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Author: Yi-Kan Cheng
Publisher: Springer Science & Business Media
ISBN: 0306470241
Category : Technology & Engineering
Languages : en
Pages : 220
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Book Description
This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Author: Yi-Kan Cheng
Publisher: Springer Science & Business Media
ISBN: 0306470241
Category : Technology & Engineering
Languages : en
Pages : 220
Get Book Here
Book Description
This useful book addresses electrothermal problems in modern VLSI systems. It discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires. The authors present three important applications of VLSI electrothermal analysis: temperature-dependent electromigration diagnosis, cell-level thermal placement, and temperature-driven power and timing analysis.
Author:
Publisher:
ISBN:
Category :
Languages : en
Pages : 210
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Book Description
Author: Márta Rencz
Publisher: MDPI
ISBN: 303943831X
Category : Technology & Engineering
Languages : en
Pages : 310
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Book Description
This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.
Author: J. Altet
Publisher: Springer Science & Business Media
ISBN: 1475736355
Category : Technology & Engineering
Languages : en
Pages : 212
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Book Description
Temperature has been always considered as an appreciable magnitude to detect failures in electric systems. In this book, the authors present the feasibility of considering temperature as an observable for testing purposes, with full coverage of the state of the art.
Author: Blaise Ravelo
Publisher: Springer Nature
ISBN: 9811505527
Category : Technology & Engineering
Languages : en
Pages : 239
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Book Description
This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering.
Author: Shahrzad Salemi
Publisher: RIAC
ISBN: 1933904291
Category : Electronic apparatus and appliances
Languages : en
Pages : 271
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Book Description
Author: Peter Haines
Publisher: Royal Society of Chemistry
ISBN: 1847551769
Category : Science
Languages : en
Pages : 236
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Book Description
The use of thermal and calorimetric methods has shown rapid growth over the last two decades, in an increasingly wide range of applications. In addition, a number of powerful new techniques have been developed. This book supplies a concise and readable account of the principles, experimental apparatus and practical procedures used in thermal analysis and calorimetric methods of analysis. Brief accounts of the basic theory are reinforced with detailed applications of the methods and contemporary developments. Also included is information on standard test methods and manufacturers. Written by acknowledged experts, Principles of Thermal Analysis and Calorimetry is up-to-date, wide-ranging and practical. It will be an important source of information for many levels of readership in a variety of areas, from students and lecturers through to industrial and laboratory staff and consultants.
Author: Joseph Bernstein
Publisher: Academic Press
ISBN: 0128008199
Category : Technology & Engineering
Languages : en
Pages : 108
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Book Description
This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design. - The ability to include reliability calculations and test results in their product design - The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions - Have accurate failure rate calculations for calculating warrantee period replacement costs
Author:
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 940
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Book Description
Author: Arman Vassighi
Publisher: Springer Science & Business Media
ISBN: 0387297499
Category : Technology & Engineering
Languages : en
Pages : 188
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Book Description
In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
