Author: Mehul B. Naik
Publisher:
ISBN:
Category :
Languages : en
Pages : 280
Book Description
Experiments and Models for the Chemical Vapor Deposition of Copper from Copper(I) and Copper(II) Compounds
Author: Mehul B. Naik
Publisher:
ISBN:
Category :
Languages : en
Pages : 280
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 280
Book Description
Experiments and Models of the Plasma Assisted Chemical Vapor Deposition of Copper from Copper Hexafluoroacetylacetonate and Hydrogen
Author: Satish Kumar Lakshmanan
Publisher:
ISBN:
Category :
Languages : en
Pages : 193
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 193
Book Description
Chemical Vapor Deposition of Copper from Copper (II) Hexafluoroacetylacetonate
Author: D. Temple
Publisher:
ISBN:
Category : Organocopper compounds
Languages : en
Pages : 12
Book Description
Publisher:
ISBN:
Category : Organocopper compounds
Languages : en
Pages : 12
Book Description
Dissertation Abstracts International
Author:
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 794
Book Description
Publisher:
ISBN:
Category : Dissertations, Academic
Languages : en
Pages : 794
Book Description
Scientific and Technical Aerospace Reports
Author:
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 464
Book Description
Publisher:
ISBN:
Category : Aeronautics
Languages : en
Pages : 464
Book Description
Proceedings of the Symposium on Fundamental Gas-Phase and Surface Chemistry of Vapor-Phase Materials Synthesis
Author: Mark Donald Allendorf
Publisher: The Electrochemical Society
ISBN: 9781566772174
Category : Science
Languages : en
Pages : 506
Book Description
Publisher: The Electrochemical Society
ISBN: 9781566772174
Category : Science
Languages : en
Pages : 506
Book Description
Combined Experimental and Modelling Studies of Laser Assisted Chemical Vapor Deposition of Copper and Aluminum
Author: Jaesung Han
Publisher:
ISBN:
Category :
Languages : en
Pages : 406
Book Description
Publisher:
ISBN:
Category :
Languages : en
Pages : 406
Book Description
Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices
Author: Thomas Wächtler
Publisher: Thomas Waechtler
ISBN: 3941003178
Category :
Languages : en
Pages : 247
Book Description
Publisher: Thomas Waechtler
ISBN: 3941003178
Category :
Languages : en
Pages : 247
Book Description
Chemistry for Electronic Materials
Author: K.F. Jensen
Publisher: Elsevier
ISBN: 0444596909
Category : Science
Languages : en
Pages : 215
Book Description
The chemical aspects of materials processing used for electronic applications, e.g. Si, III-V compounds, superconductors, metallization materials, are covered in this volume. Significant recent advances have occurred in the development of new volatile precursors for the fabrication of III-V semiconductor and metal [Cu, W] films by OMCVD. Some fundamentally new and wide-ranging applications have been introduced in recent times. Experimental and modeling studies regarding deposition kinetics, operating conditions and transport as well as properties of films produced by PVD, CVD and PECVD are discussed. The thirty papers in this volume report on many other significant topics also. Research workers involved in these aspects of materials technology may find here some new perspectives with which to augment their projects.
Publisher: Elsevier
ISBN: 0444596909
Category : Science
Languages : en
Pages : 215
Book Description
The chemical aspects of materials processing used for electronic applications, e.g. Si, III-V compounds, superconductors, metallization materials, are covered in this volume. Significant recent advances have occurred in the development of new volatile precursors for the fabrication of III-V semiconductor and metal [Cu, W] films by OMCVD. Some fundamentally new and wide-ranging applications have been introduced in recent times. Experimental and modeling studies regarding deposition kinetics, operating conditions and transport as well as properties of films produced by PVD, CVD and PECVD are discussed. The thirty papers in this volume report on many other significant topics also. Research workers involved in these aspects of materials technology may find here some new perspectives with which to augment their projects.
Chemical Vapor Deposition of Copper and Copper Oxides
Author: Jorge Ramírez-Ortiz
Publisher: LAP Lambert Academic Publishing
ISBN: 9783659199820
Category :
Languages : en
Pages : 96
Book Description
Chemical vapor deposition (CVD) is a very versatile process widely used in the production of thin solid films and surface coating. It is also used to produce powders, fibers and monolithic components. In addition, the majority of chemical elements in the periodic table has been deposited, as well as compounds such as carbides, nitrides, oxides, intermetallic and many others. Chemical vapor deposition has been a critical technology in silicon microelectronics processes, fabrication of thin films of metals, semiconductors, and insulators. With increasing packing density in microelectronic devices, copper is used as an interconnecting metal due to its superior electrical conductivity and excellent resistance against electromigration. One of the advantages of chemcial vapor deposition is that selective deposition onto one surface, often defined as the growth surface, in the presence of another surface, often defined as non-growth surface is possible. The high optical absorption coefficient and low cost of production of Cu2O thin films have they made good candidates for electrochromic devices, solar cells and oxygen sensors.
Publisher: LAP Lambert Academic Publishing
ISBN: 9783659199820
Category :
Languages : en
Pages : 96
Book Description
Chemical vapor deposition (CVD) is a very versatile process widely used in the production of thin solid films and surface coating. It is also used to produce powders, fibers and monolithic components. In addition, the majority of chemical elements in the periodic table has been deposited, as well as compounds such as carbides, nitrides, oxides, intermetallic and many others. Chemical vapor deposition has been a critical technology in silicon microelectronics processes, fabrication of thin films of metals, semiconductors, and insulators. With increasing packing density in microelectronic devices, copper is used as an interconnecting metal due to its superior electrical conductivity and excellent resistance against electromigration. One of the advantages of chemcial vapor deposition is that selective deposition onto one surface, often defined as the growth surface, in the presence of another surface, often defined as non-growth surface is possible. The high optical absorption coefficient and low cost of production of Cu2O thin films have they made good candidates for electrochromic devices, solar cells and oxygen sensors.