Electronic Packaging Materials Science VII: Volume 323 PDF Download
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Author: Peter Børgesen
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Peter Børgesen
Publisher:
ISBN:
Category : Technology & Engineering
Languages : en
Pages : 480
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Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author: Deborah D.L. Chung
Publisher: Springer Science & Business Media
ISBN: 1447137329
Category : Technology & Engineering
Languages : en
Pages : 297
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Book Description
Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal management, smart structures and other timely technologies rarely covered in existing books on composites. It also treats materials with polymer, metal, cement, carbon and ceramics matrices, contrasting with others that emphasise polymer-matrix composites. This functional approach will be useful to both practitioners and students. A good selection of example problems, solutions and figures, together with a new and vibrant approach, provides a valuable reference source for all engineers working with composite materials.
Author: Shyam P Muraka
Publisher: Elsevier
ISBN: 0080521959
Category : Science
Languages : en
Pages : 459
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Book Description
Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.
Author: Madhav Datta
Publisher: The Electrochemical Society
ISBN: 9781566771146
Category : Technology & Engineering
Languages : en
Pages : 362
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Book Description
Author:
Publisher:
ISBN:
Category : Mechanics, Applied
Languages : en
Pages : 1090
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Book Description
Author: Kenneth E. Wilkes
Publisher: CRC Press
ISBN: 1000445747
Category : Technology & Engineering
Languages : en
Pages : 652
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Book Description
This book contains keynote lectures and 54 technical papers, presented at the 23rd International Thermal Conductivity Conference, on various topics, including techniques, coatings and films, theory, composites, fluids, metals, ceramics, and organics, related to thermal conductivity.
Author:
Publisher:
ISBN:
Category : Electronic packaging
Languages : en
Pages : 304
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Book Description
Author: Woodhead Publishing, Limited
Publisher: Woodhead Publishing
ISBN: 9781855733565
Category : Technology & Engineering
Languages : en
Pages : 862
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Book Description
Author: Stuart R. Stock
Publisher: CRC Press
ISBN: 1351835076
Category : Technology & Engineering
Languages : en
Pages : 273
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Book Description
Due to the availability of commercial laboratory systems and the emergence of user facilities at synchrotron radiation sources, studies of microcomputed tomography or microCT have increased exponentially. MicroComputed Technology provides a complete introduction to the technology, describing how to use it effectively and understand its results. The first part of the book focuses on methodology, covering experimental methods, data analysis, and visualization approaches. The second part addresses various microCT applications, including porous solids, microstructural evolution, soft tissue studies, multimode studies, and indirect analyses. The author presents a sufficient amount of fundamental material so that those new to the field can develop a relative understanding of how to design their own microCT studies. One of the first full-length references dedicated to microCT, this book provides an accessible introduction to field, supplemented with application examples and color images.
Author:
Publisher:
ISBN:
Category : Heat
Languages : en
Pages : 304
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Book Description
