Electronics Reliability and Measurement Technology PDF Download
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Author: Joseph S. Heyman
Publisher: Elsevier
ISBN: 0815517009
Category : Technology & Engineering
Languages : en
Pages : 145
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Book Description
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Author: Joseph S. Heyman
Publisher: Elsevier
ISBN: 0815517009
Category : Technology & Engineering
Languages : en
Pages : 145
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Book Description
This book examines electronics reliability and measurement technology. It identifies advances in measurement science and technology for nondestructive evaluation, and it details common measurement trouble spots.
Author: Joseph S. Heyman
Publisher:
ISBN:
Category : Electronic apparatus and appliances
Languages : en
Pages : 139
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Book Description
Author: United States. National Aeronautics and Space Administration. Scientific and Technical Information Branch
Publisher:
ISBN:
Category :
Languages : en
Pages :
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Book Description
Author: Joseph S. Heyman
Publisher:
ISBN:
Category : Electronic industries
Languages : en
Pages : 139
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Book Description
Author: J. S. Heyman
Publisher:
ISBN:
Category :
Languages : en
Pages : 146
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Book Description
Author: Joseph S. Heyman
Publisher:
ISBN:
Category :
Languages : en
Pages : 139
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Book Description
Author: Milton Ohring
Publisher: Academic Press
ISBN: 0080575528
Category : Technology & Engineering
Languages : en
Pages : 759
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Book Description
Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites
Author: Harry A. Schafft
Publisher:
ISBN:
Category : Cardiac pacemakers
Languages : en
Pages : 52
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Book Description
Author: Osamu Tabata
Publisher: John Wiley & Sons
ISBN: 3527335013
Category : Technology & Engineering
Languages : en
Pages : 324
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Book Description
This first book to cover exclusively and in detail the principles, tools and methods for determining the reliability of microelectromechanical materials, components and devices covers both component materials as well as entire MEMS devices. Divided into two major parts, following a general introductory chapter to reliability issues, the first part looks at the mechanical properties of the materials used in MEMS, explaining in detail the necessary measuring technologies -- nanoindenters, bulge methods, bending tests, tensile tests, and others. Part Two treats the actual devices, organized by important device categories such as pressure sensors, inertial sensors, RF MEMS, and optical MEMS.
Author: Ronald K Jurgen
Publisher: SAE International
ISBN: 0768034922
Category : Technology & Engineering
Languages : en
Pages : 377
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Book Description
Vehicle reliability problems continue to be the news because of major vehicle recalls from several manufacturers. This book includes 40 SAE technical papers, published from 2007 through 2010, that describe the latest research on automotive electronics reliability technology. This book will help engineers and researchers focus on the design strategies being used to minimize electronics reliability problems, and how to test and verify those strategies. After an overview of durability, risk assessment, and failure mechanisms, this book focuses on state-of-the-art techniques for reliability-based design, and reliability testing and verification. Topics include: powertrain control monitoring distributed automotive embedded systems model-based design x-by-wire systems battery durability design verification fault tree analysis The book also includes editor Ronald K. Jurgen’s introduction ,“Striving for Maximum Reliability in a Highly Complex Electronic Environment”, and a concluding section on the future of electronics reliability, including networking technology, domain control units, the use of AUTOSAR, and embedded software.
