 0750672188
Category : Technology & Engineering
Languages : en
Pages : 282
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Book Description
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
