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Author: Haleh Ardebili
Publisher: William Andrew
ISBN: 0128119799
Category : Technology & Engineering
Languages : en
Pages : 510
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Book Description
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Author: Haleh Ardebili
Publisher: William Andrew
ISBN: 0128119799
Category : Technology & Engineering
Languages : en
Pages : 510
Get Book Here
Book Description
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
Author: Zulkifli Ahmad
Publisher: Elsevier
ISBN: 0323983901
Category : Technology & Engineering
Languages : en
Pages : 450
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Book Description
Polymers in Electronics: Optoelectronic Properties, Design, Fabrication, and Applications brings together the fundamentals and latest advances in polymeric materials for electronic device applications, supporting researchers, scientists and advanced students, and approaching the topic from a range of disciplines. The book begins by introducing polymeric materials, their dielectric, optical, and thermal properties, and the essential principles and techniques for polymers as applied to electronics. This is followed by detailed coverage of the key steps in the preparation of polymeric materials for opto-electronic devices, including fabrication methods, materials design, rheology, encapsulation, and conductive polymer mechanisms. The final part of the book focuses on the latest developments in advanced devices, covering the areas of photovoltaics, transistors, light-emitting diodes, and stretchable electronics. In addition, it explains mechanisms, design, fabrication techniques, and end applications. This is a highly valuable resource for researchers, advanced students, engineers and R&D professionals from a range of disciplines. Offers introductory coverage of polymeric materials for electronics, including principles, design, properties, fabrication and applications Focuses on key issues such as materials selection, structure-property relationships and challenges in application Explores advanced applications of polymers in photovoltaics, transistors, sensors, light-emitting diodes and stretchable electronics
Author: Zheng Cui
Publisher: John Wiley & Sons
ISBN: 1118920929
Category : Technology & Engineering
Languages : en
Pages : 372
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Book Description
This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading
Author: Frank Suli
Publisher: Woodhead Publishing
ISBN: 008102391X
Category : Technology & Engineering
Languages : en
Pages : 490
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Book Description
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Author: Sulaiman Khalifeh
Publisher: Elsevier
ISBN: 192788568X
Category : Technology & Engineering
Languages : en
Pages : 617
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Book Description
Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system.Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. - Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers - Covers the most common electrical, electronic, and optical properties of electronic polymers - Describes the underlying theories on the mechanics of polymer conductivity - Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures - Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components
Author: Nishar Hameed
Publisher: Elsevier
ISBN: 0323985351
Category : Technology & Engineering
Languages : en
Pages : 301
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Book Description
Rapid Cure Composites: Materials, Processing and Manufacturing presents up-to-date information on the design criteria to formulate matrix systems for rapid curing. Emphasis is placed on the role different materials [resin compound and fiber reinforcement] play in developing fast curing composites, assessment of current and novel manufacturing techniques for adapting fast curing processes, the comparison between conventional curing and rapid curing, and different applications in various industrial sectors [e.g., aerospace, automotive, renewables and marine]. The book will be an essential reference resource for academic and industrial researchers working in the field of composite materials, processing and manufacturing organizations, materials scientists, and more. Polymer composites are widely used in several industries, including aerospace, automobile, spray and coatings, and electronics due to their lightweight and superior mechanical properties. However, one of the dominant hurdles towards their growth in commercial industries is the long curing cycle and slow production. - Comprehensively addresses the scientific and technological development of rapid cured epoxy composites - Covers, in detail, the chemistry, processing, structure and performance of rapid cured epoxy composites - Provides detailed comparisons of how/why rapid cure composites are different to conventional composites - Discusses the challenges of the existing technology and future trends
Author: George Wypych
Publisher: Elsevier
ISBN: 1927885809
Category : Technology & Engineering
Languages : en
Pages : 473
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Book Description
Polymers used in electronics and electrical engineering are essential to the development of high-tech products, with applications in space, aviation, health, automotive, communication, robotics, consumer products, and beyond. Typical features of mainstream polymers such as mechanical performance, optical behavior, and environmental stability frequently need to be enhanced to perform in these demanding applications, creating the need to develop special grades or use completely new chemistry for their synthesis. Similarly, the typical set of properties included in the description of mainstream polymers are not sufficient for polymer selection for these applications, as they require different data, data that is meticulously detailed in the Handbook of Polymers for Electronics. The book provides readers with the most up-to-date information from the existing literature, manufacturing data, and patent filings. Presenting data for all polymers based on a consistent pattern of arrangement, the book provides details organized into the following sections: General; history; synthesis; structure; commercial polymers; physical properties; electrical properties; mechanical properties; chemical resistance; flammability; weather stability; thermal stability; biodegradation; toxicity; environmental impact; processing; blends; analysis. The contents, scope, treatment and novelty of the data makes this book an essential resource for anyone working with polymeric materials used in modern electronic applications. - Synthesizes the most recent literature available on various grades of polymers, plastics, finished products, and patents - Provides data on general information, synthesis, structure, physical properties, electrical properties, mechanical properties, chemical resistance, flammability, weather stability, thermal stability, biodegradation, toxicity, environmental impact, and more - Details information on crystalline structure, cell dimensions, methods of synthesis, optoelectrical properties, relative permittivity, dissipation factor, actuation bandwidth, tear strength, abrasion resistance, and more
Author: Cher Ming Tan
Publisher: Woodhead Publishing
ISBN: 012822407X
Category : Technology & Engineering
Languages : en
Pages : 190
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Book Description
Reliability and Failure Analysis of High-Power LED Packaging provides fundamental understanding of the reliability and failure analysis of materials for high-power LED packaging, with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide insights for readers regarding the possible failure mechanisms in high-power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to harsher stress conditions for high-power LEDs. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. - Introduces the failure mechanisms of high-power LEDs under varying environmental conditions and methods of how to test, simulate, and predict them - Describes the chemistry underlying the material degradation and its impact on LEDs - Discusses future directions of new packaging materials for improved performance and reliability of high-power LEDs
Author: Navid Asadizanjani
Publisher: Elsevier
ISBN: 0443185433
Category : Technology & Engineering
Languages : en
Pages : 224
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Book Description
Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities. - Discusses materials as enablers to provide electronics assurance, counterfeit detection/protection, and fingerprinting - Provides an overview of benefits and challenges of materials-based security solutions to inspire future materials research directions - Includes an introduction to material perspectives on hardware security to enable cross collaboration between materials, design, and testing
Author: K. L. Mittal
Publisher: John Wiley & Sons
ISBN: 1118831349
Category : Technology & Engineering
Languages : en
Pages : 293
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Book Description
This comprehensive book will provide both fundamental and applied aspects of adhesion pertaining to microelectronics in a single and easily accessible source. Among the topics to be covered include; Various theories or mechanisms of adhesion Surface (physical or chemical) characterization of materials as it pertains to adhesion Surface cleaning as it pertains to adhesion Ways to improve adhesion Unraveling of interfacial interactions using an array of pertinent techniques Characterization of interfaces / interphases Polymer-polymer adhesion Metal-polymer adhesion (metallized polymers) Polymer adhesion to various substrates Adhesion of thin films Adhesion of underfills Adhesion of molding compounds Adhesion of different dielectric materials Delamination and reliability issues in packaged devices Interface mechanics and crack propagation Adhesion measurement of thin films and coatings
